公开(公告)号：DE618763C

公开(公告)日：1935-09-14

申请号：DEM0120503

申请日：1932-07-23

Applicant: LEE LLOYD MARCHANT

IPC: B21J15/04

公开(公告)号：GB391652A

公开(公告)日：1933-05-04

申请号：GB2047432

申请日：1932-07-20

Applicant: LEE LLOYD MARCHANT

IPC: B21J15/26

Abstract: 391,652. Setting rivets &c. MARCHANT, L. L., 1838, Markese Avenue, Lincoln Park, Michigan, U.S.A. July 20, 1932, No. 20474. [Class 43.] A punching and riveting machine has a fixed anvil 15 through which a punch 16 is projected. A shoe 25, carrying a punch die 26, is pivoted on a pin 30 to a bar 31. Rivets are fed by known means to rivet-holding spring fingers 42 which position hollow rivets between a rivet set 47 and the anvil 15. In punching, the work-piece is held on the anvil 15 and a pedal 20 is depressed. A bell crank 27 swings the shoe to bring the die 26 in line with the punch and then lowers the bar 31 and the shoe to clamp the work-piece. An abutment 24 rocks an arm 23 to throw in a clutch 14 allowing an electromotor 5 to operate a bell crank 19 to advance the punch 18. After punching the pedal 20 is released to restore the parts but the punch is held in the hole by friction. In riveting, depression of a pedal 51 throws in a clutch 9 and the motor oscillates a lever 50 to depress a member carrying the rivet set 47. The set forces the rivet down until a screw 55 stops the descent of spring fingers and the rivet is forced from the fingers into the hole driving the outwoods. The end of the rivet is turned over by the anvil 15.

公开(公告)号：WO2005066615A1

公开(公告)日：2005-07-21

申请号：PCT/US2004/041552

申请日：2004-12-09

Applicant: TOKYO ELECTRON LIMITED ,  TOKYO ELECTRON AMERICA, INC. ,  DIXON, David ,  LEE, Lloyd

Inventor： DIXON, David ,  LEE, Lloyd

IPC: G01N21/956

CPC classification number: G01N21/95607 ,  G01N21/278 ,  G01N21/93 ,  G01N21/9501 ,  G01N2021/8416 ,  G01N2201/0695 ,  G01N2201/12753

Abstract: An after develop inspection tool (108, 400) considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature (Figs. 2A-2B) as well as the slope of the individual RGB curves (202, 204, 206) for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer (402) is subsequently inspected at an ADI station (400) using a different lamp (406), the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp’s intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract translation: 开发检查工具（108,400）在确定检查中的晶片的置信度时，会考虑刀具对刀具的变异性。 使用金色晶片来计算RGB特征（图2A-2B）以及用于不同灯强度的各个RGB曲线（202,204,206）的斜率。 这些斜率被归一化以便在签名中产生红色值和蓝色值的补偿因子。 当使用不同的灯（406）随后在ADI站（400）检查晶片（402）时，可能以不同的灯强度捕获测试晶片RGB特征。 因此，当比较签名时，基于不同的灯的强度设置，通过补偿因子来调整金色晶片RGB签名，然后使用该调整的RGB签名来确定在测试晶片上是否存在缺陷。

公开(公告)号：US2554747A

公开(公告)日：1951-05-29

申请号：US9479949

申请日：1949-05-23

Applicant: LEE LLOYD T

Inventor： LEE LLOYD T

IPC: B65D47/24

CPC classification number: B65D47/248