公开(公告)号：WO2012113902A2

公开(公告)日：2012-08-30

申请号：PCT/EP2012053147

申请日：2012-02-24

Applicant: HARTING KGAA ,  GATZEN PROF DR-ING HANS-HEINRICH ,  GRIESBACH DIPL-ING TIM

Inventor： GATZEN PROF DR-ING HANS-HEINRICH ,  GRIESBACH DIPL-ING TIM

IPC: B81B3/00

CPC classification number: H05K1/0271 ,  B81B3/0072 ,  B81B2201/11 ,  B81C2201/0167 ,  H05K3/303 ,  Y10T29/49133

Abstract: The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.

Abstract translation: 根据本发明，节省空间的微和纳米组件和方法，提出了它们的制备。 这些部件的特征在于不具有相当厚度的刚性衬底。 在此，变形和/或扭曲的机械应力补偿体的装置在部件内引起的机械应力和/或将要通过有源机械应力补偿装置通过沉积合适的电压补偿层，使得没有Bedarfnach是相对厚的基材补偿。 因此，组分的总厚度减少及其Integrationsmöglichkeitin改进的技术系统。 此外，这些组件的应用领域也在扩大。