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    Encapsulated packaging in between 2 pcbs
    4.
    发明专利
    Encapsulated packaging in between 2 pcbs 未知

    公开(公告)号：AU5903200A

    公开(公告)日：2001-02-05

    申请号：AU5903200

    申请日：2000-06-28

    Applicant: INCEP TECHNOLOGIES INC

    Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID

    IPC: G06F1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

    Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
    5.
    发明专利
    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES 未知

    公开(公告)号：CA2402229A1

    公开(公告)日：2001-09-13

    申请号：CA2402229

    申请日：2001-03-08

    Applicant: INCEP TECHNOLOGIES INC

    Inventor： RIEL JOSEPH S ,  SAN ANDREAS JOSE B ,  BRODER JAMES M ,  HOGE CARL E ,  DERIAN EDWARD J ,  DIBENE JOSEPH TED II ,  HARTKE DAVID H

    IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01R12/04

    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface an d a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a firs t conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, havi ng a second conductive member first surface electrically coupleable to the firs t circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleab le to the second circuit board second conductive surface.

    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
    9.
    发明申请
    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES 审中-公开
    将功率传递给高性能电子总成的方法和装置

    公开(公告)号：WO0167512A3

    公开(公告)日：2002-05-10

    申请号：PCT/US0107410

    申请日：2001-03-08

    Applicant: INCEP TECHNOLOGIES INC

    Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  DERIAN EDWARD J ,  HOGE CARL E ,  BRODER JAMES M ,  SAN ANDREAS JOSE B ,  RIEL JOSEPH S

    IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01R12/04

    CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/0263 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H01L2924/00

    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

    Abstract translation: 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。

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