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    텅스텐-구리 복합재료의 구리 스며나옴 억제 소결법
    1.
    发明公开
    텅스텐-구리 복합재료의 구리 스며나옴 억제 소결법 有权
    用于抑制从W-Cu复合材料中排出铜的烧结方法

    公开(公告)号：KR1020040047451A

    公开(公告)日：2004-06-05

    申请号：KR1020020075678

    申请日：2002-11-30

    Applicant: 국방과학연구소

    Inventor： 김은표 ,  홍문희 ,  노준웅 ,  이성 ,  이성호 ,  김영도 ,  김대건

    IPC: B22F3/10

    CPC classification number: C22C27/04 ,  B22F1/0003 ,  B22F9/22 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/045 ,  H01H1/025 ,  B22F3/14 ,  B22F3/1035 ,  B22F3/1028 ,  B22F1/0096

    Abstract: PURPOSE: A method for densifying the W-Cu composite material as suppressing exuding of copper from the W-Cu composite material when performing densification process of W-Cu composite material by liquid phase sintering is provided. CONSTITUTION: The sintering method for suppressing exuding of copper from W-Cu composite material comprises a step of maintaining a W-Cu composite material prepared by press forming W-Cu composite powder in the copper solidification temperature range of 800 to 1,083 (except 1,083 deg.C) at a reducing gas atmosphere for 0.5 to 10 hours; and a step of cooling the temperature increased W-Cu composite material right after increasing temperature of the W-Cu composite material to 1,200 to 1,400 deg.C, wherein the W-Cu composite powder is prepared by reduction heat treating the milled mixed powder in a hydrogen atmosphere after mixing tungsten (WO3 and WO2.9) powder with copper oxide (CuO and Cu2O) powder and milling the mixed powder, and the W-Cu composite powder is a globular powder having a certain size formed in such a shape that W powder surrounds Cu powder. The sintering method for suppressing exuding of copper from W-Cu composite material comprises a step of maintaining a W-Cu composite material prepared by press forming W-Cu composite powder in the temperature range of 1,083 to 1,150 that is right above a copper melting point at a reducing gas atmosphere for 0.5 to 10 hours; and a step of cooling the temperature increased W-Cu composite material right after increasing temperature of the W-Cu composite material to 1,200 to 1,400 deg.C.

    Abstract translation: 目的：提供通过液相烧结进行W-Cu复合材料的致密化处理时，使W-Cu复合材料致密化的方法，从而抑制铜从W-Cu复合材料渗出。 构成：从W-Cu复合材料中抑制铜的渗出的烧结方法包括：在铜固化温度范围为800〜1,083（除了1×103度以下）之间，维持通过压制成型W-Cu复合粉末制备的W-Cu复合材料的工序 C）在还原气体气氛下进行0.5〜10小时; 以及在W-Cu复合材料的温度升高之后将温度升高的W-Cu复合材料冷却至1,200〜1400℃的步骤，其中W-Cu复合粉末通过将研磨的混合粉末进行还原热处理 在将钨（WO3和WO2.9）粉末与氧化铜（CuO和Cu 2 O）粉末混合并混合粉末混合之后的氢气氛中，并且W-Cu复合粉末是具有一定尺寸的球状粉末， W粉末围绕Cu粉末。 用于抑制铜从W-Cu复合材料渗出的烧结方法包括：将在Cu熔点正上方的温度范围为1,083〜1150℃的压制成形W-Cu复合粉末的W-Cu复合材料 在还原气氛下0.5〜10小时; 以及在W-Cu复合材料的温度升高之后将温度升高的W-Cu复合材料冷却至1,200〜1400℃的步骤。

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