DETERGENT COMPOSITION
    1.
    发明申请
    DETERGENT COMPOSITION 审中-公开
    洗涤剂组合物

    公开(公告)号:WO1996005281A1

    公开(公告)日:1996-02-22

    申请号:PCT/JP1995001566

    申请日:1995-08-07

    Inventor: KAO CORPORATION

    Abstract: A detergent composition containing (A) an amide ether derivative mixture containing at least 50 wt.% in total, based on the solid component, of (1) an amide ether carboxylic acid or a salt thereof and (2) an amide ether in a weight ratio, (1)/(2), of 99:1 to 10:90 and further containing at most 5 wt.% based on the solid component, of a glycerol derivative, and (B) an amphoteric surfactant: (in formulae (1), (2) and (3), R is C5-C23 alkyl, alkenyl or phenyl substituted by C5-C23 alkyl; R is H, -(C2H4O)nCH2COOM, -(C2H4O)mH OR C1-C3 alkyl; M is H, alkali metal cation, etc.; n and m are each a number of 1 to 20; R is H, -(C2H4O)mH or C1-C3 alkyl; and R is H, -(C2H4O)nCH2COOM or -(C2H4O)mH. The composition is lowly irritative and highly foaming and gives creamy foams.

    Abstract translation: 一种洗涤剂组合物,其含有(A)酰胺醚衍生物混合物,该混合物含有(1)酰胺醚羧酸或其盐和(2)酰胺醚的总固体组分总计至少50重量% 重量比,(1)/(2),99:1至10:90,并且还含有至多5重量%的固体组分,甘油衍生物和(B)两性表面活性剂:(在式 (1),(2)和(3)中,R 1是C 5 -C 23烷基,烯基或被C 5 -C 23烷基取代的苯基; R 2是H, - (C 2 H 4 O)n CH 2 COOM, - (C 2 H 4 O) 或C 1 -C 3烷基; M为H,碱金属阳离子等; n和m各自为1至20; R 3为H, - (C 2 H 4 O)m H或C 1 -C 3烷基; 4>是H, - (C 2 H 4 O)n CH 2 COOM或 - (C 2 H 4 O)m H。组合物具有低刺激性和高发泡性,并且赋予乳状泡沫。

    CERAMIC AGGREGATE SUBSTRATE, CERAMIC SUBSTRATE AND CERAMIC AGGREGATE SUBSTRATE FABRICATION METHOD
    2.
    发明申请
    CERAMIC AGGREGATE SUBSTRATE, CERAMIC SUBSTRATE AND CERAMIC AGGREGATE SUBSTRATE FABRICATION METHOD 审中-公开
    陶瓷基体,陶瓷基体和陶瓷基体基体的制作方法

    公开(公告)号:WO2006064977A3

    公开(公告)日:2006-08-10

    申请号:PCT/JP2005023555

    申请日:2005-12-16

    Inventor: IMAMURA TAKASHI

    Abstract: When neighboring ceramic substrates are split apart by linear snaps, through-holes and holes with floors, which are formed across the snaps, are also split apart. By splitting apart such a ceramic aggregate substrate along the snaps, it is possible to obtain numerous ceramic substrates, in end faces of which recess portions are formed. In comparison with a case of splitting apart such that throwaway substrates are formed at surroundings of ceramic substrates, a number of the ceramic substrates that are split apart from one ceramic aggregate substrate is larger. Therefore, it is possible to keep a unit cost for each of the ceramic substrates lower.

    Abstract translation: 当相邻的陶瓷基板通过线性卡扣分开时,穿过卡扣形成的通孔和具有地板的孔也被分开。 通过沿着搭扣将这种陶瓷集合体基板分开,可以在其端面形成凹陷部分的情况下获得大量陶瓷基板。 与在陶瓷基板的周围形成一次性基板的情况相比,与一块陶瓷基板分开的多个陶瓷基板较大。 因此,可以降低每个陶瓷基板的单位成本。

    DETERGENT COMPOSITION
    3.
    发明申请
    DETERGENT COMPOSITION 审中-公开
    洗涤剂组合物

    公开(公告)号:WO1996005282A1

    公开(公告)日:1996-02-22

    申请号:PCT/JP1995001565

    申请日:1995-08-07

    Inventor: KAO CORPORATION

    Abstract: A detergent composition containing (A) an amide ether derivative mixture containing at least 50 wt.% in total, based on the solid component, of (1) an amide ether carboxylic acid or a salt thereof and (2) an amide ether in a weight ratio, (1)/(2), of 99:1 to 10:90 and further containing at most 5 wt.% based on the solid component, of a glycerol derivative, and (B) an amphoteric surfactant. In Formulae (1), (2) and (3) R is C5-C23 alkyl, alkenyl or phenyl substituted by C5-C23 alkyl; R is H, -(C2H4O)nCH2COOM, -(C2H4O)mH or C1-C3 alkyl; M is H, alkali metal cation, etc.; n and m are each a number of 1 to 20; R is H, -(C2H4O)mH or C1-C3 alkyl; and R is H, -(C2H4O)nCH2COOM or -(C2H4O)mH. The composition is lowly irritative and highly foaming and gives creamy foams.

    Abstract translation: 一种洗涤剂组合物,其含有(A)酰胺醚衍生物混合物,该混合物含有(1)酰胺醚羧酸或其盐和(2)酰胺醚的总固体组分总计至少50重量% 重量比,(1)/(2),99:1至10:90,并且还含有至多5重量%的固体组分,甘油衍生物和(B)两性表面活性剂。 在式(1),(2)和(3)中,R 1是C 5 -C 23烷基,被C 5 -C 23烷基取代的链烯基或苯基; R 2是H, - (C 2 H 4 O)n CH 2 COOM, - (C 2 H 4 O)m H或C 1 -C 3烷基; M为H,碱金属阳离子等; n和m各自为1〜20的数; R 3是H, - (C 2 H 4 O)m H或C 1 -C 3烷基; 和R 4是H, - (C 2 H 4 O)n CH 2 COOM或 - (C 2 H 4 O)m H。 该组合物具有低刺激性和高度起泡性,并赋予乳状泡沫。

    STRUCTURE AND METHOD FOR ATTACHING SHIELD CASE TO CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND PORTABLE TELEPHONE
    4.
    发明申请
    STRUCTURE AND METHOD FOR ATTACHING SHIELD CASE TO CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND PORTABLE TELEPHONE 审中-公开
    将电路板,电子元件和便携式电话连接到外壳的结构和方法

    公开(公告)号:WO2006075794A3

    公开(公告)日:2007-02-01

    申请号:PCT/JP2006300787

    申请日:2006-01-13

    Inventor: IMAMURA TAKASHI

    Abstract: A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.

    Abstract translation: 用于将屏蔽壳附接到电路板的结构。 电子部件安装在电路板的一个面上。 屏蔽盒用于覆盖电子元件并阻塞电磁波。 安装结构包括形成为从屏蔽壳突出的趾部和形成在电路板中的孔,趾部可插入该趾部。 脚趾部分通过插入孔中固定到电路板上,并焊接到电路板另一面的焊接区域。 因此,可以防止焊球和焊剂进入屏蔽壳体,进一步可能在电路板的背面保留用于固定屏蔽壳体所需的尺寸的焊盘的空间,以及 可以将屏蔽盒牢固地连接到电路板。

    STRUCTURE AND METHOD FOR ATTACHING SHIELD CASE TO CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND PORTABLE TELEPHONE
    5.
    发明申请
    STRUCTURE AND METHOD FOR ATTACHING SHIELD CASE TO CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND PORTABLE TELEPHONE 审中-公开
    将电路板,电子元件和便携式电话连接到外壳的结构和方法

    公开(公告)号:WO2006075794A2

    公开(公告)日:2006-07-20

    申请号:PCT/JP2006/300787

    申请日:2006-01-13

    Inventor: IMAMURA, Takashi

    Abstract: A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.

    Abstract translation: 用于将屏蔽壳附接到电路板的结构。 电子部件安装在电路板的一个面上。 屏蔽盒用于覆盖电子元件并阻塞电磁波。 安装结构包括形成为从屏蔽壳突出的趾部和形成在电路板中的孔,趾部可插入该趾部。 脚趾部分通过插入孔中固定到电路板上,并焊接到电路板另一面的焊接区域。 因此,可以防止焊球和焊剂进入屏蔽壳体,进一步可能在电路板的背面保留用于固定屏蔽壳体所需的尺寸的焊盘的空间,以及 可以将屏蔽盒牢固地连接到电路板。

    CERAMIC AGGREGATE SUBSTRATE, CERAMIC SUBSTRATE AND CERAMIC AGGREGATE SUBSTRATE FABRICATION METHOD
    6.
    发明申请
    CERAMIC AGGREGATE SUBSTRATE, CERAMIC SUBSTRATE AND CERAMIC AGGREGATE SUBSTRATE FABRICATION METHOD 审中-公开
    陶瓷聚集基板,陶瓷基板和陶瓷集合基板制造方法

    公开(公告)号:WO2006064977A2

    公开(公告)日:2006-06-22

    申请号:PCT/JP2005/023555

    申请日:2005-12-16

    Inventor: IMAMURA, Takashi

    Abstract: When neighboring ceramic substrates are split apart by linear snaps, through-holes and holes with floors, which are formed across the snaps, are also split apart. By splitting apart such a ceramic aggregate substrate along the snaps, it is possible to obtain numerous ceramic substrates, in end faces of which recess portions are formed. In comparison with a case of splitting apart such that throwaway substrates are formed at surroundings of ceramic substrates, a number of the ceramic substrates that are split apart from one ceramic aggregate substrate is larger. Therefore, it is possible to keep a unit cost for each of the ceramic substrates lower.

    Abstract translation: 当相邻的陶瓷基板通过线性卡扣分开时,跨越卡扣的通孔和带有地板的孔也被分开。 通过沿着卡扣分开这样的陶瓷集合基板,可以在形成有凹部的端面中获得许多陶瓷基板。 与分离的情况相比,在陶瓷基板的周围形成一次性的基板,与陶瓷集合基板分离的多个陶瓷基板较大。 因此,可以使每个陶瓷基板的单位成本保持较低。

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