Abstract:
This invention is directed to a tie-down device for use with small trucks such as pickup trucks having sides. The sides comprise an exterior wall and an interior wall. There is positioned between the exterior wall and the interior wall an elongated member such as a rod or a tube. There is positioned on the elongated member a clamp having an eye bolt. A cargo box or cargo may be positioned on the bed of the pickup truck. A stretchable elastic tie-down device having a hook on each end may be stretched over the cargo box and attached to the eye bolt on one side of the pickup truck and to an eye bolt on the other side of the pickup truck to hold the cargo box in position.
Abstract:
A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.
Abstract:
A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
Abstract:
In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.
Abstract:
A computer security system and method using selective permission or denial of requests to create or modify program files to prevent introduction of malware onto a protected computer system. The selective permission or denial of requests is based on comparison of information regarding the requested action and a list of rules.
Abstract:
A measuring device for measuring spectral reflectance characteristics of an area of material comprises illumination means (44, 46) arranged to illuminate an area of material. The measuring device also comprises a hollow integrating sphere (24) which has a sample port (26) arranged to allow light reflected from the area of material to enter the sphere (24). A light collection means (32, 34) is arranged to collect reflected light from the integrating sphere (24). A housing (12) is arranged to house both the illumination means (44, 46) and the integrating sphere (24).
Abstract:
A solar panel overlay (110, 310) for mounting on an underlying roof deck comprises a substrate (180) and at least one row (120) of photovoltaic cells (122) on the substrate. The photovoltaic cells define a solar collecting surface (112) having an appearance mimicking that of the underlying roof deck. A solar panel overlay assembly (250, 260, 350) comprising a plurality of interconnected solar panel overlays is also provided.
Abstract:
The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.