公开(公告)号：KR1020040095104A

公开(公告)日：2004-11-12

申请号：KR1020030028713

申请日：2003-05-06

Applicant: 고등기술연구원연구조합

Inventor： 김정순 ,  홍성진 ,  엄환섭 ,  김형석 ,  김태경

IPC: C23C14/02

CPC classification number: H01J37/32825 ,  C23C14/022

Abstract: PURPOSE: To improve plating capability and provide process convenience by treating the surface of a material having hard surface using atmospheric pressure plasma as a plating pretreatment process. CONSTITUTION: The surface treatment apparatus comprises a hollow body (12) comprising an inflow port (24) for flowing in gas; first electrode (14) installed on an upper part of the body; second electrodes (18) comprising a plural exhaust holes (18a) circulated to the outside with being installed under the first electrode at positions spaced apart from the first electrode in a certain distance; and a power supply unit for impressing a power supply to the first electrode and second electrodes, wherein the surface of a material having hard surface is treated by injecting plasma generated by impressing a power supply to the gas flown in the inflow port through the first electrode and second electrodes onto the material through the exhaust holes of the second electrodes, wherein the surface of a hard surfaced material having large area is treated by controlling size of the first electrode and the second electrodes according to area of the hard surfaced material.

Abstract translation: 目的：通过使用大气压等离子体处理具有硬表面的材料的表面作为电镀预处理工艺，提高电镀能力并提供工艺便利性。 构成：表面处理装置包括中空体（12），其包括用于气体流动的流入口（24） 第一电极（14），其安装在所述主体的上部; 第二电极（18），其包括循环到外部的多个排气孔（18a），其在与所述第一电极间隔开一定距离的位置处设置在所述第一电极下方; 以及用于向第一电极和第二电极施加电源的电源单元，其中具有硬表面的材料的表面通过将通过向流入口中流动的气体施加电力而产生的等离子体进行处理，该电流通过第一电极 并且通过第二电极的排气孔将第二电极放置在材料上，其中通过根据硬表面材料的面积控制第一电极和第二电极的尺寸来处理具有大面积的硬表面材料的表面。