公开(公告)号：WO2004072998A3

公开(公告)日：2004-08-26

申请号：PCT/US2004/003763

申请日：2004-02-10

Applicant: KEMET ELECTRONICS CORPORATION ,  MELODY, Brian, John ,  KINARD, John, Tony ,  PERSICO, Daniel, F. ,  STOLARSKI, Chris ,  LESSNER, Phillip, Michael ,  CHEN, Qingping ,  PRITCHARD, Kim ,  HARRINGTON, Albert, Kennedy ,  WHEELER, David, Alexander

Inventor： MELODY, Brian, John ,  KINARD, John, Tony ,  PERSICO, Daniel, F. ,  STOLARSKI, Chris ,  LESSNER, Phillip, Michael ,  CHEN, Qingping ,  PRITCHARD, Kim ,  HARRINGTON, Albert, Kennedy ,  WHEELER, David, Alexander

IPC: H01G9/012

Abstract: A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).

公开(公告)号：WO2004072998A2

公开(公告)日：2004-08-26

申请号：PCT/US2004003763

申请日：2004-02-10

Applicant: KEMET ELECTRONICS CORP ,  MELODY BRIAN JOHN ,  KINARD JOHN TONY ,  PERSICO DANIEL F ,  STOLARSKI CHRIS ,  LESSNER PHILLIP MICHAEL ,  CHEN QINGPING ,  PRITCHARD KIM ,  HARRINGTON ALBERT KENNEDY ,  WHEELER DAVID ALEXANDER

Inventor： MELODY BRIAN JOHN ,  KINARD JOHN TONY ,  PERSICO DANIEL F ,  STOLARSKI CHRIS ,  LESSNER PHILLIP MICHAEL ,  CHEN QINGPING ,  PRITCHARD KIM ,  HARRINGTON ALBERT KENNEDY ,  WHEELER DAVID ALEXANDER

IPC: H01G9/00 ,  H01G9/012 ,  H01L23/495 ,  H01G

CPC classification number: H01G9/012 ,  H01L23/49586 ,  H01L2224/32245 ,  Y10T29/417

Abstract: A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).

Abstract translation: 一种通过将热可固化预涂树脂（48）施加到电容器（40）的端子（41,43）的一部分并封装电容器元件（40）的方法来保护表面贴装电容器（40）免受湿气和氧气腐蚀 s）（42）与保护树脂（46）。 预涂树脂（48）在环境温度下基本上是刚性的，并且在高温下是柔性的，并且优选是含内酯的环氧树脂。 在将电容器元件（42）与保护树脂（42）封装之前，可以通过刷子或擦拭器将预涂树脂（48）施加到端子（41,43）的无焊料部分（50） 46）。