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    METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE
    1.
    发明申请
    METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE 审中-公开
    制造和结果封装机电装置的方法

    公开(公告)号：WO2012087942A3

    公开(公告)日：2012-10-26

    申请号：PCT/US2011065864

    申请日：2011-12-19

    Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  HE RIHUI ,  YAN XIAOMING ,  LAN JE-HSIUNG

    Inventor： HE RIHUI ,  YAN XIAOMING ,  LAN JE-HSIUNG

    IPC: B81C1/00

    CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145

    Abstract: This disclosure provides systems, methods, and apparatus for encapsulated electromechanical systems. In one aspect, a release path includes a release hole through an encapsulation layer. The release path exposes a portion of a first sacrificial layer that extends beyond a second sacrificial layer in a horizontal direction. This allows the first sacrificial layer and the second sacrificial layer to later be etched through the release path. The corresponding electromechanical system device includes a shell layer encapsulating a mechanical layer. A conformal layer seals a release hole that extends through a shell layer. A portion of the conformal layer blocks the opening of the release passage within the release hole. The release passage has substantially the same vertical height as a gap that defines the spacing between the mechanical layer and a substrate.

    Abstract translation: 本公开提供了用于封装机电系统的系统，方法和设备。 在一个方面，释放路径包括穿过封装层的释放孔。 释放路径暴露沿水平方向延伸超出第二牺牲层的第一牺牲层的一部分。 这允许第一牺牲层和第二牺牲层稍后通过释放路径被蚀刻。 相应的机电系统装置包括封装机械层的壳层。 保形层密封延伸穿过壳层的释放孔。 共形层的一部分阻塞释放孔内释放通道的打开。 释放通道具有与限定机械层和衬底之间的间隔的间隙基本相同的垂直高度。

    METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE
    2.
    发明申请
    METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE 审中-公开
    制造方法和结果封装的电化学装置

    公开(公告)号：WO2012087942A2

    公开(公告)日：2012-06-28

    申请号：PCT/US2011/065864

    申请日：2011-12-19

    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  HE, Rihui ,  YAN, Xiaoming ,  LAN, Je-Hsiung

    Inventor： HE, Rihui ,  YAN, Xiaoming ,  LAN, Je-Hsiung

    IPC: B81C1/00

    CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145

    Abstract: This disclosure provides systems, methods, and apparatus for encapsulated electromechanical systems. In one aspect, a release path includes a release hole through an encapsulation layer. The release path exposes a portion of a first sacrificial layer that extends beyond a second sacrificial layer in a horizontal direction. This allows the first sacrificial layer and the second sacrificial layer to later be etched through the release path. The corresponding electromechanical system device includes a shell layer encapsulating a mechanical layer. A conformal layer seals a release hole that extends through a shell layer. A portion of the conformal layer blocks the opening of the release passage within the release hole. The release passage has substantially the same vertical height as a gap that defines the spacing between the mechanical layer and a substrate.

    Abstract translation: 本公开提供了用于封装的机电系统的系统，方法和装置。 一方面，释放路径包括通过封装层的释放孔。 释放路径暴露在水平方向上延伸超过第二牺牲层的第一牺牲层的一部分。 这允许第一牺牲层和第二牺牲层随后通过释放路径被蚀刻。 相应的机电系统装置包括封装机械层的外壳层。 保形层密封延伸穿过壳层的释放孔。 共形层的一部分阻挡释放孔内的释放通道的开口。 释放通道具有与限定机械层和基底之间的间隔的间隙大致相同的垂直高度。

    OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE
    3.
    发明申请
    OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE 审中-公开
    在MEMS封装中优化消耗剂使用

    公开(公告)号：WO2009041951A1

    公开(公告)日：2009-04-02

    申请号：PCT/US2007/020985

    申请日：2007-09-28

    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  LIN, Yen, Hua ,  HE, Rihui ,  WU, Lingling ,  PALMATEER, Lauren ,  HEALD, David

    Inventor： LIN, Yen, Hua ,  HE, Rihui ,  WU, Lingling ,  PALMATEER, Lauren ,  HEALD, David

    IPC: B81C1/00

    CPC classification number: B81C1/00285 ,  B81C1/00674

    Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

    Abstract translation: MEMS器件可以用干燥剂包装以提供无湿度的环境。 为了避免对MEMS器件的不期望的影响，可以选择或处理干燥剂以便与特定的MEMS器件兼容。 这种处理可以包括烘烤干燥剂，以引起除湿或其它不期望的物质。 还可以改变MEMS器件的结构，以改善与特定干燥剂的相容性。

    METHODS OF CREATING SPACERS BY SELF-ASSEMBLY
    4.
    发明申请
    METHODS OF CREATING SPACERS BY SELF-ASSEMBLY 审中-公开
    通过自组织创建间隔的方法

    公开(公告)号：WO2013052317A1

    公开(公告)日：2013-04-11

    申请号：PCT/US2012/057123

    申请日：2012-09-25

    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  HE, Rihui

    Inventor： HE, Rihui

    IPC: B81B7/00

    CPC classification number: B81B7/0058

    Abstract: This disclosure provides systems, methods and apparatus for fabricating spacers for electromechanical systems devices. In one aspect, a method of forming a spacer on a spacer portion of a device surface of an electromechanical systems device includes exposing the device surface to spacer particles suspended in a fluid. The spacer particles are allowed to attach to the spacer portion. Each of the spacer particles can have at least one dimension of about 1 micron to 10 microns. The electromechanical systems device can also include a sacrificial layer that is subsequently removed between the device surface and a substr8ate surface of a substrate on which the electromechanical systems device is formed.

    Abstract translation: 本公开提供了用于制造用于机电系统装置的间隔件的系统，方法和装置。 一方面，在机电系统装置的装置表面的间隔部分上形成间隔物的方法包括将装置表面暴露于悬浮在流体中的间隔物颗粒。 允许间隔物颗粒附着到间隔物部分。 每个间隔物颗粒可以具有约1微米至10微米的至少一个尺寸。 机电系统装置还可以包括牺牲层，其随后在器件表面与其上形成有机电系统器件的衬底的衬底表面之间移除。

    MECHANICAL LAYER FOR INTERFEROMETRIC MODULATORS AND METHODS OF MAKING THE SAME
    5.
    发明申请
    MECHANICAL LAYER FOR INTERFEROMETRIC MODULATORS AND METHODS OF MAKING THE SAME 审中-公开
    用于干涉式调制器的机械层及其制造方法

    公开(公告)号：WO2013036436A1

    公开(公告)日：2013-03-14

    申请号：PCT/US2012/053208

    申请日：2012-08-30

    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  PU, Chuan ,  TAO, Yi ,  TUPELLY, Chandra S. ,  DJORDJEV, Kostadin D. ,  ZHONG, Fan ,  HE, Rihui ,  ZHANG, Wenyue

    Inventor： PU, Chuan ,  TAO, Yi ,  TUPELLY, Chandra S. ,  DJORDJEV, Kostadin D. ,  ZHONG, Fan ,  HE, Rihui ,  ZHANG, Wenyue

    IPC: G02B26/00 ,  B81B3/00 ,  B81C1/00

    CPC classification number: G02B26/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81B2203/019 ,  B81C2201/0167 ,  B81C2201/017

    Abstract: This disclosure provides systems, methods and apparatus for controlling a movable layer. In one aspect, an electromechanical systems device includes a substrate and a movable layer positioned over the substrate to define a gap. The movable layer is movable in the gap between an actuated position and a relaxed position, and includes a mirror layer, a cap layer, and a dielectric layer disposed between the mirror layer and the cap layer. The movable layer is configured to have a curvature in a direction away from the substrate when the movable layer is in the relaxed position. In some implementations, the movable layer can be formed to have a positive stress gradient directed toward the substrate that can direct the curvature of the movable layer upward when the sacrificial layer is removed.

    Abstract translation: 本公开提供了用于控制可移动层的系统，方法和装置。 在一个方面，机电系统装置包括基板和位于基板上方以限定间隙的可移动层。 可移动层可以在致动位置和松弛位置之间的间隙中移动，并且包括镜层，盖层和设置在镜层和盖层之间的介电层。 可移动层被配置为当可移动层处于松弛位置时具有远离基底的方向的曲率。 在一些实施方案中，可移动层可以形成为具有朝向衬底的正应力梯度，当消除牺牲层时，可以将可移动层的曲率向上引导。

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