SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 审中-公开
    半导体器件及其制造方法

    公开(公告)号:WO1997011485A1

    公开(公告)日:1997-03-27

    申请号:PCT/JP1996002591

    申请日:1996-09-11

    Inventor: HITACHI, LTD.

    Abstract: A semiconductor device provided with copper-alloy interconnection which has a line width narrower than that the conventional copper interconnection, a low resistance and a high reliability. A method of manufacturing the semiconductor device is also disclosed. An opening (400) in an insulating film (201) formed on a semiconductor substrate (100) is filled with interconnection (302A) made of an alloy of copper and an element which accelerates the surface diffusion of copper. Since the interconnection contains copper and the element which accelerates the surface diffusion of copper, the opening (400) having an extremely narrow width is filled with the copper alloy (302) extremely easily and a highly reliable fine copper-alloy interconnection (302A) can be obtained.

    Abstract translation: 具有铜合金互连的半导体器件,其宽度比常规铜互连线宽窄,电阻低,可靠性高。 还公开了制造半导体器件的方法。 形成在半导体衬底(100)上的绝缘膜(201)中的开口(400)填充有由铜合金制成的互连(302A)和加速铜的表面扩散的元素。 由于互连包含铜和加速铜的表面扩散的元素,所以具有非常窄的宽度的开口(400)非常容易地被铜合金(302)填充,并且高度可靠的细铜合金互连(302A)可以 得到。

    COMPOUNDING COMPOSITION BASED ON EPOXY RESIN AND VINYL CHLORIDE COPOLYMER

    公开(公告)号:JPS5620047A

    公开(公告)日:1981-02-25

    申请号:JP9613279

    申请日:1979-07-30

    Inventor: IIO HIDEO

    Abstract: PURPOSE:Titled composition which can form stable films, does not tend toward adhering to the surfaces of coating tools, and can be applied in one simple step, prepared by mixing and stirring, at the time of use, a curing agent in an amount necessary for curing the epoxy resin contained. CONSTITUTION:A compounded composition which provides a coating which can be applied without adhering to the surface of trowels or rollers, which composition is prepared by mixing and stirring, at the time of use, a curing agent in an amount necessary for curing epoxy resin and the vehicle of which composition comprises 55-75pts.wt. of a reactive epoxy resin, 3-10pts.wt. of a vinyl chloride copolymer, a fat and oil having drying properties, 5-10pts.wt. of an alcohol which is at least monohydric (or a volatile hydrocarbon) and, if necessary, an inorganic or organic filler.

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