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公开(公告)号：DE69636745T2
公开(公告)日：2007-10-18
申请号：DE69636745
申请日：1996-08-02
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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公开(公告)号：AT346896T
公开(公告)日：2006-12-15
申请号：AT03000556
申请日：1996-08-02
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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公开(公告)号：DE69636745D1
公开(公告)日：2007-01-11
申请号：DE69636745
申请日：1996-08-02
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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公开(公告)号：ES2196168T3
公开(公告)日：2003-12-16
申请号：ES96928033
申请日：1996-08-02
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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公开(公告)号：DE69627507T2
公开(公告)日：2003-11-06
申请号：DE69627507
申请日：1996-08-02
Applicant: DYNETICS LLC WOBURN
Inventor： PERRY B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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Patent Agency Ranking
公开(公告)号：DK0844920T3
公开(公告)日：2003-08-04
申请号：DK96928033
申请日：1996-08-02
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B
Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.
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公开(公告)号：DE69941494D1
公开(公告)日：2009-11-12
申请号：DE69941494
申请日：1999-05-11
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B , O'SHEA LIAM , WRIGHT MARK
Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.
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公开(公告)号：AT444139T
公开(公告)日：2009-10-15
申请号：AT99921847
申请日：1999-05-11
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD , O'SHEA LIAM , WRIGHT MARK
Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.
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9.发明授权SYSTEM AND METHOD FOR CONTROLLING THE SIZE AND SURFACE GEOMETRY OF AN ORIFICE 有权方法和设备，用于调节尺寸，表面形状的开口
公开(公告)号：EP1159108B1
公开(公告)日：2009-09-30
申请号：EP99921847.2
申请日：1999-05-11
Applicant: Dynetics LLC
Inventor： PERRY, Winfield, B. , O'SHEA, Liam , WRIGHT, Mark
IPC: B24B31/116 , B24C3/20
CPC classification number: B24C3/20 , B23Q39/044 , B24B31/116 , B24C1/083 , B24C3/325 , B24C3/327
Abstract: A system to smooth and radius a microhole in a workpiece to calibrate the microhole. The workpiece is held in an indexable holder (28), which moves the workpiece through a series of calibrating, abrasive jet, and cleaning stations.
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10.发明公开SYSTEM AND METHOD FOR CONTROLLING THE SIZE AND SURFACE GEOMETRY OF AN ORIFICE 有权方法和设备，用于调节尺寸，表面形状的开口
公开(公告)号：EP1159108A4
公开(公告)日：2008-08-06
申请号：EP99921847
申请日：1999-05-11
Applicant: DYNETICS LLC
Inventor： PERRY WINFIELD B , O'SHEA LIAM , WRIGHT MARK
CPC classification number: B24C3/20 , B23Q39/044 , B24B31/116 , B24C1/083 , B24C3/325 , B24C3/327
Abstract: A system to smooth and radius a microhole in a workpiece to calibrate the microhole. The workpiece is held in an indexable holder (28), which moves the workpiece through a series of calibrating, abrasive jet, and cleaning stations.
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