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公开(公告)号:KR100597946B1
公开(公告)日:2006-07-06
申请号:KR1020050054195
申请日:2005-06-22
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 연속 주행하는 판형 피도포부재에 습식 도막으로 후막 코팅층을 형성함에 있어서, 별다른 장비의 추가 없이도 2층으로 적층된 후막 코팅층을 형성하는 공정을 채택함으로써, 종래의 후막 코팅층을 형성할 때 나타나는 파핑현상의 문제점을 해결하고, 원하는 두께로 균일하게 코팅막을 형성할 수 있는 방법을 제공한다.
습식 도막, 후막, 적층, 판형 처리물, 파핑 현상.Abstract translation: 本发明采用在连续运行的板状涂覆构件上形成厚膜涂层的方法,该方法不用任何设备在湿膜涂层上形成厚膜涂层, 本发明提供了一种解决打印现象并且以期望的厚度均匀地形成涂膜的方法。
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公开(公告)号:KR101293775B1
公开(公告)日:2013-08-06
申请号:KR1020050119540
申请日:2005-12-08
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02
Abstract: 본 발명은 내열성이 우수한 열경화성 접착 필름에 관한 것으로서, 보다 상세하게는 연성회로기판에 보강재를 부착시킬 때 사용되는 종래의 접착필름보다 저온에서 속 경화할 수 있어 접착력이 우수하며 내열성이 우수하므로 보강재나 연성회로기판의 손상을 방지할 수 있고, 제품의 신뢰성뿐만 아니라 제품의 수율도 높일 수 있는 내열성이 우수한 열경화성 접착 필름에 관한 것이다.
열경화성 접착 필름, 연성회로 기판 보강재, 접착필름, 접착제-
公开(公告)号:KR100836158B1
公开(公告)日:2008-06-09
申请号:KR1020060126281
申请日:2006-12-12
Applicant: 도레이첨단소재 주식회사
IPC: C09J109/02 , C09J163/00 , C09J11/00
CPC classification number: C09J109/02 , C08L63/00 , C08L83/04 , C09J5/06 , C09J11/04 , C09J11/06 , C09J2203/326
Abstract: A heat-curable adhesive film is provided to prevent the damage of a reinforcing material or flexible printed circuit board when the reinforcing material adheres to the flexible printed circuit board, and to enhance reliance and yield of a product. A heat-curable adhesive film is a laminate comprising an adhesive layer(20), a release paper(30) formed on one surface of the adhesive layer, and an exfoliative film(10) formed on the other surface of the adhesive layer. The adhesive layer comprises 100 parts by weight of acrylonitrile butadiene rubber containing a carboxyl group, 50-100 parts by weight of an epoxy resin, 1-20 parts by weight of at least one hardener selected from amine-based or acid anhydride-based hardeners, and 0.01-1 parts by weight of a silicone-based surface treatment agent. The silicone-based surface treatment agent is a polysiloxane-based or organically modified polysiloxane.
Abstract translation: 提供一种可热固化的粘合剂膜,以防止当增强材料粘附到柔性印刷电路板上时增强材料或柔性印刷电路板的损坏,并且增强产品的依赖性和屈服性。 热固性粘合剂膜是包含粘合剂层(20),形成在粘合剂层的一个表面上的剥离纸(30)和形成在粘合剂层的另一个表面上的剥离膜(10)的层压体。 粘合剂层包含100重量份含有羧基的丙烯腈丁二烯橡胶,50-100重量份的环氧树脂,1-20重量份的至少一种选自胺系或酸酐系硬化剂的硬化剂 ,和0.01-1重量份的硅氧烷基表面处理剂。 硅氧烷类表面处理剂是聚硅氧烷类或有机改性聚硅氧烷。
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公开(公告)号:KR100802560B1
公开(公告)日:2008-02-14
申请号:KR1020060075270
申请日:2006-08-09
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/20 , C09J7/02 , C09J7/00
CPC classification number: C09J7/35 , C09J2201/128 , C09J2203/326
Abstract: A thermosetting double-sided adhesive film for a bonding sheet used in the lamination of a flexible printed circuit board is provided to improve fast curing property and workability. A thermosetting double-sided adhesive film comprises a releasing paper(30); an adhesive layer(20) formed on the one side of the releasing paper; and a stripping film(10) laminated on the adhesive layer, wherein the adhesive layer is laminated with an adhesive composition which comprises an acrylonitrile-butadiene rubber having a weight average molecular weight of 2,000-200,000, an acrylonitrile content of 10-60 wt% and a carboxyl group content of 1-20 wt%; at least one curing agent selected from a multifunctional epoxy resin, a multifunctional phenolic resin, an amine-based compound or acid anhydride; and a siloxane compound.
Abstract translation: 提供了一种用于柔性印刷电路板层压的接合片的热固性双面粘合膜,以提高快速固化性能和可加工性。 热固性双面粘合膜包括脱模纸(30); 形成在所述脱模纸一侧的粘合剂层(20) 和层压在粘合剂层上的剥离膜(10),其中粘合剂层与包含重均分子量为2,000-200,000的丙烯腈 - 丁二烯橡胶,丙烯腈含量为10-60重量%的粘合剂组合物层压, 羧基含量为1-20重量%; 选自多官能环氧树脂,多官能酚醛树脂,胺类化合物或酸酐中的至少一种固化剂; 和硅氧烷化合物。
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公开(公告)号:KR1020070060289A
公开(公告)日:2007-06-13
申请号:KR1020050119540
申请日:2005-12-08
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02
CPC classification number: C09J7/35 , C09J2203/326
Abstract: A heat-curable adhesive film having good heat resistance is provided to have excellent adhesion and good heat resistance, prevent damage to a reinforcing material or a flexible printed circuit board, and enhance reliability and yield of products. The heat-curable adhesive film having good heat resistance comprises an adhesive layer(20) of which one surface is laminated with a release paper(30) and the other surface is laminated with a release film(10). The adhesive layer(20) consists of 50-300 parts by weight of an epoxy resin, 1-20 parts by weight of at least one hardener selected from amine-based or acid anhydride-based hardeners, 5-30 parts by weight of silica particles based on 100 parts by weight of an acrylonitrile-butadiene rubber containing a carboxyl group.
Abstract translation: 提供具有良好耐热性的热固性粘合剂膜以具有优异的粘附性和良好的耐热性,防止对增强材料或柔性印刷电路板的损坏,并提高产品的可靠性和产率。 具有良好耐热性的热固性粘合剂膜包括其中一个表面与隔离纸(30)层压的粘合剂层(20),另一个表面与隔离膜(10)层压。 粘合剂层(20)由50-300重量份的环氧树脂,1-20重量份的至少一种选自胺类或酸酐类固化剂的硬化剂组成,5-30重量份二氧化硅 基于100重量份含有羧基的丙烯腈 - 丁二烯橡胶的颗粒。
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