Abstract:
A method for assembling a circuit card assembly (100) includes populating a plurality of components (110) on a top side of a component layer (105), performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer (115) to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer (120) and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer.
Abstract:
A method for assembling a circuit card assembly includes populating a plurality of components on a top side of a component layer, performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer.
Abstract:
A method for assembling a circuit card assembly (100) includes populating a plurality of components (110) on a top side of a component layer (105), performing component-level testing on at least one component of the plurality of components populated on the component layer, adhering a bonding layer (115) to a bottom side of the component layer, the bonding layer to facilitate bonding the component layer to an interconnect layer (120) and to provide connectivity between the plurality of components and the interconnect layer, and forming a single-sided circuit card assembly by adhering the interconnect layer to the bonding layer, the interconnect layer having a top side and a bottom side, the bonding layer adhered to the top side of the interconnect layer.