저온 동시소성 유전체 세라믹 조성물, 및 이의 용도
    1.
    发明授权
    저온 동시소성 유전체 세라믹 조성물, 및 이의 용도 有权
    低温辅助陶瓷组合物及其用途

    公开(公告)号:KR100496135B1

    公开(公告)日:2005-06-16

    申请号:KR1020020057019

    申请日:2002-09-18

    Abstract: 본 발명은 x(Ba,Sr)Oㆍy(Ti,Zr)O
    2 ㆍz(Nb,Ta)
    2 O
    5 의 주성분, 소결조제, 및 접합 조절제를 포함하는 세라믹 조성물, 이를 이용한 이종 세라믹 접합체, 및 수동 집적 소자에 관한 것이다.
    본 발명의 조성물은 이종의 저온 소성 세라믹간의 동시 소성 접합성과 높은 유전 상수(Dielectric Constant), 낮은 유전 손실(Dielectric Loss), 뛰어난 유전 상수의 온도 안정성을 이용하여, 저온 동시 소성 세라믹으로 구현되는 다층 세라믹 모듈형(Multilayer Ceramic Module) 전자부품의 부피를 감소시킴과 동시에 그 특성을 향상시킬 수 있다.

    내장 발열 부재를 포함하는 세라믹 칩 퓨즈
    2.
    发明授权
    내장 발열 부재를 포함하는 세라믹 칩 퓨즈 有权
    具有内部加热构件的陶瓷芯片保险丝

    公开(公告)号:KR101307530B1

    公开(公告)日:2013-09-12

    申请号:KR1020120052661

    申请日:2012-05-17

    Abstract: PURPOSE: A ceramic chip fuse including an internal heat generation member simplifies manufacturing process time by printing a screen and firing the screen and green sheets at the same time. CONSTITUTION: A ceramic chip fuse (100) includes a ceramic substrate (110), a fuse member (120), an internal heat generation member, and a fuse receiving member (122). The ceramic substrate includes multiple ceramic sheets integrated by co-firing. The fuse member is placed on the ceramic substrate. The internal heat generation member is embedded in the ceramic substrate, is placed to overlap the fuse member, and fuses the fuse member when a current is applied. The fuse receiving member is placed on the ceramic substrate, is formed by being fired with multiple ceramic sheets at the same, and receives the fuse member until the fuse member is fused. The fuse receiving member is in contact with the fuse member and is interposed between the fuse member and the internal heat generation member.

    Abstract translation: 目的:包括内部发热体的陶瓷芯片保险丝通过打印屏幕和同时点燃屏幕和绿化板来简化制造工艺时间。 构成:陶瓷芯片保险丝(100)包括陶瓷基板(110),熔丝部件(120),内部发热部件和熔丝接收部件(122)。 陶瓷基板包括通过共烧制成的多个陶瓷片。 保险丝部件放置在陶瓷基板上。 将内部发热体嵌入陶瓷基板内,放置成与熔丝部件重叠,并在施加电流时对保险丝部件进行熔断。 熔丝接收部件放置在陶瓷基板上,通过在其上被烧制而形成多个陶瓷片,并且接收保险丝部件直到保险丝部件熔合。 保险丝接收构件与保险丝构件接触并且插入在保险丝构件和内部发热构件之间。

    저온 동시소성 유전체 세라믹 조성물, 및 이의 용도
    3.
    发明公开
    저온 동시소성 유전체 세라믹 조성물, 및 이의 용도 有权
    低温烧结电介质陶瓷组合物及其用途

    公开(公告)号:KR1020040025177A

    公开(公告)日:2004-03-24

    申请号:KR1020020057019

    申请日:2002-09-18

    CPC classification number: H01B3/12 C04B37/04 H01G4/1209 H01G4/30

    Abstract: PURPOSE: Provided is a low temperature co-firing dielectric ceramic composition, which has a high dielectric constant, low dielectric loss and excellent stability of dielectric constant against temperature so as to reduce the volume of multilayer ceramic module-type electronic components and to improve the characteristic property of the component. CONSTITUTION: The ceramic composition comprises: (a) x(Ba,Sr)O·y(Ti,Zr)O2·z(Nb,Ta)2O5 as a main component, (b) a firing aid, and (b) a bonding modifier, wherein the main component is represented by the formula of x(aBaO,(1-a)SrO)·y(bTiO 2,(1-b)ZrO2)·z(cNb2O5,(1-c)Ta2O5), in which 0.15

    Abstract translation: 目的:提供一种低介电常数电介质陶瓷组合物,介电常数低,介电损耗低,介电常数对温度稳定性好,降低多层陶瓷模块型电子元件的体积, 组件的特征属性。 构成:陶瓷组合物包含:(a)x(Ba,Sr)O·y(Ti,Zr)O 2·z(Nb,Ta)2 O 5为主要成分,(b)烧成助剂,(b) (aBaO,(1-a)SrO)·y(bTiO 2,(1-b)ZrO 2)·z(cNb 2 O 5,(1-c)Ta 2 O 5)表示的主成分, 其中0.15 <= x <= 0.3,0.15 <= y <0.3和0.4 <= z <= 0.7,0

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