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公开(公告)号：KR1020120030773A
公开(公告)日：2012-03-29
申请号：KR1020100092502
申请日：2010-09-20
Applicant: 삼성전기주식회사
Inventor： 김미금
CPC classification number: C25D3/12
Abstract: PURPOSE: A nickel electro-plating solution and a chip component using the same are provided to improve the soldering characteristics of a chip component by including a nickel plating layer as a barrier layer between an exterior terminal electrode and solder. CONSTITUTION: A nickel electro-plating solution comprises nickel, nickel chloride, boric acid, a first additive, and a second additive. The first additive includes one or more selected from the group consisting of the first additive is the benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharin. The second additive includes one or more selected from the group consisting of sodium dialkylsulfosuccinate, laurylsodiumsulfate, polyethylene glycol, polyethylene glycol methylether, and polyethylene glycol laurylamine ether.
Abstract translation: 目的：提供镍电镀液和使用其的芯片部件，以通过在外部端子电极和焊料之间包括作为阻挡层的镀镍层来提高芯片部件的焊接特性。 构成：镍电镀液包括镍，氯化镍，硼酸，第一添加剂和第二添加剂。 第一添加剂包括选自第一添加剂中的一种或多种，其为苯，萘，二甲苯，磺酸，磺酸钠和糖精。 第二添加剂包括选自二烷基磺基琥珀酸钠，月桂基硫酸钠，聚乙二醇，聚乙二醇甲基醚和聚乙二醇月桂基胺醚中的一种或多种。
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Patent Agency Ranking
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公开(公告)号：KR1020140034529A
公开(公告)日：2014-03-20
申请号：KR1020120100969
申请日：2012-09-12
Applicant: 삼성전기주식회사
Abstract: Disclosed herein is an electro-copper plating apparatus in which a cathode, an insoluble anode, a copper ball, and a plating solution are included in a single bath, wherein the plating solution includes manganese oxide; or an electro-copperplating apparatus including: a main bath including a cathode, an insoluble anode, and a plating solution; and a dissolution bath including a copper ball, and manganese oxide. According to the present invention, the manganese oxide having higher oxidation-reduction potential instead of using Fe^3+ of the related art as the copper source in the electro-copper plating apparatus may be used to obtain a high effect in suppressing surface plating even at a low concentration.
Abstract translation: 这里公开了一种电镀铜装置，其中阴极，不溶性阳极，铜球和电镀液包含在单个浴中，其中电镀溶液包括氧化锰; 或电镀铜装置，其包括：主浴，其包括阴极，不溶性阳极和电镀液; 以及包含铜球和氧化锰的溶解浴。 根据本发明，可以使用具有较高氧化还原电位而不是使用现有技术的Fe 3+作为铜电镀装置中的铜源的氧化锰，以获得甚至抑制表面电镀的高效果 浓度低。
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公开(公告)号：KR1020140033908A
公开(公告)日：2014-03-19
申请号：KR1020120100435
申请日：2012-09-11
Applicant: 삼성전기주식회사
Abstract: The present invention relates to a nickel electroplating solution which includes nickel ions, chlorine ions, and a pH buffering agent using a mix of inorganic and organic acids, and relates to method for forming a nickel plating layer using the same solution by which a nickel plating layer is formed on an outer electrode of a chip part. According to the present invention, the nickel electroplating solution for forming the nickel plating layer on the outer electrode of the chip part, which includes an element made of material containing ferrite or manganese oxide, includes organic acids and salts thereof, thereby reducing damage to the element.
Abstract translation: 本发明涉及一种镍电镀溶液，其包括镍离子，氯离子和使用无机酸和有机酸的混合物的pH缓冲剂，并且涉及使用相同的镀镍方法形成镍镀层的方法 层形成在芯片部分的外部电极上。 根据本发明，用于在芯片部分的外部电极上形成镍镀层的镍电镀溶液包括有机酸及其盐，其中包含由铁氧体或氧化锰构成的材料，从而减少对 元件。
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