公开(公告)号：EP4528793A1

公开(公告)日：2025-03-26

申请号：EP22942598.8

申请日：2022-05-16

Applicant: Shinkawa Ltd.

Inventor： FUKUMOTO, Shinsuke ,  NOMURA, Katsutoshi

IPC: H01L21/60 ,  H01L21/52

Abstract: A bonding apparatus 1 comprises: a bonding head 2 including a pressure tool PT that pressurizes an electronic component 9 and a heater 22 that heats the pressure tool PT, the pressure tool PT being configured so as to be detachable from the heater 22; a storage unit 5 that stores temperature control data indicating temporal changes in the set temperature of the heater 22; and a control unit 4 that controls the set temperature of the heater 22 on the basis of the temperature control data. The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component 9 to a substrate 8. The control unit 4 reads one of the one or more temperature control patterns according to the bonding conditions and controls the set temperature of the heater 22.

公开(公告)号：EP3633713A1

公开(公告)日：2020-04-08

申请号：EP18806139.4

申请日：2018-05-24

Applicant: Shinkawa Ltd. ,  Tohoku University

Inventor： EGUCHI, Yuji ,  SEYAMA, Kohei ,  NAKAMURA, Tomonori ,  KIKUCHI, Hiroshi ,  SHIMATSU, Takehito ,  UOMOTO, Miyuki

IPC: H01L21/52 ,  B23K20/00 ,  B23K20/24

Abstract: This method for producing a structure (1) wherein base materials (10, 20) are bonded by atomic diffusion comprises: a step for applying a liquid resin (11a) to the surface of the base material (10); a step for smoothing the surface of the liquid resin (11a) by means of the surface tension of the liquid resin (11a); a step for forming a resin layer (11) by curing the liquid resin (11a); a step for forming a metal thin film (12) on the surface of the resin layer (11); a step for forming a metal thin film (21) on the surface of the base material (20); and a step for bringing the metal thin film (12) of the base material (10) and the metal thin film (21) of the base material (20) into close contact with each other, thereby bonding the metal thin film (12) of the base material (10) and the metal thin film (21) of the base material (20) with each other by atomic diffusion. Consequently, the present invention enables bonding by means of atomic diffusion even in cases where the thin film formation surface of a member is not smooth.

公开(公告)号：EP4027119A1

公开(公告)日：2022-07-13

申请号：EP20861869.4

申请日：2020-09-03

Applicant: Shinkawa Ltd.

Inventor： KIRKBY, Michael ,  NAKANO, Shota ,  MUNAKATA, Hiroshi

IPC: G01H9/00

Abstract: A vibration detection system (100) that detects vibrations of an ultrasonic horn (12) and a capillary (13) having a non-mirror surface includes a laser light source (20) that irradiates the ultrasonic horn (12) and the capillary (13) with parallel laser light (21), a camera (30) that includes an imaging device (31) that captures an image of the ultrasonic horn (12) and the capillary (13) irradiated with the parallel laser light (21), and an image processing apparatus (40) that processes the image captured by the camera (30) and that displays a vibrating potion.

公开(公告)号：US20250088058A1

公开(公告)日：2025-03-13

申请号：US18729728

申请日：2023-01-13

Applicant: Proterial, Ltd. ,  Shinkawa Ltd.

Inventor： Osamu Kakutani ,  Seiki Takedomi ,  Tatsuya Nakano ,  Minoru Yoshida

IPC: H02K3/47 ,  H02K33/18

Abstract: A three-phase coil structure (30) having a two-phase coil set (32) including a plurality of rectangular air-core coils arranged side by side so as to be adjacent to each other in the same plane includes a one-phase coil set (31) including two air-core coils having different sizes and bending angles bent at both ends and disposed to straddle adjacent long sides of the two-phase coil set (32), wherein a number of turns of each of the air-core coils of the one-phase coil set (31) is larger than a number of turns of each of the air-core coils of the two-phase coil set (32).

公开(公告)号：US12191276B2

公开(公告)日：2025-01-07

申请号：US17642948

申请日：2020-07-16

Applicant: SHINKAWA LTD.

Inventor： Alexander Dzhangirov ,  Kohei Seyama

IPC: B32B41/00 ,  H01L23/00

Abstract: The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.

公开(公告)号：US12087725B2

公开(公告)日：2024-09-10

申请号：US17603584

申请日：2020-09-04

Applicant: SHINKAWA LTD.

Inventor： Toshihiko Toyama

IPC: B23K20/00 ,  H01L23/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  H01L2224/78001 ,  H01L2224/78353 ,  H01L2224/78621

Abstract: A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.

公开(公告)号：US20240162073A1

公开(公告)日：2024-05-16

申请号：US18015714

申请日：2021-11-16

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA

IPC: H01L21/68 ,  H01L21/67

CPC classification number: H01L21/681 ,  H01L21/67144 ,  H01L21/67248

Abstract: A mounting apparatus obtains calibration values for calibrating a difference between coordinate values based on top-view and bottom-view images, for each assumed placement height of a planned placement area of a mounting body. A calibration controller calculates calibration values based on the top-view and bottom-view images from a bottom-view imaging unit and top-view imaging units employing a Scheimpflug optical system by imaging a calibration index matching the placement height. A mounting controller adjusts a position of a mounting tool so that a planned contact surface of the mounting body is at the placement height to recognize a reference position based on the bottom-view image, and adjusts positions of the top-view imaging units so that the focal plane falls on the same plane as the placement height to recognize a target position based on the top-view images of the planned placement area and the calibration values corresponding to the placement height.

公开(公告)号：US20240063170A1

公开(公告)日：2024-02-22

申请号：US18269949

申请日：2020-12-28

Applicant: SHINKAWA LTD.

Inventor： Shinsuke FUKUMOTO

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/75502 ,  H01L2224/75983 ,  H01L2924/40

Abstract: A mounting head for bonding a chip to a bonding target includes: a mounting tool having a bottom surface which functions as a suction surface for sucking and holding the chip; a heater arranged on an upper surface of the mounting tool and heating the mounting tool; a cooling mechanism having a plurality of cooling channels which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater, and being capable of cooling the plurality of cooling areas independently of one another; and a controller controlling driving of the heater and the cooling mechanism. The controller independently controls a flow rate of the refrigerant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution during heating of the heater.

公开(公告)号：US20240055388A1

公开(公告)日：2024-02-15

申请号：US18037760

申请日：2021-06-22

Applicant: SHINKAWA LTD.

Inventor： Kiyotaka TANAKA

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/85 ,  H01L2224/85047 ,  H01L2224/85051 ,  H01L2224/78901

Abstract: A bump-forming device (1) includes a bonding tool (15) and a bonding controller (10). The bonding controller is configured to execute a crimping step (S14), a delivery step (S15), a pressing step (S16), and a cutting step (S17), and of the trajectories of the bonding tool (15), at least the trajectory in the delivery step (S15) is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool (15).

公开(公告)号：US20230274951A1

公开(公告)日：2023-08-31

申请号：US18015073

申请日：2020-08-05

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Alexander DZHANGIROV ,  Kohei SEYAMA

IPC: H01L21/603 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L21/603 ,  H01L21/52 ,  H01L24/08 ,  H01L24/24 ,  H01L24/73 ,  H01L2021/6015

Abstract: In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), and for heating and then cooling the thermocompression tool (16) to mount the semiconductor chip (100) on the substrate (104); and a separator for heating the thermocompression tool (16) after the semiconductor chip (100) has been mounted, and for raising a mounting head (17) to be separated from the cover film (110).