Abstract:
A method is provided for depositing a monocrystalline Sn-containing semiconductor material on a substrate, comprising providing a semiconductor material precursor, a Sn precursor and a carrier gas in a chemical vapor deposition (CVD) reactor, and epitaxially growing the Sn- containing semiconductor material on the substrate, wherein the Sn precursor comprises tin tetrachloride (SnC14). SnC14 is used as Sn-precursor for chemical vapor deposition of Sn comprising semiconductor materials.
Abstract:
A method is provided for depositing a monocrystalline Sn-containing semiconductor material on a substrate, comprising providing a semiconductor material precursor, a Sn precursor and a carrier gas in a chemical vapor deposition (CVD) reactor, and epitaxially growing the Sn- containing semiconductor material on the substrate, wherein the Sn precursor comprises tin tetrachloride (SnC14). SnC1 4 is used as Sn-precursor for chemical vapor deposition of Sn comprising semiconductor materials.