Abstract:
Techniques for achieving high average spectrum efficiency in a wireless system are disclosed. In one particular embodiment, the techniques may be realized as a method of communicating with a wireless station comprising defining a plurality of beams to be generated by a beam- forming device, defining a set of beam groups wherein each beam group is a different subset of beams of the plurality of beams; repeatedly cycling through the set of beam groups by sequentially generating each group of beams among the set of beam groups; identifying a beam group among the set of beam groups which yields a best communication link with a wireless station; and scheduling communications with the wireless station to occur via the identified beam group when the identified beam group is being generated.
Abstract:
Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.
Abstract:
An electronic circuit including: a differential multiplier circuit with a first differential input and a second differential input and a differential output; and a phase locked loop (PLL) circuit including: (1) a balanced differential mixer circuit with a first differential input electrically connected to the differential output of the differential multiplier circuit, a second differential input, and an output; (2) a loop filter having an output and an input electrically connected to the output of the balanced differential mixer circuit; and (3) a voltage controlled oscillator (VCO) circuit having an input electrically connected to the output of the loop filter and with an output electrically feeding back to the second differential input of the balanced differential mixer circuit.
Abstract:
A transmitter system including: a bidirectional signaling (BDS) network having first and second networks for carrying first and second carrier signals, and having a set of n phase synchronous location pairs (a i , b i ),; and also including tunable transmitter circuits for driving an antenna array, each tunable transmitter circuit having an output line for carrying an output signal and first and second input lines electrically connected to the first and second networks of the BDS network at locations of a corresponding one of the set of phase synchronous location pairs, and including a multiplier having a first input electrically connected to the first input line of that tunable transmitter circuit; a phase setting circuit electrically connected to the multiplier for controlling the phase of the output signal of that tunable transmitter circuit; and an amplitude setting circuit for controlling the amplitude of the output signal of that tunable transmitter circuit.
Abstract:
Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.