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公开(公告)号：US12015382B1
公开(公告)日：2024-06-18
申请号：US17517230
申请日：2021-11-02
Applicant: Scientific Components Corporation
Inventor： Fuad Haji Mokhtar , Norizwani Mohd Nazari
CPC classification number: H03F1/3205 , H03F3/193
Abstract: An apparatus and method for a linearized RF and microwave amplifier current source by feedback of a sampled RF amplifier output signal into a current mirror amplifier bias, to modulate the amplifier bias and produce an increase in a linearized amplifier output. The linearized RF and microwave amplifier is operable over a large bandwidth extending over multiple microwave frequency octaves.
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公开(公告)号：US20240178541A1
公开(公告)日：2024-05-30
申请号：US18519881
申请日：2023-11-27
Applicant: SCIENTIFIC COMPONENTS CORPORATION
Inventor： Yevhen Tymofieiev
CPC classification number: H01P5/16 , H01B3/445 , H01P3/06 , H01P11/005
Abstract: A high power electrical signal power combiner including coaxial and integrated waveguide structures, and including thermal stress relief elements and impedance transformation elements is designed and constructed.
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公开(公告)号：US11784146B1
公开(公告)日：2023-10-10
申请号：US17221983
申请日：2021-04-05
Applicant: Scientific Components Corporation
Inventor： Fuad Haji Mokhtar , Goh Chee Kheng , Khor Gang Quan , Alvin Yong Shee Meng
IPC: H01L23/66 , H01L23/00 , H01L23/498 , H01L21/48
CPC classification number: H01L23/66 , H01L21/4853 , H01L23/49838 , H01L24/48 , H01L2223/6611 , H01L2223/6683 , H01L2224/48227
Abstract: An apparatus and method for co-axial wire bonding to improve impedance and electrical package connection performance of a substrate attached to the interior of an electrical device package. One or more wire bonds making ground connections between a package and an internal electrical circuit substrate make a non-contact geometrical crossing over an active electrical signal wire.
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公开(公告)号：US11324111B1
公开(公告)日：2022-05-03
申请号：US17072871
申请日：2020-10-16
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman , Benjamin Kahtan , Behnam Tabrizi , Himat Hayer
Abstract: An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.
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公开(公告)号：US11430752B1
公开(公告)日：2022-08-30
申请号：US17112604
申请日：2020-12-04
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman
Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.
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Patent Agency Ranking
公开(公告)号：US09949361B1
公开(公告)日：2018-04-17
申请号：US15146577
申请日：2016-05-04
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman
CPC classification number: H01P5/085 , H01P5/028 , H01P5/10 , H05K1/0245 , H05K1/0251 , H05K2201/09609 , H05K2201/09618
Abstract: A balun device comprises an input microstrip, a first output microstrip, a second output microstrip, and a junction comprising a conductive termination of the input microstrip, the first output microstrip, and the second output microstrip, whereby an input signal provided to the input microstrip will propagate through the first output microstrip as a first output signal and through the second output microstrip as a second output signal, wherein the phase of the first output signal is identical to the phase of the input signal, and wherein the junction inverts the phase of the second output signal relative to the phase of the input signal and the first output signal.
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公开(公告)号：US09300022B2
公开(公告)日：2016-03-29
申请号：US14244997
申请日：2014-04-04
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman
Abstract: A planar balun comprises a balun input, a first balun output, a second balun output,two primary coupled lines with a first cross-sectional area disposed on an inhomogeneous medium, and two secondary coupled lines with a second cross-sectional area, the second coupled lines disposed on an inhomogeneous medium. Each of the primary coupled lines are coupled to one of the secondary coupled lines with a predetermined uniform surface space therebetween. The first cross-sectional area and the second cross-sectional area are unequal, thereby producing pairs of asymmetric coupled lines.
Abstract translation: 平面平衡 - 不平衡变压器包括平衡 - 不平衡转换器输入，第一平衡 - 不平衡变换器输出，第二平衡 - 不平衡变换器输出，具有设置在不均匀介质上的第一横截面积的两个主耦合线，以及具有第二横截面积的两个辅助耦合线， 设置在不均匀介质上的耦合线。 每个主耦合线路之间具有预定的均匀表面空间耦合到二次耦合线路之一。 第一横截面积和第二横截面面积不相等，从而产生成对的不对称耦合线。
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公开(公告)号：US11744057B1
公开(公告)日：2023-08-29
申请号：US17398901
申请日：2021-08-10
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman
CPC classification number: H05K9/0026 , H05K9/0018
Abstract: An apparatus and method for shielding for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port, and to increase isolation from other electrical signals external to the component or filter. Some embodiments include an interposer two-sided and plated through printed circuit board to provide a constant impedance transition from a surface-mount device input and output ports to corresponding input and output connection points of a circuit on a printed circuit board onto which the device is mounted, including a ground plane transition.
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公开(公告)号：US11638370B1
公开(公告)日：2023-04-25
申请号：US17072924
申请日：2020-10-16
Applicant: Scientific Components Corporation
Inventor： Aaron Vaisman
Abstract: An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.
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公开(公告)号：US11189902B1
公开(公告)日：2021-11-30
申请号：US17066908
申请日：2020-10-09
Inventor： Sahar Merhav , Amir Yerushalmy
Abstract: An apparatus and method for electrical power splitting with a reduced physical size by using reactive electrical components, producing an increase in signal isolation among output ports and a reduction in internal electrical losses, and operable over a large bandwidth extending from DC to microwave frequencies. Attenuators with capacitors in parallel are used inboard of each output port to achieve extended broadband operation. 2-way and N-way power splitters and corresponding power combiners are described.
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