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    Electromagnetic shield
    2.
    发明专利
    Electromagnetic shield 有权
    电磁屏蔽

    公开(公告)号：JP2013042161A

    公开(公告)日：2013-02-28

    申请号：JP2012226744

    申请日：2012-10-12

    Applicant: Laird Technologies Inc ,  レアード テクノロジーズ インコーポレイテッドLaird Technologies,Inc.

    Inventor： LARRY D CREASY JR

    IPC: H05K9/00 ,  B32B5/24

    CPC classification number: H05K9/0088 ,  C08K5/49 ,  Y10T428/249953 ,  Y10T428/249982 ,  Y10T428/28

    Abstract: PROBLEM TO BE SOLVED: To materialize an electromagnetic shield that generates no halogen gas even if it is exposed to high temperatures, has required adhesive strength, and is capable of achieving UL flame retardant rating V0.SOLUTION: This electromagnetic shield includes at least one resilient core member, at least one conductive layer, and at least one adhesive existing between the conductive layer and the resilient core member and having adhesive strength of at least 10 ounces per inch width (111.6 g per 1 cm width) for bonding the conductive layer to the resilient core member. The conductive layer includes at least one cloth material. The resilient core member includes at least one urethane foam material as an option. The adhesive contains no halogen, and contains at least one kind of halogen-free flame retardant agent of not less than 35% and not more than 63% by dry weight. The shield has flame rating of V0 by Underwriter's Laboratories (UL) standard No.94.

    Abstract translation: 要解决的问题：为了实现即使暴露于高温也不产生卤素气体的电磁屏蔽，需要粘合强度，并且能够获得UL阻燃等级V0。 解决方案：该电磁屏蔽包括至少一个弹性芯构件，至少一个导电层和存在于导电层和弹性芯构件之间的至少一个粘合剂，并具有至少10盎司/英寸宽度的粘合强度（ 111.6g / 1cm宽度），用于将导电层粘合到弹性芯构件上。 导电层包括至少一种布料。 弹性芯构件包括至少一个聚氨酯泡沫材料作为选项。 粘合剂不含卤素，并且含有至少一种不少于35重量％且不超过63重量％的无卤阻燃剂。 盾牌通过Underwriter's Laboratories（UL）94号标准获得V0的阻燃等级。 版权所有（C）2013，JPO＆INPIT

    Highly thermal conductive and formable thermoplastic composite material and composition
    3.
    发明专利
    Highly thermal conductive and formable thermoplastic composite material and composition 有权
    高导热和热塑性复合材料及组成

    公开(公告)号：JP2011038078A

    公开(公告)日：2011-02-24

    申请号：JP2010123935

    申请日：2010-05-31

    Applicant: Laird Technologies Inc ,  レアード テクノロジーズ インコーポレイテッドLaird Technologies,Inc.

    Inventor： BUKKINAKERE KAPANIPATHAIYA CHANDRASEKHAR ,  RAMACHANDRAIAH MANJUNATHA HOSAHALLI ,  KUMAR BAMBORE LOKESHWARAPPA SANTHOSH ,  DURAISWAMY SRINIVASAN

    IPC: C08L101/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02

    CPC classification number: H01B1/22 ,  H01B1/24

    Abstract: PROBLEM TO BE SOLVED: To provide a material for a composite material, having a particulate filler in a high ratio. SOLUTION: The thermoplastic composition or composite material, which is thermally conductive and formable, may contain a plurality of filler particles coated with a metal, a plurality of secondary filler particles, and a polymer matrix in a mixture of the filler particles coated with the metal and the secondary filler particles. The composition and the composite material may have a thermal conductivity in the range of about 20 W to about 35 W/m×K. An injection molded article, having the composition or the composite material which has thermal conductivity and thermoplasticity and is formable, may be produced in order to apply to microelectronics, automobile, aviation electronics and other heat dissipation. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有高比率的颗粒填料的复合材料的材料。 解决方案：热塑性组合物或复合材料，其是导热的和可形成的，可以包含涂覆有金属的多个填料颗粒，多个二次填料颗粒和在涂覆的填料颗粒的混合物中的聚合物基质 与金属和二次填料颗粒。 组合物和复合材料的热导率可以在约20W至约35W / m×K的范围内。 可以制造具有导热性和热塑性且可成形的组合物或复合材料的注塑制品，以便应用于微电子学，汽车，航空电子学和其它散热。 版权所有（C）2011，JPO＆INPIT

    Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same
    4.
    发明专利
    Suitable multilayer heat conductive intermediate structure, and memory module equipped with the same 审中-公开
    适用的多层导热介质结构及其相关的存储器模块

    公开(公告)号：JP2011000884A

    公开(公告)日：2011-01-06

    申请号：JP2010123934

    申请日：2010-05-31

    Applicant: Laird Technologies Inc ,  レアード テクノロジーズ インコーポレイテッドLaird Technologies,Inc.

    Inventor： HILL RICHARD F ,  SMYTHE ROBERT MICHAEL

    IPC: B32B7/02 ,  B32B3/24 ,  B32B9/00 ,  G06K19/077

    Abstract: PROBLEM TO BE SOLVED: To provide a heat conductive intermediate structure suitable for utilization when radiating heat from one or a plurality of components mounted to memory modules or other devices.SOLUTION: A heat transfer intermediate material is arranged on or along one surface of a flexible heat conductive sheet, or the flexible heat conductive sheet is jointed to a first layer and a second layer of the heat transfer intermediate material enclosed therein, or interposed therebetween. The flexible heat conductive sheet may be a flexible porous graphite sheet. The heat transfer intermediate material may be a heat conductive polymer. Polymer-polymer bonding easily occurs by forming holes in the graphite sheet. The polymer-polymer bonding can promote the mechanical joint of the first layer and the second layer to the graphite sheet and promote the provision of heat conduction between the first layer and the second layer.

    Abstract translation: 要解决的问题：提供一种适于在从安装到存储器模块或其它装置的一个或多个部件散发热量时适用的导热中间结构。解决方案：传热中间材料布置在柔性 导热片或柔性导热片被接合到封闭在其中的第一层和传热中间材料的第二层，或插入其间。 柔性导热片可以是柔性多孔石墨片。 传热中间材料可以是导热聚合物。 通过在石墨片中形成孔容易发生聚合物 - 聚合物的结合。 聚合物 - 聚合物结合可以促进第一层和第二层的机械接合到石墨片上，并且促进在第一层和第二层之间提供热传导。

    Electromagnetic interference shield and its manufacturing method
    5.
    发明专利
    Electromagnetic interference shield and its manufacturing method 有权
    电磁干扰屏蔽及其制造方法

    公开(公告)号：JP2009060067A

    公开(公告)日：2009-03-19

    申请号：JP2007282010

    申请日：2007-10-30

    Applicant: Laird Technologies Inc ,  レアード テクノロジーズ インコーポレイテッドLaird Technologies,Inc.

    Inventor： CROTTY PAUL W

    IPC: H05K9/00

    CPC classification number: H05K9/0032

    Abstract: PROBLEM TO BE SOLVED: To provide a shield suitable for shielding electronic parts on a printed circuit board from electromagnetic interference (EMI)/radio frequency interference (RFI).
    SOLUTION: A shield 100 comprises a shield housing having a sidewall 102 and an integrated upper face 130. The side wall 102 comprises an upper wall part 132 and a lower wall part 108, wherein the wall parts 132 and 108 together demarcate an interlock 104. The upper wall part 132 extends downward from the integrated upper face 130. By means of the interlock 104, the integrated upper face 130 and the upper wall part 132 are attached to the lower wall part 108 in a removable manner. When the interlock 104 is canceled, the integrated upper face 130 and the upper wall part 132 are completely separated from the lower wall part 108. The integrated upper face 130 and the upper wall part 132 can also be attached again to the lower wall part 108 by means of the engagement of the interlock 104.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供适用于屏蔽印刷电路板上的电子部件的屏蔽电磁干扰（EMI）/射频干扰（RFI）。 屏蔽件100包括具有侧壁102和整体上表面130的屏蔽壳体。侧壁102包括上壁部分132和下壁部分108，其中壁部分132和108一起划分为 上壁部分132从一体化的上表面130向下延伸。通过互锁件104，集成的上表面130和上壁部分132以可移除的方式附接到下壁部分108。 当联锁104被取消时，集成的上表面130和上壁部分132与下壁部分108完全分离。集成的上表面130和上壁部分132也可以再次附接到下壁部分108 通过联锁装置104的接合。版权所有（C）2009，JPO＆INPIT

    Electrically conductive porous material assemblies and methods of making the same
    7.
    发明专利
    Electrically conductive porous material assemblies and methods of making the same 有权
    电导体多孔材料组件及其制造方法

    公开(公告)号：JP2014150242A

    公开(公告)日：2014-08-21

    申请号：JP2013246460

    申请日：2013-11-28

    Applicant: Laird Technologies Inc ,  レアード テクノロジーズ インコーポレイテッドLaird Technologies,Inc.

    Inventor： LARRY D CREASY JR ,  RICHARD TSAI ,  OU BAOQUAN ,  DAVID B WOOD

    IPC: H05K9/00 ,  B32B5/24 ,  C09K21/02 ,  C09K21/06

    CPC classification number: H05K9/003 ,  H05K9/0041 ,  H05K9/0088

    Abstract: PROBLEM TO BE SOLVED: To provide electrically conductive porous material assemblies and methods of making or producing the same.SOLUTION: Disclosed are exemplary embodiments of electrically conductive porous material assemblies. Also disclosed are exemplary methods of making or producing electrically conductive porous material assemblies. In an exemplary embodiment, an electrically conductive porous material assembly generally includes an electrically conductive porous material and a first layer of electrically conductive porous fabric. A first layer of adhesive is between the first layer of electrically conductive porous fabric and the electrically conductive porous material.

    Abstract translation: 要解决的问题：提供导电多孔材料组件及其制造或制造方法。解决方案：公开了导电多孔材料组件的示例性实施例。 还公开了制造或制造导电多孔材料组件的示例性方法。 在示例性实施例中，导电多孔材料组件通常包括导电多孔材料和第一层导电多孔织物。 第一层粘合剂位于第一层导电多孔织物和导电多孔材料之间。

    A tape comprising a flame retardant, electrically conductive adhesive material
    8.
    发明公开
    A tape comprising a flame retardant, electrically conductive adhesive material 审中-公开
    包含阻燃剂，电导电胶粘材料的胶带

    公开(公告)号：KR20150107645A

    公开(公告)日：2015-09-23

    申请号：KR20150033764

    申请日：2015-03-11

    Applicant: LAIRD TECHNOLOGIES INC

    Inventor： LARRY D CREASY JR ,  HSU MIN WEI ,  LIN YI SHEN

    IPC: C09J7/04 ,  H01B5/14

    CPC classification number: C09J7/21 ,  C09J9/02 ,  H01B5/14

    Abstract: 난연성, 전기 도전성 접착 재료의 예시적인 실시형태를 개시한다. 예시적인 실시형태에서, 테이프로 사용하기에 적합한 난연성, 전기 도전성 접착 재료는 일반적으로 접착제층을 포함한다. 전기 도전성 직물층이 접착제층 상에 존재한다. 난연성 코팅이 전기 도전성 직물층 상에 존재한다. 난연성 코팅은 탄소함유 수지를 포함한다.

    Abstract translation: 公开了阻燃和导电粘合剂材料的示例性实施方案。 在示例性实施例中，适合用作带的阻燃和导电粘合剂材料通常包括粘合剂层。 导电织物层存在于粘合剂层上。 在导电织物层上存在阻燃涂层。 阻燃涂层包括含碳树脂。

    열 계면 재료 도포 시스템 및 방법
    9.
    发明公开
    열 계면 재료 도포 시스템 및 방법 审中-公开
    用于热界面材料的系统和方法

    公开(公告)号：KR20180006850A

    公开(公告)日：2018-01-19

    申请号：KR20170085269

    申请日：2017-07-05

    Applicant: LAIRD TECHNOLOGIES INC

    Inventor： MARK D KITTEL ,  JASON L STRADER

    IPC: H01L23/373 ,  H01L21/67 ,  H01L21/78

    CPC classification number: B23P15/26 ,  B29C63/0013 ,  B29C63/02 ,  H01L21/4803 ,  H01L21/4882 ,  H01L23/42 ,  H05K7/2039

    Abstract: 열계면재료(TIM)를도포하기위한시스템및 방법의예시적인실시예가개시된다. 열계면재료는집적회로(IC) 패키지의덮개또는일체형열 분산기, 보드레벨차폐물, 열원(예컨대, 중앙처리장치(CPU) 등), 열제거/소산구조물또는구성요소(예컨대, 열분산기, 히트싱크, 히트파이프, 증기챔버, 장치외장케이스또는하우징등)와같은, 광범위한기판또는구성요소에도포될수 있다.

    Abstract translation: 公开了应用热界面材料（TIM）的系统和方法的示例性实施例。 热界面材料可应用于各种衬底和组件，例如集成电路（IC）封装的盖子或集成散热器，板级屏蔽，热源（例如中央处理单元（CPU）等） ），散热/散热结构或部件（例如，散热器，散热器，热管，蒸汽室，设备外壳或外壳等）等等。

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