公开(公告)号：US20230274951A1

公开(公告)日：2023-08-31

申请号：US18015073

申请日：2020-08-05

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Alexander DZHANGIROV ,  Kohei SEYAMA

IPC: H01L21/603 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L21/603 ,  H01L21/52 ,  H01L24/08 ,  H01L24/24 ,  H01L24/73 ,  H01L2021/6015

Abstract: In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), and for heating and then cooling the thermocompression tool (16) to mount the semiconductor chip (100) on the substrate (104); and a separator for heating the thermocompression tool (16) after the semiconductor chip (100) has been mounted, and for raising a mounting head (17) to be separated from the cover film (110).

公开(公告)号：US20200251369A1

公开(公告)日：2020-08-06

申请号：US16632870

申请日：2018-07-12

Applicant: SHINKAWA LTD.

Inventor： Tetsuya UTANO ,  Yuichiro NOGUCHI ,  Kohei SEYAMA

IPC: H01L21/68 ,  H01L21/67 ,  B65G47/91

Abstract: This mounting device (100) comprises: a base (10) that moves linearly in relation to a substrate (16); a bonding head (20) that is attached to the base (10); a camera (25) that is attached to the base (10) and identifies the position of the substrate (16); a linear scale (33) having a plurality of graduations along the movement direction; a bonding head-side encoder head (31); and a camera-side encoder head (32). A control unit (50) causes the base (10) to move to a position where the bonding head-side encoder head (31) detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die (15) in relation to the substrate (16) is improved.

公开(公告)号：US20240120219A1

公开(公告)日：2024-04-11

申请号：US18275806

申请日：2021-02-05

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67144 ,  H01L21/67259 ,  H01L21/67294 ,  H01L21/68714

Abstract: A bonding apparatus includes: a movable bonding head part that holds a top camera and a bonding tool disposed at an offset distance from the top camera; a bottom camera capable of photographing the bonding head part; a reference member having a reference mark and fixed to a position that is at a predetermined distance from the bottom camera; and a calculation part that calculates a change amount in the offset distance based on the predetermined distance, a position of the reference mark detected by the top camera, and a position of a chip detected by the bottom camera, when the bonding head part moves such that the reference mark is positioned in the field of view of the top camera and the chip held by the bonding tool is positioned in the field of view of the bottom camera.

公开(公告)号：US20200279762A1

公开(公告)日：2020-09-03

申请号：US16650871

申请日：2018-08-28

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Tetsuya UTANO ,  Yuichiro NOGUCHI

IPC: H01L21/677 ,  H01L21/52

Abstract: The present invention is provided with: first and second bases, which are guided by a guide rail to thereby linearly move; a linear scale provided with graduations at predetermined pitches in the moving direction; and first and second encoder heads attached to the first and second bases. In the present invention, while maintaining, at a predetermined interval a, a distance between the first and second encoder heads, and moving the first and second bases along the guide rail, first and second graduation numbers, at which the first and second encoder heads are positioned, are sequentially detected from the first and second encoder heads, and the amount of movement of the first and second bases is controlled on the basis of the ratio between the predetermined interval a and the distance on the scale between the first graduation numbers and the second graduation numbers.

公开(公告)号：US20230197670A1

公开(公告)日：2023-06-22

申请号：US17925314

申请日：2021-05-11

Applicant: SHINKAWA LTD.

Inventor： ALEXANDER Dzhangirov ,  Yuichiro NOGUCHI

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75745 ,  H01L2924/40 ,  H01L2224/75983 ,  H01L2224/75702 ,  H01L2224/75701 ,  H01L2224/75985 ,  H01L2224/75303 ,  H01L2224/75804 ,  H01L2224/75841 ,  H01L2224/7592 ,  H01L24/16 ,  H01L2224/16221 ,  H01L2924/37001

Abstract: A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface having the substrate placed thereon; and a conforming jig which has a conforming surface onto which the chip holding surface is pressed, and in which the inclination of the conforming surface can be changed such that the inclination of the chip holding surface corresponds to the inclination indicated by the inclination information.

公开(公告)号：US20210005570A1

公开(公告)日：2021-01-07

申请号：US16464300

申请日：2017-11-29

Applicant: SHINKAWA LTD.

Inventor： Osamu WATANABE ,  Tomonori NAKAMURA ,  Toru MAEDA ,  Satoru NAGAI ,  Yuichiro NOGUCHI

IPC: H01L23/00 ,  H01L21/683

Abstract: [Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily.
[Solution] A bonding device 10 for thermally bonding an electronic component 100 to a substrate 110 or to another electronic component via an adhesive material 112, the bonding device being provided with: a bonding tool 40 comprising a bonding distal-end portion 42 which includes a bonding surface 44 and tapered side surfaces 46 formed in a tapering shape becoming narrower toward the bonding surface 44, the bonding surface 44 having a first suction hole 50 for suction-attaching the electronic component 100 via an individual piece of a porous sheet 130, the tapered side surfaces 46 having second suction holes 52, 54 for suction-attaching the porous sheet 130; and a bonding control unit 30 which controls the first suction hole 50 and the second suction holes 52, 54 independently from each other.

公开(公告)号：US20240318958A1

公开(公告)日：2024-09-26

申请号：US18278012

申请日：2021-02-22

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI

IPC: G01B21/24 ,  G01B21/08

CPC classification number: G01B21/24 ,  G01B21/08

Abstract: In this method for detecting a degree of parallelism of a mounting device: a triangular pin is arranged at a point A on a placement surface of a stage; a mounting head is lowered, and a height of the mounting head when a holding surface comes into contact with a tip end of the triangular pin is detected using an encoder, after which the triangular pin is moved to a point B and the mounting head is lowered; the height of the mounting head when the holding surface comes into contact with the tip end of the triangular pin is detected by the encoder; and the degree of parallelism between the placement surface of the stage and the holding surface of the mounting head is calculated on the basis of the detected heights at point A and point B.

公开(公告)号：US20220412733A1

公开(公告)日：2022-12-29

申请号：US17630515

申请日：2020-07-30

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Alexander DZHANGIROV

IPC: G01B21/22 ,  G01B21/08

Abstract: The present invention provides a mounting apparatus and a parallelism detection method in the mounting apparatus. The parallelism detection method in the mounting apparatus includes: a first height detection process of detecting first heights of a mounting tool when a holding surface comes into contact with the a tip of a triangular pin by placing the triangular pin on a placement surface of a stage and lowering the mounting tool; a second height detection process of detecting second heights of the mounting tool when the tip of the triangular pin comes into contact with the placement surface by holding the triangular pin on the holding surface of the mounting tool and lowering the mounting tool; and a parallelism calculation process of calculating the parallelism between the placement surface of the stage and the holding surface of the mounting tool based on the first heights and the second heights.

公开(公告)号：US20210242051A1

公开(公告)日：2021-08-05

申请号：US17050453

申请日：2019-01-21

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Katsutoshi NOMURA

IPC: H01L21/67 ,  H01L23/00

Abstract: A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.