公开(公告)号：KR100791265B1

公开(公告)日：2008-01-04

申请号：KR1020060108101

申请日：2006-11-03

Applicant: (주)파트론

Inventor： 김종태 ,  김태일 ,  전문수 ,  박지찬

IPC: H01L21/58 ,  H01L27/146

CPC classification number: H01L21/563

Abstract: A method for bonding a flexible printed circuit board of a camera module using an underfill process is provided to increase a peel-off value by performing an SMT process and an underfill process. A plurality of terminals(31) are formed on a flexible printed circuit board(30). A solder paste(32) is coated on upper parts of the terminals by using an SMT method. A module main part(33) is mounted on the upper parts of the terminals coated with the solder paste. A reflow process for the module main part is performed. An edge of a bonding part between the module main part and the flexible printed circuit board is filled with an underfill material(35). A thermal curing process for the edge of the bonding part is performed. The process for coating the solder paste is performed by using a screen printing process.

Abstract translation: 提供了使用底部填充处理来接合相机模块的柔性印刷电路板的方法，以通过执行SMT处理和底部填充处理来增加剥离值。 多个端子（31）形成在柔性印刷电路板（30）上。 通过使用SMT方法将焊膏（32）涂覆在端子的上部。 模块主体（33）安装在涂有锡膏的端子的上部。 执行模块主要部分的回流处理。 在模块主体部分和柔性印刷电路板之间的接合部分的边缘填充有底部填充材料（35）。 进行接合部的边缘的热固化处理。 通过使用丝网印刷方法进行涂布焊膏的工序。