Abstract:
PURPOSE: A thin film transistor, a display device having the same, and a method for manufacturing the same are provided to reduce the negative shift phenomenon of a threshold voltage by preventing a light negative bias thermal stress (LNBTS). CONSTITUTION: A gate electrode (GE) is formed on a base substrate. A first insulating layer is formed on the gate electrode. A semiconductor layer (SM) is formed on the first insulating layer. A source electrode (SE) is formed on the semiconductor layer. A drain electrode (DE) is formed on the first insulating layer.
Abstract:
본발명에관한박막트랜지스터의반도체층용산화물은, Zn, Sn 및 In을포함하고, 산화물에포함되는금속원소의함유량(원자%)을각각, [Zn], [Sn] 및 [In]으로하였을때, 하기수학식 1 내지 3을만족하는것이다. [수학식 1][수학식 2][수학식 3]본발명에따르면, 높은이동도를실현할수 있고, 또한, 스트레스내성(스트레스인가전후의임계값전압시프트량이적은것)도우수한박막트랜지스터용산화물을제공할수 있었다.
Abstract:
박막 트랜지스터의 스위칭 특성이 우수하며, 특히 ZnO 농도가 높은 영역이라도, 또한 보호막 형성 후 및 스트레스 인가 후에도 양호한 특성을 안정적으로 얻을 수 있는 박막 트랜지스터 반도체층용 산화물을 제공한다. 본 발명에 따른 박막 트랜지스터의 반도체층용 산화물은, 박막 트랜지스터의 반도체층에 사용되는 산화물로서, 상기 산화물은, Zn 및 Sn을 포함하고, Al, Hf, Ta, Ti, Nb, Mg, Ga, 및 희토류 원소로 이루어지는 X군으로부터 선택되는 적어도 1종의 원소를 더 포함하고 있다.
Abstract:
An oxide for a thin film transistor of the present invention is an In-Zn-Sn-based oxide including at least In, Zn, and Sn. When the contents (atomic percent) of metal elements included in the In-Zn-Sn-based oxide are represented by ′Zn′, ′Sn′, and ′In′, respectively, the following formulas 2 and 4 are satisfied when ′In′ / (′In′+′Sn′) 0.5. Formula 1: ′In′ / (′In′ + ′Zn′ + ′Sn′)
Abstract:
The present invention discloses a thin film transistor of a crystalline thin film. The transistor includes a metal electrode and a zinc oxide based blocking layer for preventing the diffusion of a material from the metal electrode. The zinc oxide based blocking layer is doped with 1-50 wt% of indium oxide in regards to zinc oxide. The present invention provides a zinc oxide based sputtering target for a thin film transistor blocking layer deposition that is doped with 1-50 wt% of indium oxide in regards to zinc oxide.