Abstract:
A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity.
Abstract:
A plasma reactor for processing a substrate in a plasma has a dielectric window disposed in a wall of a chamber. An RF antenna coil (402) is disposed outside of the chamber and adjacent to the window. A magnetic core (420) is disposed outside of the chamber and adjacent to the coil. The magnetic core comprises a material having a magnetic dipole moment in a range of about 10μ to about 1000μ. The magnetic core comprises a ferrite material that surrounds at least a portion of the coil. The position of the magnetic core relative to the dielectric window can be adjusted.
Abstract:
A sintered ceramic electrostatic chucking device (ESC) which includes a patterned electrostatic clamping electrode embedded in a ceramic body wherein the clamping electrode includes at least one strip of a sintered electrically conductive material arranged in a fine pattern. Due to the fineness of the electrode pattern employed, stresses induced during manufacture of the ESC are reduced such that the clamping electrode remains substantially planar after the sintering operation. The resulting ESC allows for improved clamping uniformity. Another ESC includes an insulating or semi-conducting body and a clamping electrode having a high resistivity and or a high lateral impedance. The electrostatic chucking device provides improved RF coupling uniformity when RF energy is coupled thorough the clamping electrode from an underlying RF electrode. The RF electrode can be a separate baseplate or it can be a part of the chuck. The ESC's may be used to support semiconductor substrates such as semiconductor wafers in plasma processing equipment.
Abstract:
An inductively coupled plasma etching apparatus includes a chamber (100) for generating a plasma therein. The chamber (100) is defined by walls of a housing. A coil (313) for receiving high frequency (RF) power is disposed adjacent to and outside of one of the walls (101) of the housing. A metal plate (217) is disposed adjacent to and outside of the wall (101) of the housing that the coil (313) is disposed adjacent to. The metal plate (217) is positioned in a spaced apart relationship between the coil (313) and the wall (101) of the housing and has radial slits formed therein that extend transversely to the coil (313). A connector (207) electrically connects the metal plate (217) to the coil (313). A method for controlling an inner surface of a wall defining a chamber in which a plasma is generated is also described.
Abstract:
An inductively coupled plasma etching apparatus includes a chamber (100) and a window (10) for sealing a top opening of the chamber. The window (10) has an inner surface that is exposed to an internal region of the chamber (100). A metal plate (217), which acts as a Faraday shield, is disposed above and spaced apart from the window (10). A coil (117) is disposed above and spaced apart from the metal plate (217). The coil (117) is conductively connected to the metal plate (217) at a connection location (see connector 207) that is configured to generate a peak-to-peak voltage on the metal plate that optimally reduces sputtering of the inner surface of the window (10) while substantially simultaneously preventing deposition of etch byproducts on the inner surface of the window. In another embodiment, the apparatus includes a controller for externally applying a peak-to-peak voltage to the metal plate (217). The controller includes an oscillation circuit, a matching circuit, an RF generator, and a feedback control for monitoring the applied peak-to-peak voltage. Methods for optimizing operation of an inductively coupled plasma etching apparatus also are described.