公开(公告)号：KR101475172B1

公开(公告)日：2014-12-19

申请号：KR1020137020470

申请日：2011-12-07

Applicant: 니혼도꾸슈도교 가부시키가이샤

Inventor： 사이타겐이치 ,  미야모토신야 ,  야마시타다이스케 ,  스즈키신야 ,  하시모토히로히토

IPC: H05K3/46

CPC classification number: H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

Abstract: 코어재의수용부에수지충전재를개재시켜서부품을내장할경우, 코너부로의응력집중에기인하는크랙등의문제점을방지할수 있는부품내장배선기판을제공한다. 본발명의부품내장배선기판은, 수용부를개구한코어재(11)와, 상기코어재(11)의수용부에수용되는부품(커패시터)(50)과, 코어재(11)에절연층및 도체층을교호로적층형성한적층부를구비하고있다. 코어재(11)의수용부와부품(50)의사이의간극부(G)에는수지충전재(20)가충전되어있다. 코너영역(C)에는코어재(11)의수용부의내주부에는직사각형의각 코너부에직선형상의제 1 모따기부가형성되고, 부품(50)의외주부에는직사각형의각 코너부에직선형상의제 2 모따기부가형성된다. 제 2 모따기부의모따기길이는, 코너영역(C)에있어서의간극부의폭보다크게되어있다. 이와같은구조에의해, 수지충전재(20)의코너부부근으로의응력집중을완화하여크랙등을방지함으로써높은신뢰성을확보할수 있다.

公开(公告)号：KR1020130102120A

公开(公告)日：2013-09-16

申请号：KR1020137020470

申请日：2011-12-07

Applicant: 니혼도꾸슈도교 가부시키가이샤

Inventor： 사이타겐이치 ,  미야모토신야 ,  야마시타다이스케 ,  스즈키신야 ,  하시모토히로히토

IPC: H05K3/46

CPC classification number: H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

Abstract: Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.