CERAMIC ELECTROSTATIC CHUCK AND METHOD OF FABRICATING SAME

    公开(公告)号:WO2003003449A3

    公开(公告)日:2003-01-09

    申请号:PCT/US2002/018093

    申请日:2002-06-10

    Abstract: A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity.

    INDUCTIVELY COUPLED PLASMA CONTROL WITH EXTERNAL MAGNETIC MATERIAL
    2.
    发明申请
    INDUCTIVELY COUPLED PLASMA CONTROL WITH EXTERNAL MAGNETIC MATERIAL 审中-公开
    用外部磁性材料进行电感耦合等离子体控制

    公开(公告)号:WO2002084700A1

    公开(公告)日:2002-10-24

    申请号:PCT/US2002/010547

    申请日:2002-04-02

    CPC classification number: H01J37/321

    Abstract: A plasma reactor for processing a substrate in a plasma has a dielectric window disposed in a wall of a chamber. An RF antenna coil (402) is disposed outside of the chamber and adjacent to the window. A magnetic core (420) is disposed outside of the chamber and adjacent to the coil. The magnetic core comprises a material having a magnetic dipole moment in a range of about 10μ to about 1000μ. The magnetic core comprises a ferrite material that surrounds at least a portion of the coil. The position of the magnetic core relative to the dielectric window can be adjusted.

    Abstract translation: 用于处理等离子体中的基板的等离子体反应器具有设置在室的壁中的电介质窗口。 RF天线线圈(402)设置在腔室的外部并与窗口相邻。 磁芯(420)设置在腔室的外部并且与线圈相邻。 磁芯包括具有约10至约1000微米范围内的磁偶极矩的材料。 磁芯包括围绕线圈的至少一部分的铁氧体材料。 可以调节磁芯相对于电介质窗口的位置。

    CERAMIC ELECTROSTATIC CHUCK ASSEMBLY AND METHOD OF MAKING
    3.
    发明申请
    CERAMIC ELECTROSTATIC CHUCK ASSEMBLY AND METHOD OF MAKING 审中-公开
    陶瓷静电块组件及其制造方法

    公开(公告)号:WO03003449A2

    公开(公告)日:2003-01-09

    申请号:PCT/US0218093

    申请日:2002-06-10

    CPC classification number: H01L21/6833

    Abstract: A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity. Another ESC includes an insulating or semi-conducting body and a clamping electrode having a high resistivity and or a high lateral impedance. The electrostatic chucking device provides improved RF coupling uniformity when RF energy is coupled thorough the clamping electrode from an underlying RF electrode. The RF electrode can be a separate baseplate or it can be a part of the chuck. The ESC's may be used to support semiconductor substrates such as semiconductor wafers in plasma processing equipment.

    Abstract translation: 一种烧结陶瓷静电夹持装置(ESC),其包括嵌入在陶瓷体中的图案化静电夹持电极,其中所述夹持电极包括布置成精细图案的至少一个烧结导电材料条。 由于所使用的电极图案的细度,ESC制造期间引起的应力减小,使得夹紧电极在烧结操作之后保持基本平坦。 所得的ESC允许改进的夹紧均匀性。 另一个ESC包括绝缘或半导电体和具有高电阻率或高横向阻抗的夹持电极。 当RF能量通过来自底层RF电极的钳位电极耦合时,静电夹持装置提供改进的RF耦合均匀性。 RF电极可以是单独的基板,也可以是卡盘的一部分。 ESC可用于支持诸如等离子体处理设备中的半导体晶片的半导体衬底。

    INDUCTIVELY COUPLED PLASMA ETCHING APPARATUS
    4.
    发明申请
    INDUCTIVELY COUPLED PLASMA ETCHING APPARATUS 审中-公开
    电感耦合等离子体蚀刻装置

    公开(公告)号:WO0175931A3

    公开(公告)日:2002-03-21

    申请号:PCT/US0110335

    申请日:2001-03-28

    Inventor: NAKAJIMA SHU

    CPC classification number: H01J37/321

    Abstract: An inductively coupled plasma etching apparatus includes a chamber (100) for generating a plasma therein. The chamber (100) is defined by walls of a housing. A coil (313) for receiving high frequency (RF) power is disposed adjacent to and outside of one of the walls (101) of the housing. A metal plate (217) is disposed adjacent to and outside of the wall (101) of the housing that the coil (313) is disposed adjacent to. The metal plate (217) is positioned in a spaced apart relationship between the coil (313) and the wall (101) of the housing and has radial slits formed therein that extend transversely to the coil (313). A connector (207) electrically connects the metal plate (217) to the coil (313). A method for controlling an inner surface of a wall defining a chamber in which a plasma is generated is also described.

    Abstract translation: 电感耦合等离子体蚀刻装置包括用于在其中产生等离子体的腔室(100)。 腔室(100)由壳体的壁限定。 用于接收高频(RF)功率的线圈(313)设置在壳体的一个壁(101)的外侧。 金属板(217)被布置成与壳体的壁(101)相邻并且位于外侧,线圈(313)邻近设置。 金属板(217)以线圈(313)和壳体的壁(101)之间的间隔开的关系定位,并且在其中形成有横向于线圈(313)延伸的径向狭缝。 连接器(207)将金属板(217)电连接到线圈(313)。 还描述了一种用于控制限定其中产生等离子体的室的壁的内表面的方法。

    APPARATUS AND METHODS FOR ACTIVELY CONTROLLING RF PEAK-TO-PEAK VOLTAGE IN AN INDUCTIVELY COUPLED PLASMA ETCHING SYSTEM
    5.
    发明申请
    APPARATUS AND METHODS FOR ACTIVELY CONTROLLING RF PEAK-TO-PEAK VOLTAGE IN AN INDUCTIVELY COUPLED PLASMA ETCHING SYSTEM 审中-公开
    用于在感应耦合等离子体蚀刻系统中动态控制RF峰值电压的装置和方法

    公开(公告)号:WO0175930A3

    公开(公告)日:2002-05-23

    申请号:PCT/US0110183

    申请日:2001-03-28

    Inventor: NAKAJIMA SHU

    CPC classification number: H01J37/321

    Abstract: An inductively coupled plasma etching apparatus includes a chamber (100) and a window (10) for sealing a top opening of the chamber. The window (10) has an inner surface that is exposed to an internal region of the chamber (100). A metal plate (217), which acts as a Faraday shield, is disposed above and spaced apart from the window (10). A coil (117) is disposed above and spaced apart from the metal plate (217). The coil (117) is conductively connected to the metal plate (217) at a connection location (see connector 207) that is configured to generate a peak-to-peak voltage on the metal plate that optimally reduces sputtering of the inner surface of the window (10) while substantially simultaneously preventing deposition of etch byproducts on the inner surface of the window. In another embodiment, the apparatus includes a controller for externally applying a peak-to-peak voltage to the metal plate (217). The controller includes an oscillation circuit, a matching circuit, an RF generator, and a feedback control for monitoring the applied peak-to-peak voltage. Methods for optimizing operation of an inductively coupled plasma etching apparatus also are described.

    Abstract translation: 电感耦合等离子体蚀刻装置包括用于密封腔室顶部开口的腔室(100)和窗口(10)。 窗口(10)具有暴露于室(100)的内部区域的内表面。 用作法拉第屏蔽的金属板(217)设置在窗口(10)的上方并与之隔开。 线圈(117)设置在金属板(217)的上方并与金属板间隔开。 线圈(117)在被配置为在金属板上产生峰峰值电压的连接位置(见连接器207)处导电连接到金属板(217),其最佳地减小了金属板的内表面的溅射 窗口(10),同时基本上同时防止蚀刻副产物沉积在窗的内表面上。 在另一实施例中,该装置包括用于向金属板(217)外部施加峰 - 峰电压的控制器。 控制器包括振荡电路,匹配电路,RF发生器和用于监视施加的峰 - 峰电压的反馈控制。 还描述了用于优化电感耦合等离子体蚀刻装置的操作的方法。

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