公开(公告)号：WO2009052147A2

公开(公告)日：2009-04-23

申请号：PCT/US2008079943

申请日：2008-10-15

Applicant: HEWLETT PACKARD DEVELOPMENT CO ,  BRAUN DAVID M ,  BHOWMIK SIDDHARTHA ,  KOMMERA SWAROOP K ,  ORAM RICHARD J ,  ROURKE PHILIP G ,  SMITH JOSHUA W ,  ASCHOFF CHRISTOPHER C

Inventor： BRAUN DAVID M ,  BHOWMIK SIDDHARTHA ,  KOMMERA SWAROOP K ,  ORAM RICHARD J ,  ROURKE PHILIP G ,  SMITH JOSHUA W ,  ASCHOFF CHRISTOPHER C

CPC classification number: B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  Y10T29/49401

Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Abstract translation: 公开了一种方法和装置，其中打印头模具包括穿过狭槽的槽和肋。 肋从模具的一侧或两侧凹入。

公开(公告)号：WO2009025986A1

公开(公告)日：2009-02-26

申请号：PCT/US2008/072155

申请日：2008-08-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  KOMMERA, Swaroop K. ,  BHOWMIK, Siddhartha ,  ORAM, Richard, J. ,  RAMAMOORTHI, Sriram ,  BRAUN, David, M.

Inventor： KOMMERA, Swaroop K. ,  BHOWMIK, Siddhartha ,  ORAM, Richard, J. ,  RAMAMOORTHI, Sriram ,  BRAUN, David, M.

IPC: H01L21/302

CPC classification number: B81C1/00087 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1634 ,  B81B2201/052 ,  H01L21/76898

Abstract: A slot (18) is formed that reaches through a first side (21) of a silicon substrate (12) to a second side of the silicon substrate (12). A trench (15) is laser patterned. The trench (15) has a mouth at the first side (21) of the silicon substrate (12). The trench (15) does not reach the second side of the silicon substrate (12). the trench (15) is dry etched until a depth of at least a portion of the trench (15) is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot (18). the wet etch etches silicon from all surfaces of the trench (15).

Abstract translation: 形成了通过硅衬底（12）的第一侧（21）到达硅衬底（12）的第二侧的槽（18）。 激光图案的沟槽（15）。 沟槽（15）在硅衬底（12）的第一侧（21）处具有口。 沟槽（15）没有到达硅衬底（12）的第二侧。 干式蚀刻沟槽（15）直到沟槽（15）的至少一部分的深度大致延伸到硅衬底（12）的第二侧。 执行湿蚀刻以完成狭槽（18）的形成。 湿蚀刻从沟槽（15）的所有表面蚀刻硅。

公开(公告)号：WO2010005434A1

公开(公告)日：2010-01-14

申请号：PCT/US2008/069570

申请日：2008-07-09

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  BHOWMIK, Siddhartha ,  KOMMERA, Swaroop K. ,  GIRI, Manish ,  BROWNING, Robert N.k. ,  SCHMIDT, Charles Gustav

Inventor： BHOWMIK, Siddhartha ,  KOMMERA, Swaroop K. ,  GIRI, Manish ,  BROWNING, Robert N.k. ,  SCHMIDT, Charles Gustav

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1601 ,  B41J2/14145 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1634

Abstract: A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).

Abstract translation: 打印头模具（30）包括具有三角形凹口的边缘（62,64）的槽肋（41）。 在一个实施例中，打印头模具通过从晶片（30）的第一侧（50）干燥蚀刻而形成，所述第一侧（30）具有完全穿过晶片（30）的一系列间隔开的开口（220），并且被肋（41）隔开， 从第二相对侧（44）湿式蚀刻晶片（30）以将肋（41）从第二侧（44）凹入。

公开(公告)号：WO2009052147A3

公开(公告)日：2009-04-23

申请号：PCT/US2008/079943

申请日：2008-10-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ,  BRAUN, David M. ,  BHOWMIK, Siddhartha ,  KOMMERA, Swaroop K. ,  ORAM, Richard J. ,  ROURKE, Philip G. ,  SMITH, Joshua W. ,  ASCHOFF, Christopher C.

Inventor： BRAUN, David M. ,  BHOWMIK, Siddhartha ,  KOMMERA, Swaroop K. ,  ORAM, Richard J. ,  ROURKE, Philip G. ,  SMITH, Joshua W. ,  ASCHOFF, Christopher C.

IPC: B41J2/01 ,  B41J2/16

Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.