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    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
    1.
    发明专利
    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES 未知

    公开(公告)号：CA2402229A1

    公开(公告)日：2001-09-13

    申请号：CA2402229

    申请日：2001-03-08

    Applicant: INCEP TECHNOLOGIES INC

    Inventor： RIEL JOSEPH S ,  SAN ANDREAS JOSE B ,  BRODER JAMES M ,  HOGE CARL E ,  DERIAN EDWARD J ,  DIBENE JOSEPH TED II ,  HARTKE DAVID H

    IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01R12/04

    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface an d a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a firs t conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, havi ng a second conductive member first surface electrically coupleable to the firs t circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleab le to the second circuit board second conductive surface.

    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
    3.
    发明申请
    METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES 审中-公开
    将功率传递给高性能电子总成的方法和装置

    公开(公告)号：WO0167512A3

    公开(公告)日：2002-05-10

    申请号：PCT/US0107410

    申请日：2001-03-08

    Applicant: INCEP TECHNOLOGIES INC

    Inventor： DIBENE JOSEPH TED II ,  HARTKE DAVID ,  DERIAN EDWARD J ,  HOGE CARL E ,  BRODER JAMES M ,  SAN ANDREAS JOSE B ,  RIEL JOSEPH S

    IPC: G06F1/18 ,  H01L23/427 ,  H05K1/02 ,  H05K3/36 ,  H05K7/10 ,  H01R12/04

    CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/0263 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H01L2924/00

    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

    Abstract translation: 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。

    LAN GRID ARRAY INTERCONNECT METHODS FOR Z-AXIS POWER DELIVERY
    4.
    发明申请
    LAN GRID ARRAY INTERCONNECT METHODS FOR Z-AXIS POWER DELIVERY 审中-公开
    用于Z轴电力传输的局域网阵列互连方法

    公开(公告)号：WO2005013328A2

    公开(公告)日：2005-02-10

    申请号：PCT/US2004024124

    申请日：2004-07-27

    Applicant: INCEP TECHNOLOGIES INC ,  DERIAN EDWARD J ,  DIBENE II J TED

    Inventor： DERIAN EDWARD J ,  DIBENE II J TED

    IPC: H01L20060101 ,  H05K7/20 ,  H01L

    CPC classification number: H05K7/1061

    Abstract: [30] A land grid retention and interconnection system for high power low impedance delivery for microprocessors and other devices are used for Z-axis power delivery packaging architectures. The system includes a substrate with LGA pads on its bottom and surface power delivery pads on its top. A subassembly includes an LGA socket subassembly with a cage for retaining the substrate and contact with the land grid array beams of the LGA socket subassembly.

    Abstract translation: [30]用于微处理器和其他设备的大功率低阻抗传输的陆地电网保持和互连系统用于Z轴功率传输封装架构。 该系统包括在其底部具有LGA焊盘并在其顶部具有表面功率传输焊盘的衬底。 子组件包括具有用于保持衬底并与LGA插座子组件的焊盘栅格阵列梁接触的保持架的LGA插座子组件。

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