公开(公告)号：WO2012080808A1

公开(公告)日：2012-06-21

申请号：PCT/IB2011/003006

申请日：2011-12-13

Applicant: SCHLUMBERGER TECHNOLOGY B.V. ,  SERVICES PETROLIERS SCHLUMBERGER ,  SCHLUMBERGER CANADA LIMITED ,  SCHLUMBERGER HOLDINGS LIMITED ,  PRAD RESEARCH AND DEVELOPMENT LIMITED ,  TAKEDA, Jiro ,  GARANDO, Lahcen ,  LABANDA, José Gregorio

Inventor： TAKEDA, Jiro ,  GARANDO, Lahcen ,  LABANDA, José Gregorio

IPC: E21B36/00 ,  E21B47/01 ,  H01L23/36 ,  F21V29/00

CPC classification number: E21B36/001 ,  E21B47/011 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.

Abstract translation: 提供地下装置，其配置或设计用于高温井下使用。 井下装置包括配置或设计用于井中井下使用的电子装置和散热系统。 散热可以包括一个或多个有源冷却器和施加到主动式冷却器的微粒辐射改进涂层。

公开(公告)号：WO2007102062A3

公开(公告)日：2008-01-17

申请号：PCT/IB2007000489

申请日：2007-03-02

Applicant: SCHLUMBERGER TECHNOLOGY BV ,  SCHLUMBERGER SERVICES PETROL ,  PRAD RES & DEV NV ,  SCHLUMBERGER CA LTD ,  SCHLUMBERGER HOLDINGS ,  SATO SHIGERU ,  TAKEDA JIRO ,  KAYAMA ATSUSHI ,  SUZUKI SO ,  BENETEAU LIONEL

Inventor： SATO SHIGERU ,  TAKEDA JIRO ,  KAYAMA ATSUSHI ,  SUZUKI SO ,  BENETEAU LIONEL

IPC: H05K3/34 ,  H01L23/495

CPC classification number: H05K3/3426 ,  C23C18/31 ,  C23C18/32 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/26 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180°C and 220°C and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.

Abstract translation: 本文描述的原理涉及用于焊接商业电气部件的电极端子，引脚或引线框架以实现高温可靠性的方法。 在一个实施例中，在焊接电气部件之前，从引线框或引脚去除预镀焊料层，并且用无电镀形成镍和/或金膜。 预镀焊料层的去除避免了高铅焊料的过量预镀Sn，将熔点降至180°C至220°C，并削弱焊点。 用无电电镀形成的镍层作为阻挡锡从焊料与铜框架材料的铜的相互扩散，否则可能会在高温下发生。 相互扩散形成铜和锡的金属间化合物层，并降低焊点强度。 新颖的焊接工艺提高了焊点的高温可靠性，延长了电子设备的使用寿命。

公开(公告)号：WO2009081243A1

公开(公告)日：2009-07-02

申请号：PCT/IB2008/003195

申请日：2008-11-25

Applicant: SCHLUMBERGER TECHNOLOGY B.V. ,  SERVICES PETROLIERS SCHLUMBERGER ,  SCHLUMBERGER CANADA LIMITED ,  SCHLUMBERGER HOLDINGS LIMITED ,  PRAD RESEARCH AND DEVELOPMENT LIMITED ,  OTSUKA, Akira ,  MIYAMAE, Shohachi ,  TAKEDA, Jiro

Inventor： OTSUKA, Akira ,  MIYAMAE, Shohachi ,  TAKEDA, Jiro

IPC: H01L21/56 ,  E21B49/10

CPC classification number: H01L21/56 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device, including: a die; a bonding pad which is attached to the surface of the die; a bonding wire which is attached to the bonding pad; a ball which is formed on the bonding pad for connecting the bonding wire to the bonding pad; an encapsulating resin encapsulating the die and being provided with a cavity such that a connecting portion of the ball and the bonding pad is exposed out of the resin in the cavity; and a lid formed on the encapsulating resin to cover the cavity is provided.

Abstract translation: 一种半导体器件，包括：模具; 连接到模具的表面的焊盘; 连接到所述接合焊盘的接合线; 形成在所述接合焊盘上的用于将所述接合线连接到所述接合焊盘的球; 封装树脂封装模具并设置有空腔，使得球和焊盘的连接部分从空腔中的树脂露出; 并且提供形成在封装树脂上以覆盖空腔的盖。

公开(公告)号：WO2008107768A2

公开(公告)日：2008-09-12

申请号：PCT/IB2008/000473

申请日：2008-03-05

Applicant: SCHLUMBERGER TECHNOLOGY B.V. ,  SERVICES PETROLIERS SCHLUMBERGER ,  SCHLUMBERGER CANADA LIMITED ,  SCHLUMBERGER HOLDINGS LIMITED ,  PRAD RESEARCH AND DEVELOPMENT N.V. ,  UNDERHILL, William ,  KAMATA, Masahiro ,  TAKEDA, Jiro ,  WILSON, Colin

Inventor： UNDERHILL, William ,  KAMATA, Masahiro ,  TAKEDA, Jiro ,  WILSON, Colin

IPC: G01V1/42

CPC classification number: G01V1/42

Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool along the borehole. A conveyance and a sensor section are configured to move the sensor section in the borehole. At least one receiver is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.

Abstract translation: 用于通过在沿钻孔移动工具的情况下通过检查测量来创建围绕钻孔的地层的速度分布的方法和装置。 输送和传感器部分被配置成使钻孔中的传感器部分移动。 至少一个接收器被配置为在传感器部分在钻孔中移动时检测在表面处或附近产生的信号。

公开(公告)号：WO2008050191A2

公开(公告)日：2008-05-02

申请号：PCT/IB2007/002998

申请日：2007-10-10

Applicant: SCHLUMBERGER TECHNOLOGY B.V. ,  SERVICES PETROLIERS SCHLUMBERGER ,  SCHLUMBERGER CANADA LIMITED ,  SCHLUMBERGER HOLDINGS LIMITED ,  PRAD RESEARCH AND DEVELOPMENT N.V. ,  GOTO, Yasunori ,  TAKEDA, Jiro ,  MASAKI, Tsutomu

Inventor： GOTO, Yasunori ,  TAKEDA, Jiro ,  MASAKI, Tsutomu

IPC: H05K3/34

CPC classification number: H05K3/3489 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613

Abstract: Methods of manufacturing printed circuit board assemblies include placing a semiconductor chip having a plurality of lead terminals on a board formed with a plurality of solder lands at its surface such that each of the plurality of lead terminals is in touch with a corresponding one of the solder lands; supplying a solder material on the plurality of lead terminals and the plurality of solder lands; supplying a flux including mono salt of adipic acid and alkyl secondary amine; and locally heating the plurality of lead terminals such that the solder material and the flux are melted to join together the lead terminals and the solder lands.

Abstract translation: 制造印刷电路板组件的方法包括将具有多个引线端子的半导体芯片放置在其表面上形成有多个焊接区的板上，使得多个引线端子中的每一个处于 接触相应的一个焊接区; 在所述多个引线端子和所述多个焊料焊盘上供应焊料材料; 提供包括己二酸和烷基仲胺的单盐的助熔剂; 以及局部加热多个引线端子，使得焊料材料和焊剂熔化以将引线端子和焊盘连接在一起。

公开(公告)号：WO2007102062A2

公开(公告)日：2007-09-13

申请号：PCT/IB2007/000489

申请日：2007-03-02

Applicant: SCHLUMBERGER TECHNOLOGY B.V. ,  SERVICES PETROLIERS SCHLUMBERGER ,  PRAD RESEARCH AND DEVELOPMENT N.V. ,  SCHLUMBERGER CANADA LIMITED ,  SCHLUMBERGER HOLDINGS LIMITED ,  SATO, Shigeru ,  TAKEDA, Jiro ,  KAYAMA, Atsushi ,  SUZUKI, So ,  BENETEAU, Lionel

Inventor： SATO, Shigeru ,  TAKEDA, Jiro ,  KAYAMA, Atsushi ,  SUZUKI, So ,  BENETEAU, Lionel

IPC: H05K3/34 ,  H01L23/495

CPC classification number: H05K3/3426 ,  C23C18/31 ,  C23C18/32 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/26 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180°C and 220°C and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.

Abstract translation: 本文描述的原理涉及用于焊接商业电气部件的电极端子，引脚或引线框架以实现高温可靠性的方法。 在一个实施例中，在焊接电气部件之前，从引线框或引脚去除预镀焊料层，并且用无电镀形成镍和/或金膜。 预镀焊料层的去除避免了高铅焊料的过量预镀Sn，将熔点降至180°C至220°C，并削弱焊点。 用无电电镀形成的镍层作为阻挡锡从焊料与铜框架材料的铜的相互扩散，否则可能会在高温下发生。 相互扩散形成铜和锡的金属间化合物层，并降低焊点强度。 新颖的焊接工艺提高了焊点的高温可靠性，延长了电子设备的使用寿命。

公开(公告)号：WO2008107768A3

公开(公告)日：2008-10-30

申请号：PCT/IB2008000473

申请日：2008-03-05

Applicant: SCHLUMBERGER TECHNOLOGY BV ,  SCHLUMBERGER SERVICES PETROL ,  SCHLUMBERGER CA LTD ,  SCHLUMBERGER HOLDINGS ,  PRAD RES & DEV NV ,  UNDERHILL WILLIAM ,  KAMATA MASAHIRO ,  TAKEDA JIRO ,  WILSON COLIN

Inventor： UNDERHILL WILLIAM ,  KAMATA MASAHIRO ,  TAKEDA JIRO ,  WILSON COLIN

IPC: G01V1/42

CPC classification number: G01V1/42

Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool (202) along the borehole. A conveyance and a sensor section (202, 205) are configured to move the sensor section (205) in the borehole. At least one receiver (205) is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.

Abstract translation: 用于在沿钻孔移动工具（202）的情况下通过检查测量来创建围绕钻孔的地层的速度分布的方法和装置。 传送器和传感器部分（202,205）被配置为使传感器部分（205）在钻孔中移动。 至少一个接收器（205）被配置为在传感器部分在钻孔中移动的同时检测在表面处或附近产生的信号。

公开(公告)号：WO2008023256A1

公开(公告)日：2008-02-28

申请号：PCT/IB2007/002433

申请日：2007-08-24

Applicant: SCHLUMBERGER TECHNOLOGY B.V ,  SERVICES PETROLIERS SCHLUMBERGER ,  SCHLUMBERGER CANADA LIMTED ,  SCHLUMBERGER HOLDINGS LIMITED ,  PRAD RESEARCH AND DEVELOPMENT N.V. ,  YAMATE, Tsutomu ,  INOUE, Hiroshi ,  TAKEDA, Jiro ,  SUDO, Yukio ,  DESROQUES, Emmanuel ,  UMEMOTO, Satoru

Inventor： YAMATE, Tsutomu ,  INOUE, Hiroshi ,  TAKEDA, Jiro ,  SUDO, Yukio ,  DESROQUES, Emmanuel ,  UMEMOTO, Satoru

IPC: G01V11/00 ,  E21B47/00

CPC classification number: E21B47/00

Abstract: A downhole tool, configured to be suspended in a borehole traversing an earth formation, includes a downhole data acquisition system placed in the tool body and electrically connected to an electric power generator at the formation surface. The downhole data acquisition system includes a sensor for detecting local conditions in the borehole, and a transducer for transducing the voltage of an input signal from high to low or low to high. The transducer having a gallium nitride or silicon carbide based discrete semiconductor device.

Abstract translation: 构造成悬挂在穿过地层的钻孔中的井下工具包括放置在工具主体中并与形成表面处的发电机电连接的井下数据采集系统。 井下数据采集系统包括用于检测钻孔中的局部状况的传感器，以及用于将输入信号的电压从高变为低或低转换为高的换能器。 换能器具有基于氮化镓或碳化硅的分立半导体器件。

公开(公告)号：WO2008050191A3

公开(公告)日：2008-06-19

申请号：PCT/IB2007002998

申请日：2007-10-10

Applicant: SCHLUMBERGER TECHNOLOGY BV ,  SCHLUMBERGER SERVICES PETROL ,  SCHLUMBERGER CA LTD ,  SCHLUMBERGER HOLDINGS ,  PRAD RES & DEV NV ,  GOTO YASUNORI ,  TAKEDA JIRO ,  MASAKI TSUTOMU

Inventor： GOTO YASUNORI ,  TAKEDA JIRO ,  MASAKI TSUTOMU

IPC: H05K3/34

CPC classification number: H05K3/3489 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613

Abstract: Methods of manufacturing printed circuit board assemblies include placing a semiconductor chip having a plurality of lead terminals on a board formed with a plurality of solder lands at its surface such that each of the plurality of lead terminals is in touch with a corresponding one of the solder lands; supplying a solder material on the plurality of lead terminals and the plurality of solder lands; supplying a flux including mono salt of adipic acid and alkyl secondary amine; and locally heating the plurality of lead terminals such that the solder material and the flux are melted to join together the lead terminals and the solder lands.

Abstract translation: 制造印刷电路板组件的方法包括将具有多个引线端子的半导体芯片放置在其表面上形成有多个焊接区域的板上，使得多个引线端子中的每一个与相应的一个焊料接触 土地; 在所述多个引线端子和所述多个焊盘上提供焊料材料; 提供包含己二酸单烷基酯和烷基仲胺的助熔剂; 并且对多个引线端子进行局部加热，使得焊料材料和焊剂熔化，以将引线端子和焊盘接合在一起。