1.
    发明专利
    未知

    公开(公告)号:AT444139T

    公开(公告)日:2009-10-15

    申请号:AT99921847

    申请日:1999-05-11

    Applicant: DYNETICS LLC

    Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.

    2.
    发明专利
    未知

    公开(公告)号:DE69941494D1

    公开(公告)日:2009-11-12

    申请号:DE69941494

    申请日:1999-05-11

    Applicant: DYNETICS LLC

    Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.

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