Abstract:
In a pattern-lock system of particle-beam apparatus wherein the imaging of the pattern is done by means of at least two consecutive projector stages of the projecting system, reference marks are imaged upon registering means to determine the position of the particle-beam, at the location of an intermediary image of the reference marks produced by a non-final projector stage, with the registering means being positioned at locations of nominal positions of an intermediary imaging plane. Furthermore, to produce a scanning movement over the registering means the reference beamlets are shifted laterally by means of deflector means provided in the pattern defining means in dependence of a time-dependent electric voltage.
Abstract:
A particle-beam projection processing apparatus (100) for irradiating a target (41), with an illumination system (101) for forming a wide-area illuminating beam (Ip) of energetic electrically charged particles; a pattern definition means (102) for positioning an aperture pattern (21) in the path of the illuminating beam; and a projection system (103) for projecting the beam thus patterned (pb) onto a target (41) to be positioned after the projection system. A foil (34, 35) located across the path of the patterned beam (pb) is positioned between the pattern definition means (102) and the position of the target (41) at a location close to an image (i0) of the aperture pattern (21) formed by the projection system.
Abstract:
In a pattern-lock system of particle-beam, apparatus reference marks are imaged upon registering means to determine the position of the particle-beam, with the registering means being positioned at locations of nominal positions of images of the reference marks. Exposure pauses are used for applying a lateral movement of the reference beamlets by means of the projecting system and the resulting varying signals from the image detection are used to determine a suitable operation point. Then, the lateral movement is stopped to obtain a stable image position for the duration of an exposure.
Abstract:
A charged particle, in particular ion projector system, has a mask arranged in the path of the charged particle beam and provided with transparent spots, in particular openings, arranged asymmetrically to the optical axis, which are reproduced on a wafer by means of lenses arranged in the path of the charged particle beam. The charged particle beam has at least one cross-over (crosses the optical axis at least once) between the mask and the wafer. Charged particles with an opposite charge to the charge of the reproduction particles are supplied into the path of the reproduction charged particle beam in a defined area located between the mask and the wafer. The limits that define said area are selected in such a way that the absolute value of the integral effect of the space charge on the particles that reproduce the mask structures is as high upstream of said area (seen in the direction of radiation) as the absolute value of the integral effect of the space charge downstream of said area.
Abstract:
An ion beam apparatus is used to detect and repair under constant control the defects of a substrate. To that effect, the ion beam apparatus includes a mask (4) arranged in the path of the rays after the ion source (1) and presenting a perforation (5), preferably a round opening. A controllable lens (6) is provided between the ion source (1) and the mask (4) to modify the angle epsilon with which the ion beam leaves the ion source (Fig. 1)
Abstract:
A charged particle system comprises a particle source for generating a beam of charged particles and a particle-optical projection system. The particle-optical projection system comprises a focusing first magnetic lens (403) comprising an outer pole piece (411) having a radial inner end (411’), and an inner pole piece (412) having a lowermost end (412’) disposed closest to the radial inner end of the outer pole piece, a gap being formed by those; a focusing electrostatic lens (450) having at least a first electrode (451) and a second electrode (450) disposed in a region of the gap; and a controller (C ) configured to control a focusing power of the first electrostatic lens based on a signal indicative of a distance of a surface of a substrate from a portion of the first magnetic lens disposed closest to the substrate.
Abstract:
In a pattern-lock system of particle-beam apparatus, reference marks are imaged upon registering means to determine the position of the particle-beam. The registering means are positioned at locations of nominal positions at the imaging plane in order to detect the location of respective images of the reference marks. A registering means comprises a multitude of detective areas arranged beside each other; detection signals produced by the detective areas when bit by radiation from the reference mark are added to a sum signal, wherein the detective areas yield different contributions to the detection signal in relation to a unit of impingent radiation, respectively, resulting in a sum signal varying in dependence of the position of the reference mark image with respect to the detection means.
Abstract:
The present invention relates to a multi-beamlet multi- column particle-optical system comprising a plurality of columns which are disposed in an array for simultaneously exposing a substrate, each column having an optical axis and comprising: a beamlet generating arrangement comprising at least one multi-aperture plate for generating a pattern of multiple beamlets of charged particles, and an electrostatic lens arrangement comprising at least one electrode element; the at least one electrode element having an aperture defined by an inner peripheral edge facing the optical axis, the aperture having a center and a predetermined shape in a plane orthogonal to the optical axis; wherein in at least one of the plurality of columns, the predetermined shape of the aperture is a non- circular shape with at least one of a protrusion and an indentation from an ideal circle about the center of the aperture.
Abstract:
A beam manipulating arrangement for a multi beam application using charged particles comprises a multi-aperture plate having plural apertures traversed by beams of charged particles. A frame portion of the multi-aperture plate is heated to reduce temperature gradients within the multi-aperture plate. Further, a heat emissivity of a surface of the multi-aperture plate may be higher in some regions as compared to other regions in view of also reducing temperature gradients.
Abstract:
A particle-beam projection processing apparatus (100) for irradiating a target (41), with an illumination system (101) for forming a wide-area illuminating beam (Ip) of energetic electrically charged particles; a pattern definition means (102) for positioning an aperture pattern (21) in the path of the illuminating beam; and a projection system (103) for projecting the beam thus patterned (pb) onto a target (41) to be positioned after the projection system. A foil (34, 35) located across the path of the patterned beam (pb) is positioned between the pattern definition means (102) and the position of the target (41) at a location close to an image (i0) of the aperture pattern (21) formed by the projection system.