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公开(公告)号：WO2008109283A1
公开(公告)日：2008-09-12
申请号：PCT/US2008/054906
申请日：2008-02-25
Applicant: KEMET ELECTRONICS CORPORATION , MOTOROLA, INC. , PRYMAK, John, D. , STOLARSKI, Chris , JACOBS, David , WAYNE, Chris , LESSNER, Philip , KINARD, John, T. , MELODY, Alethia , DUNN, Gregory , CROSWELL, Robert, T. , CHELINI, Remy, J.
Inventor： PRYMAK, John, D. , STOLARSKI, Chris , JACOBS, David , WAYNE, Chris , LESSNER, Philip , KINARD, John, T. , MELODY, Alethia , DUNN, Gregory , CROSWELL, Robert, T. , CHELINI, Remy, J.
CPC classification number: H01G9/0029 , H01G9/012 , H01G9/0425 , H01G9/055 , H01G9/15 , H05K1/185 , Y10T29/417
Abstract: An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.
Abstract translation: 一种形成电容器的改进方法。 该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。
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公开(公告)号：WO2011087870A3
公开(公告)日：2011-07-21
申请号：PCT/US2010/061931
申请日：2010-12-22
Applicant: KEMET ELECTRONICS CORPORATION , SUMMEY, Brandon , POLTORAK, Jeffrey , LESSNER, Phillip, M. , QIU, Yongjian , HAHN, Randolph, S. , JACOBS, David , BRENNEMAN, Keith, R. , HARRINGTON, Albert , STOLARSKI, Chris
Inventor： SUMMEY, Brandon , POLTORAK, Jeffrey , LESSNER, Phillip, M. , QIU, Yongjian , HAHN, Randolph, S. , JACOBS, David , BRENNEMAN, Keith, R. , HARRINGTON, Albert , STOLARSKI, Chris
Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
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Patent Agency Ranking
公开(公告)号：WO2011087870A2
公开(公告)日：2011-07-21
申请号：PCT/US2010061931
申请日：2010-12-22
Applicant: KEMET ELECTRONICS CORP , SUMMEY BRANDON , POLTORAK JEFFREY , LESSNER PHILLIP M , QIU YONGJIAN , HAHN RANDOLPH S , JACOBS DAVID , BRENNEMAN KEITH R , HARRINGTON ALBERT , STOLARSKI CHRIS
Inventor： SUMMEY BRANDON , POLTORAK JEFFREY , LESSNER PHILLIP M , QIU YONGJIAN , HAHN RANDOLPH S , JACOBS DAVID , BRENNEMAN KEITH R , HARRINGTON ALBERT , STOLARSKI CHRIS
CPC classification number: H01G9/15 , H01G9/0029 , H01G9/012 , H01G9/048 , Y10T29/41 , Y10T29/417 , Y10T29/43
Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
Abstract translation: 描述了改进的固体电解电容器和形成固体电解电容器的方法。 该方法包括形成包括阀金属或阀金属的导电氧化物的阳极，其中阳极引线延伸部从阳极伸出。 在阳极上形成电介质，在电介质上形成阴极层。 阳极，电介质和阴极层被封装在非导电材料中，并且阳极引线延伸部暴露在外壳的外侧的侧表面处。 导电金属层粘附到阳极引线延伸部，其优选地通过将预制的固体金属端子，最优选地L形端子电连接到侧表面处的导电金属层来终止。
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公开(公告)号：WO2010014580A3
公开(公告)日：2010-04-15
申请号：PCT/US2009051919
申请日：2009-07-28
Applicant: KEMET ELECTRONICS CORP , MOTOROLA INC , PRYMAK JOHN D , STOLARSKI CHRIS , MELODY ALETHIA , CHACKO ANTONY P , DUNN GREGORY J
Inventor： PRYMAK JOHN D , STOLARSKI CHRIS , MELODY ALETHIA , CHACKO ANTONY P , DUNN GREGORY J
CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
Abstract translation: 一种用于形成具有电容的层压体的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电耦合，并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号：WO2010014580A2
公开(公告)日：2010-02-04
申请号：PCT/US2009/051919
申请日：2009-07-28
Applicant: KEMET ELECTRONICS CORPORATION , MOTOROLA, INC. , PRYMAK, John, D. , STOLARSKI, Chris , MELODY, Alethia , CHACKO, Antony, P. , DUNN, Gregory, J.
Inventor： PRYMAK, John, D. , STOLARSKI, Chris , MELODY, Alethia , CHACKO, Antony, P. , DUNN, Gregory, J.
CPC classification number: H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
Abstract: A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
Abstract translation: 用于形成具有电容的层压体的方法和由此形成的层压体。 该方法包括提供衬底和在衬底上层压导电箔的步骤，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与附加的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电偶，并且在导电箔和阳极迹线之间形成阳极导电偶。
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公开(公告)号：WO2004072998A3
公开(公告)日：2004-08-26
申请号：PCT/US2004/003763
申请日：2004-02-10
Applicant: KEMET ELECTRONICS CORPORATION , MELODY, Brian, John , KINARD, John, Tony , PERSICO, Daniel, F. , STOLARSKI, Chris , LESSNER, Phillip, Michael , CHEN, Qingping , PRITCHARD, Kim , HARRINGTON, Albert, Kennedy , WHEELER, David, Alexander
Inventor： MELODY, Brian, John , KINARD, John, Tony , PERSICO, Daniel, F. , STOLARSKI, Chris , LESSNER, Phillip, Michael , CHEN, Qingping , PRITCHARD, Kim , HARRINGTON, Albert, Kennedy , WHEELER, David, Alexander
IPC: H01G9/012
Abstract: A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).
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公开(公告)号：WO2004072998A2
公开(公告)日：2004-08-26
申请号：PCT/US2004003763
申请日：2004-02-10
Applicant: KEMET ELECTRONICS CORP , MELODY BRIAN JOHN , KINARD JOHN TONY , PERSICO DANIEL F , STOLARSKI CHRIS , LESSNER PHILLIP MICHAEL , CHEN QINGPING , PRITCHARD KIM , HARRINGTON ALBERT KENNEDY , WHEELER DAVID ALEXANDER
Inventor： MELODY BRIAN JOHN , KINARD JOHN TONY , PERSICO DANIEL F , STOLARSKI CHRIS , LESSNER PHILLIP MICHAEL , CHEN QINGPING , PRITCHARD KIM , HARRINGTON ALBERT KENNEDY , WHEELER DAVID ALEXANDER
IPC: H01G9/00 , H01G9/012 , H01L23/495 , H01G
CPC classification number: H01G9/012 , H01L23/49586 , H01L2224/32245 , Y10T29/417
Abstract: A method of protecting surface mount capacitors (40) from moisture and oxygen corrosion by applying a thermally curable pre-coat resin (48) to a portion of the terminals (41, 43) of a capacitor (40) and encapsulating the capacitor element(s) (42) with a protective resin (46). The pre-coat resin (48) is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin (48) may be applied to a solder coating-free portion (50) of the terminals (41, 43) by brush or wiper prior to encapsulating the capacitor element(s) (42) with the protective resin (46).
Abstract translation: 一种通过将热可固化预涂树脂（48）施加到电容器（40）的端子（41,43）的一部分并封装电容器元件（40）的方法来保护表面贴装电容器（40）免受湿气和氧气腐蚀 s）（42）与保护树脂（46）。 预涂树脂（48）在环境温度下基本上是刚性的，并且在高温下是柔性的，并且优选是含内酯的环氧树脂。 在将电容器元件（42）与保护树脂（42）封装之前，可以通过刷子或擦拭器将预涂树脂（48）施加到端子（41,43）的无焊料部分（50） 46）。
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