MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRONICS PACKAGE FORMED THEREBY

    公开(公告)号:WO2021243161A1

    公开(公告)日:2021-12-02

    申请号:PCT/US2021/034771

    申请日:2021-05-28

    Abstract: An electronics package includes an electrically insulating substrate having a first surface and a second surface, an adhesive layer positioned on the first surface of the electrically insulating substrate, and an electrical component having a top surface coupled to the adhesive layer on a surface thereof opposite the electrically insulating substrate, the electrical component having contact pads on the top surface. Vias are formed through the electrically insulating substrate and the adhesive layer at locations corresponding to the contact pads by way of a mechanical punching operation, with each of the vias having a via wall extending from the second surface of the electrically insulating substrate to a respective contact pad. At each via, the electrically insulating substrate comprises a protrusion extending outwardly from the first surface thereof so as to cover at least part of the adhesive layer in forming part of the via wall.

    CROSSLINKABLE AND CROSSLINKED POLYMERS
    4.
    发明申请
    CROSSLINKABLE AND CROSSLINKED POLYMERS 审中-公开
    交联和交联聚合物

    公开(公告)号:WO2006026421A3

    公开(公告)日:2007-02-01

    申请号:PCT/US2005030390

    申请日:2005-08-25

    Abstract: Crosslinkable polymeric materials are disclosed useful for the temporal stabilization of a poling- induced noncentrosymmetric host lattice containing guest nonlinear optical chromophores . The materials are also suitable as, crosslinkable coatings in the absence of chromophores. Also disclosed is a method of srosslinking such polymeric material comprising reacting i)a crosslinkable polymeric material comprising olefin groups and ii) a crosslinking agent comprising electron deficient olefin groups, at a temperature at which crosslinking occurs.

    Abstract translation: 公开了可交联聚合材料,其用于包含客体非线性光学发色团的极化诱导的非中心对称主体晶格的时间稳定性。 在不存在发色团的情况下,这些材料也适合作为可交联涂层。 还公开了一种交联这种聚合材料的方法,包括使i)包含烯烃基团的可交联聚合物材料和ii)在发生交联的温度下包含电子缺陷烯烃基团的交联剂。

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