公开(公告)号：AU7816501A

公开(公告)日：2002-02-13

申请号：AU7816501

申请日：2001-08-01

Applicant: INCEP TECHNOLOGIES INC

Inventor： JOSEPH TED DIBENE II ,  FARHAD RAISZADEH

IPC: G06F1/18 ,  H01L23/427 ,  H01R12/16 ,  H05K1/02 ,  H05K3/36 ,  H05K7/20 ,  H05K7/00

公开(公告)号：AU2003216390A1

公开(公告)日：2003-09-09

申请号：AU2003216390

申请日：2003-02-21

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE II JOSEPH T ,  HARRIS PHILIP M

IPC: G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H02M3/158 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20

Abstract: A synchronous voltage regulation circuit having an energy storage circuit for controlling the output signal is disclosed. The voltage regulation circuit includes a circuit which advantageously uses leakage inductance from loose coupling of input and output inductors to control regulator switching.

公开(公告)号：AU6655101A

公开(公告)日：2001-09-12

申请号：AU6655101

申请日：2001-02-16

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  KASKADE JAMES HJERPE ,  HOGE CARL E

IPC: H05K3/34 ,  G06F1/18 ,  H01L23/32 ,  H01L23/427 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  G06F1/26

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

公开(公告)号：AU6655401A

公开(公告)日：2001-09-17

申请号：AU6655401

申请日：2001-03-08

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  DERIAN EDWARD J ,  HOGE CARL E ,  BRODER JAMES M ,  ANDREAS JOSE B SAN ,  RIEL JOSEPH S

IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01L23/00

公开(公告)号：AU5903200A

公开(公告)日：2001-02-05

申请号：AU5903200

申请日：2000-06-28

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID

IPC: G06F1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

公开(公告)号：CA2402229A1

公开(公告)日：2001-09-13

申请号：CA2402229

申请日：2001-03-08

Applicant: INCEP TECHNOLOGIES INC

Inventor： RIEL JOSEPH S ,  SAN ANDREAS JOSE B ,  BRODER JAMES M ,  HOGE CARL E ,  DERIAN EDWARD J ,  DIBENE JOSEPH TED II ,  HARTKE DAVID H

IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01R12/04

Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface an d a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a firs t conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, havi ng a second conductive member first surface electrically coupleable to the firs t circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleab le to the second circuit board second conductive surface.

公开(公告)号：CA2400568A1

公开(公告)日：2001-09-07

申请号：CA2400568

申请日：2001-02-16

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  KASKADE JAMES HJERPE ,  HOGE CARL E ,  HARTKE DAVID

IPC: H05K3/34 ,  G06F1/18 ,  H01L23/32 ,  H01L23/427 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10

Abstract: A microprocessor packaging architecture using a modular circuit board assemb ly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

公开(公告)号：AU1231901A

公开(公告)日：2001-05-14

申请号：AU1231901

申请日：2000-10-24

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID

IPC: H05K1/11 ,  G06F1/18 ,  H01R4/64 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20 ,  H01R12/04

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

公开(公告)号：MXPA02008042A

公开(公告)日：2004-09-06

申请号：MXPA02008042

申请日：2001-02-16

Applicant: INCEP TECHNOLOGIES INC

Inventor： HOGE CARL E

IPC: H05K3/34 ,  G06F1/18 ,  H01L23/32 ,  H01L23/427 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  G06F1/26

Abstract: Se describe una arquitectura de empaque de microprocesador que utiliza un ensamble de tablero de circuito modular que proporciona energia a un microprocesador mientras que tambien proporciona una interfase integrada termica y electromagnetica (EMI). El ensamble de tablero de circuito modular comprende un substrato que tiene un componente montado en el mismo, un tablero de circuito incluyendo un circuito para suministrar energia al componente, y por lo menos un dispositivo de interconexion conductor dispuesto entre el substrato y el tablero de circuito, el dispositivo de interconexion conductor configurado para acoplar electricamente el circuito a la computadora.

公开(公告)号：CA2389712A1

公开(公告)日：2001-05-10

申请号：CA2389712

申请日：2000-10-24

Applicant: INCEP TECHNOLOGIES INC

Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID

IPC: H05K1/11 ,  G06F1/18 ,  H01R4/64 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20 ,  H01R12/04

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanica l coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.