公开(公告)号：WO2008083250A2

公开(公告)日：2008-07-10

申请号：PCT/US2007/088992

申请日：2007-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  STIBOREK, Leon

Inventor： STIBOREK, Leon

IPC: H05K1/00 ,  H01L21/58 ,  H05K7/00

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/0219 ,  H05K3/4015 ,  H05K2201/09809 ,  H05K2201/10946 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A contact grid array interconnect (100) element for mounting an IC package (130) to a substrate. The interconnect comprises an insulating stand-off post (110) having opposing ends. An electrically conductive core (105) is embedded in and traverses the post. Conductive endplates (125, 127) are located on the opposing ends (117, 120) of the post and contact the core.

Abstract translation: 用于将IC封装（130）安装到衬底的触点栅格阵列互连（100）元件。 互连件包括具有相对端部的绝缘支柱（110）。 导电芯（105）嵌入并横穿该柱。 导电端板（125,127）位于柱的相对端（117,120）上并与芯接触。

公开(公告)号：WO2006113754A3

公开(公告)日：2007-11-08

申请号：PCT/US2006014631

申请日：2006-04-19

Applicant: TEXAS INSTRUMENTS INC ,  ODEGARD CHARLES ANTHONY ,  COWENS MARVIN WAYNE ,  STIBOREK LEON

Inventor： ODEGARD CHARLES ANTHONY ,  COWENS MARVIN WAYNE ,  STIBOREK LEON

IPC: H01L21/00

CPC classification number: H01L23/13 ,  H01L21/563 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01033 ,  H01L2924/14

Abstract: An IC assembly (10) having a die mounted on a substrate (16) with a gap therebetween, receives underfill material (12) through an aperture (32) provided in the substrate to fill the gap. This provides a favorable flow rate and improved underfilling, with less voiding. Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive pressure, are used to assist the flow of underfill material.

Abstract translation: 具有安装在其间具有间隙的衬底（16）上的管芯的IC组件（10）通过设置在衬底中的孔（32）接收底部填充材料（12）以填充间隙。 这提供了有利的流速和改进的底部填充，孔隙少。 公开了本发明的实施例，其中使用毛细管作用，真空或正压来帮助底部填充材料的流动。

公开(公告)号：WO2008083250A3

公开(公告)日：2008-08-21

申请号：PCT/US2007088992

申请日：2007-12-27

Applicant: TEXAS INSTRUMENTS INC ,  STIBOREK LEON

Inventor： STIBOREK LEON

IPC: H01R13/02 ,  H01L21/48 ,  H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/0219 ,  H05K3/4015 ,  H05K2201/09809 ,  H05K2201/10946 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A contact grid array interconnect (100) element for mounting an IC package (130) to a substrate. The interconnect comprises an insulating stand-off post (110) having opposing ends. An electrically conductive core (105) is embedded in and traverses the post. Conductive endplates (125, 127) are located on the opposing ends (117, 120) of the post and contact the core.

Abstract translation: 一种用于将IC封装（130）安装到衬底的接触栅极阵列互连（100）元件。 互连包括具有相对端的绝缘支座（110）。 导电芯（105）嵌入并穿过柱。 导电端板（125,127）位于柱的相对端（117,120）上并与芯接触。

公开(公告)号：WO2006113754A2

公开(公告)日：2006-10-26

申请号：PCT/US2006/014631

申请日：2006-04-19

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  ODEGARD, Charles, Anthony ,  COWENS, Marvin, Wayne ,  STIBOREK, Leon

Inventor： ODEGARD, Charles, Anthony ,  COWENS, Marvin, Wayne ,  STIBOREK, Leon

IPC: H01L21/00

CPC classification number: H01L23/13 ,  H01L21/563 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01033 ,  H01L2924/14

Abstract: An IC assembly (10) having a die mounted on a substrate (16) with a gap therebetween, receives underfill material (12) through an aperture (32) provided in the substrate to fill the gap. This provides a favorable flow rate and improved underfilling, with less voiding. Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive pressure, are used to assist the flow of underfill material.

Abstract translation: 具有安装在其间具有间隙的衬底（16）上的管芯的IC组件（10）通过设置在衬底中的孔（32）接收底部填充材料（12）以填充间隙。 这提供了有利的流速和改进的底部填充，孔隙少。 公开了本发明的实施例，其中使用毛细管作用，真空或正压来辅助底部填充材料的流动。