METHOD
    2.
    发明申请
    METHOD 审中-公开
    方法

    公开(公告)号:WO2012066506A2

    公开(公告)日:2012-05-24

    申请号:PCT/IB2011/055175

    申请日:2011-11-18

    Abstract: The present invention relates to a method for fabricating a microneedle which comprises the steps of spraying a composition into a mould, drying the composition and removal of the dried composition from the mould, thereby forming a microneedle that, when applied to the skin of a subject, pierces the stratum corneum to access the underlying tissue of the subject. The present invention also relates to a method for coating a microneedle which comprises the steps of spraying a composition onto a microneedle and drying the composition at an ambient temperature, thereby forming a coated microneedle that, when applied to the skin of a subject, pierces the stratum corneum to deliver the sprayed material to the underlying tissue of the subject

    Abstract translation: 本发明涉及一种制造微针的方法,包括以下步骤:将组合物喷雾到模具中,干燥组合物并从模具中除去干燥的组合物,从而形成微针,当被施用于受试者的皮肤时 刺穿角质层以进入受试者的下方组织。 本发明还涉及一种用于涂覆微针的方法,其包括以下步骤:将组合物喷雾到微针上并在环境温度下干燥组合物,从而形成涂覆的微针,当被施用于受试者的皮肤时,刺穿 角质层以将喷射的材料输送到受试者的潜在组织

    METHOD OF PRODUCING MICRONEEDLES
    3.
    发明申请
    METHOD OF PRODUCING MICRONEEDLES 审中-公开
    微胶囊的生产方法

    公开(公告)号:WO2011015650A2

    公开(公告)日:2011-02-10

    申请号:PCT/EP2010/061477

    申请日:2010-08-06

    Abstract: A method of forming a microneedle device comprises the steps of coating the front and back surfaces of a substrate with a protective masking material, patterning the protective masking material to form a protective mask on the front surface of the substrate and an opening in the protective masking material on the back surface of the substrate, and simultaneously wet-etching both front and back surfaces of the substrate to provide a generally conical microneedle on the front surface of the substrate and a generally conical pit on the back surface of the substrate. The dimensions and location of the protective mask and opening are chosen so that the pyramidal pit extends from the back surface to intersect the front surface of the substrate, generally on, or adjacent to, a surface of the conical microneedle. Thus, a through-hole is formed in the substrate providing fluid communication from a rear of the substrate to a location on the front surface of the substrate, either on the microneedle surface or adjacent to a base of the microneedle.

    Abstract translation: 一种形成微针装置的方法包括以下步骤:用保护性掩膜材料涂覆衬底的前表面和后表面,图案化保护性掩膜材料以在所述衬底的前表面上形成保护性掩膜 衬底和在衬底背面上的保护性掩模材料中的开口,同时湿法蚀刻衬底的前后表面以在衬底的前表面上提供大致圆锥形的微针,并且在衬底的前表面上提供大致圆锥形的凹坑 衬底的背面。 选择防护掩模和开口的尺寸和位置,使得金字塔形凹坑从后表面延伸以与基底的前表面相交,大体在圆锥形微针的表面上或与圆锥形微针的表面相邻。 因此,在基底中形成通孔,该通孔提供从基底后部到基底前表面上的位置的微通道表面上或邻近微针基部的流体连通。

    METHOD FOR FABRICATING A MICRONEEDLE
    4.
    发明申请
    METHOD FOR FABRICATING A MICRONEEDLE 审中-公开
    一种制作麦克风的方法

    公开(公告)号:WO2012066506A3

    公开(公告)日:2012-08-23

    申请号:PCT/IB2011055175

    申请日:2011-11-18

    Abstract: The present invention relates to a method for fabricating a microneedle which comprises the steps of spraying a composition into a mould, drying the composition and removal of the dried composition from the mould, thereby forming a microneedle that, when applied to the skin of a subject, pierces the stratum corneum to access the underlying tissue of the subject. The present invention also relates to a method for coating a microneedle which comprises the steps of spraying a composition onto a microneedle and drying the composition at an ambient temperature, thereby forming a coated microneedle that, when applied to the skin of a subject, pierces the stratum corneum to deliver the sprayed material to the underlying tissue of the subject.

    Abstract translation: 本发明涉及一种制造微针的方法,包括以下步骤:将组合物喷雾到模具中,干燥组合物并从模具中除去干燥的组合物,从而形成微针,当被施用于受试者的皮肤时 刺穿角质层以进入受试者的下方组织。 本发明还涉及一种用于涂覆微针的方法,其包括以下步骤:将组合物喷雾到微针上并在环境温度下干燥组合物,从而形成涂覆的微针,当被施用于受试者的皮肤时,刺穿 角质层以将喷射的材料输送到受试者的潜在组织。

    PACKAGING OF MICRO DEVICES
    5.
    发明申请
    PACKAGING OF MICRO DEVICES 审中-公开
    微型器件的封装

    公开(公告)号:WO2006077565A1

    公开(公告)日:2006-07-27

    申请号:PCT/IE2006/000004

    申请日:2006-01-24

    CPC classification number: B81C1/00293 B81C2203/0136 B81C2203/0145

    Abstract: A silicon wafer is used as a substrate (1). A thin layer of metal is deposited and etched to form device metallisation (3), including electrodes and bondpads. A passivation layer (4) of silicon nitride is patterned to open access points to the metal. A lower sacrificial layer (5) is formed from polyimide and is patterned (at 5(a) and 5(b)) to open anchor regions for a device and for bridges that will define lateral etch channels for package evacuation. Structural materials that form a MEMS device (6) and bridges (13) are then deposited and patterned. The bridges (13) are patterned simultaneously with the device 6 on the lower sacrificial layer (5). .An upper sacrificial layer (7) is then deposited over the device (6) and the lower sacrificial layer (5) and is patterned to open anchor regions (8) for an encapsulation layer (10). Both sacrificial layers are then simultaneously removed in an oxygen plasma ash through lateral etc channels (15). This step leaves a hollow and empty shell, inside which the MEMS device (6) is present. The device (6) is free to move after sacrificial layer removal and has clearance both above and below. The etch channels (15) are sealed by a sealant (40) applied over the encapsulant layer

    Abstract translation: 硅晶片用作基板(1)。 沉积并蚀刻薄层金属以形成器件金属化(3),包括电极和粘结垫。 将氮化硅钝化层(4)图案化以打开到金属的接入点。 下部牺牲层(5)由聚酰亚胺形成,并被图案化(在5(a)和5(b))处,以打开用于器件的锚定区域,以及将限定用于封装排空的横向蚀刻通道的桥。 然后,形成MEMS器件(6)和桥(13)的结构材料被沉积和图案化。 桥(13)与下牺牲层(5)上的装置6同时图案化。 然后将上部牺牲层(7)沉积在器件(6)和下部牺牲层(5)上,并被图案化以打开用于封装层(10)的锚定区域(8)。 然后通过侧面等通道(15)在氧等离子体灰中同时去除两个牺牲层。 该步骤留下空心的空壳,其中存在MEMS装置(6)。 器件(6)在牺牲层去除之后自由移动并具有上下两个间隙。 蚀刻通道(15)由施加在密封剂层上的密封剂(40)密封

    METHOD OF PRODUCING MICRONEEDLES
    6.
    发明申请
    METHOD OF PRODUCING MICRONEEDLES 审中-公开
    生产麦克风的方法

    公开(公告)号:WO2011015650A3

    公开(公告)日:2011-10-27

    申请号:PCT/EP2010061477

    申请日:2010-08-06

    Abstract: A method of forming a microneedle device comprises the steps of coating the front and back surfaces of a substrate with a protective masking material, patterning the protective masking material to form a protective mask on the front surface of the substrate and an opening in the protective masking material on the back surface of the substrate, and simultaneously wet-etching both front and back surfaces of the substrate to provide a generally conical microneedle on the front surface of the substrate and a generally conical pit on the back surface of the substrate. The dimensions and location of the protective mask and opening are chosen so that the pyramidal pit extends from the back surface to intersect the front surface of the substrate, generally on, or adjacent to, a surface of the conical microneedle. Thus, a through-hole is formed in the substrate providing fluid communication from a rear of the substrate to a location on the front surface of the substrate, either on the microneedle surface or adjacent to a base of the microneedle.

    Abstract translation: 形成微针装置的方法包括以下步骤:用保护性掩蔽材料涂覆基材的前表面和后表面,图案化保护性掩模材料以在基材的前表面上形成保护掩模,并在保护掩模中形成开口 材料,同时湿式蚀刻基板的前表面和后表面,以在基板的前表面上提供大致圆锥形的微针,并且在基板的背面上具有大致圆锥形的凹坑。 选择保护面罩和开口的尺寸和位置,使得金字塔形凹坑从背面延伸以与基底的前表面相交,通常在锥形微针的表面上或邻近圆锥形微针的表面。 因此,在基板中形成通孔,该基板提供从基板的后部到基板的前表面上的位置(在微针表面上或邻近微针的基部)的流体连通。

    MICROELECTROMECHANICAL SYSTEM TUNABLE CAPACITOR
    7.
    发明申请
    MICROELECTROMECHANICAL SYSTEM TUNABLE CAPACITOR 审中-公开
    微电子系统电容器

    公开(公告)号:WO2009092605A1

    公开(公告)日:2009-07-30

    申请号:PCT/EP2009/000442

    申请日:2009-01-23

    CPC classification number: H01G5/16 H01G5/38 H01H59/0009

    Abstract: The present invention provides a new type of microelectromechanical capacitor, that allows ' a first selective deflection of a movable capacitance electrode to form an arched shape over a fixed capacitance electrode upon the application of an electrostatic force between the movable capacitance electrode and fixed bias electrodes, and a second deflection of the arched movable capacitance electrode upon the application of a second electrostatic force between the movable capacitance electrode and fixed capacitance electrode; such that said first and second deflections control and/or tune the capacitance of said capacitor. By providing the first and second deflections of the movable capacitance electrode allows that (a) the capacitor is continuously tunable and (b) provides a high accurate tuning range. The first and second deflections are used to modify the capacitance between the movable capacitance electrode and fixed capacitance electrode(s). The tunable capacitor of the present invention can be used to optimise the operation of a radio-frequency circuit at multiple frequencies and power levels.

    Abstract translation: 本发明提供了一种新型的微机电电容器,其允许在可动电容电极和固定偏置电极之间施加静电力时,可动电容电极的第一选择性偏转在固定电容电极上形成拱形, 以及在可动电容电极和固定电容电极之间施加第二静电力时的拱形可动电容电极的第二偏转; 使得所述第一和第二偏转控制和/或调谐所述电容器的电容。 通过提供可移动电容电极的第一和第二偏转允许(a)电容器是连续可调的,并且(b)提供高精度的调谐范围。 第一和第二偏转用于修改可移动电容电极和固定电容电极之间的电容。 本发明的可调电容器可以用于在多个频率和功率水平下优化射频电路的操作。

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