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公开(公告)号：WO2007136928A3
公开(公告)日：2008-05-02
申请号：PCT/US2007065009
申请日：2007-03-27
Applicant: STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , HASKELL BERT
Inventor： WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , HASKELL BERT
CPC classification number: G11C5/04 , H01L23/13 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A system and method for combining at least two semiconductor die (12, 12FC, 14, 14FC) using multi-layer flex circuitry is provided. A first semiconductor die (12, 12FC) is attached and preferably electrically connected to a first layer of the flex circuitry (20) while a second semiconductor die (14, 14FC) is set, at least in part, into a window (FW) that extends into the flex circuitry (20) to expose a layer of the flex to which the second die (14, 14FC) is attached. When the second semiconductor die (14, 14FC) is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry (20), it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry (20).
Abstract translation: 提供了一种使用多层柔性电路组合至少两个半导体管芯（12,12FC，14,14FC）的系统和方法。 第一半导体管芯（12,12FC）被附接并且优选地电连接到柔性电路（20）的第一层，而第二半导体管芯（14,14FC）至少部分地被设置到窗口（FW）中， 其延伸到柔性电路（20）中以暴露第二管芯（14,14FC）附接到的柔性层。 当第二半导体管芯（14,14FC）是倒装芯片器件时，其通过其触点连接到暴露在窗口中的柔性层，并且当其是其接触侧定向远离柔性电路（20 ），其优选地与引线键合电连接到柔性电路（20）的另一导电层。
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公开(公告)号：WO2007136928A2
公开(公告)日：2007-11-29
申请号：PCT/US2007/065009
申请日：2007-03-27
Applicant: STAKTEK GROUP L.P. , WEHRLY, Jr., James, Douglas , SZEWERENKO, Leland , HASKELL, Bert
Inventor： WEHRLY, Jr., James, Douglas , SZEWERENKO, Leland , HASKELL, Bert
CPC classification number: G11C5/04 , H01L23/13 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A system and method for combining at least two semiconductor die (12, 12FC, 14, 14FC) using multi-layer flex circuitry is provided. A first semiconductor die (12, 12FC) is attached and preferably electrically connected to a first layer of the flex circuitry (20) while a second semiconductor die (14, 14FC) is set, at least in part, into a window (FW) that extends into the flex circuitry (20) to expose a layer of the flex to which the second die (14, 14FC) is attached. When the second semiconductor die (14, 14FC) is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry (20), it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry (20).
Abstract translation: 提供了一种使用多层柔性电路组合至少两个半导体管芯（12,12FC，14,14FC）的系统和方法。 第一半导体管芯（12,12FC）被附接并且优选地电连接到柔性电路（20）的第一层，而第二半导体管芯（14,14FC）至少部分地被设置到窗口（FW）中， 其延伸到柔性电路（20）中以暴露第二管芯（14,14FC）附接到的柔性层。 当第二半导体管芯（14,14FC）是倒装芯片器件时，其通过其触点连接到暴露在窗口中的柔性层，并且当其是其接触侧定向远离柔性电路（20 ），其优选地与引线键合电连接到柔性电路（20）的另一导电层。
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