公开(公告)号：US5972484A

公开(公告)日：1999-10-26

申请号：US980770

申请日：1997-12-01

Applicant: Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

Inventor： Yachin Cohen ,  Dimitri Rein ,  Lev Vaykhansky

IPC: B32B27/02 ,  C08J5/04 ,  H05K1/00 ,  H05K1/03 ,  B32B3/00 ,  B32B5/06

CPC classification number: H05K1/0366 ,  B32B27/02 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/31681 ,  Y10T442/3415 ,  Y10T442/656

Abstract: An ultrahigh molecular weight polyethylene composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including an ultrahigh molecular weight polyethylene composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

Abstract translation: 用于印刷电路板或天线基材的超高分子量聚乙烯复合材料，包括复合材料的基材和包括基材的电子模块。 基材包括至少一个介电层，包括超高分子量聚乙烯复合材料和至少一个包含导电材料的导电层，电介质层和导电层彼此紧密结合。