Abstract:
본 발명은 칩의 본딩을 위한 본딩 장치에 장착되는 히터 어셈블리에 관한 것이다. 본 발명의 일 실시예에 따른 히터 어셈블리는, 하면에 발열 박막층이 형성되는 발열체와, 에어의 유입이 가능한 이격 공간이 형성되도록 발열체의 하부에 장착되는 인슐레이터와, 인슐레이터가 고정 설치되는 베이스부를 포함한다.
Abstract:
본 발명은 「(a) 유연 기판이 일측면으로 들어가 코팅공정 후 타측면으로 나오도록 구성된 코팅챔버를 준비하는 단계; (b) 유연 기판을 상기 코팅챔버 내부로 이송하고, 상기 유연 기판의 상·하면이 공간에 노출되도록 하는 단계; (c) 상기 유연 기판을 고정하되, 공정 진행 방향 기준으로 상기 유연 기판의 전방과 후방 가장자리를 고정하는 단계; 및 (d) 투명전도막 프리커서를 상기 유연 기판의 상·하면과 평행을 이루면서 공정 진행 방향과는 수직을 이루는 방향으로 흘려주어 상기 유연 기판에 증착시키는 단계;를 포함하여 구성된 유연 기판 투명전도막 양면 코팅 방법」을 제공한다.
Abstract:
The present invention relates to a metal wiring technique for enabling a large-sized process and reducing process costs compared to an existing technique by using basic paste. The present invention is to provide an alkali metal patterning method using basic paste that includes a step (a) of manufacturing basic paste by mixing a thickener with a basic solution including alkali metal; and a step (b) of adsorbing the alkali metal to a substrate by patterning the basic paste to the substrate made of a basic reaction resin.
Abstract:
The present invention relates to a metal wiring method for a substrate which is coated with a transparent conductive layer, capable of selectively forming a metal wire on the substrate which is exposed by cutting the transparent conductive layer which is coated on the upper part of the substrate in a laser scribing method. The present invention provides the method wiring method for the substrate which is coated with the transparent conductive layer including (a) a step of preparing the substrate which is coated with the transparent conductive layer, (b) a step of exposing the substrate by cutting the transparent conductive layer as necessary through a laser scribing, and (c) a step of forming the metal wire on the exposed substrate. [Reference numerals] (AA) Polymer protection film; (BB) Laser etching; (CC) Copper line; (DD) Remove polymer
Abstract:
PURPOSE: A method for depositing a thin film of a transparent conductive substrate and a hard board is provided to reduce manufacturing time by forming a thin film on both sides of the hard board and a flexible substrate in one process chamber. CONSTITUTION: A film is supplied from a first roll and is wound around a second roll. A raw material feeding and exhausting nozzle is installed in a direction of 90 degrees of the same plane as the first roll and the second roll. Raw materials are supplied in the direction of 90 degrees of the plane in a progressive direction of the substrate. A line connected to the center of the feeding and exhausting nozzle coincides with the location of a surface with the substrate. Both sides of the transparent hard board and the flexible substrate are coated with ceramic by uniformly supplying raw gas. [Reference numerals] (AA) Supplying mist; (BB) Cooling unit; (CC) Coating unit; (DD) Preheating unit; (EE) Product roll; (FF) Exhaust; (GG) Substrate roll; (HH) Progressive direction of a substrate