세라믹 슬러리의 제조방법, 및 상기 세라믹 슬러리를 이용한 적층 세라믹 콘덴서
    6.
    发明公开
    세라믹 슬러리의 제조방법, 및 상기 세라믹 슬러리를 이용한 적층 세라믹 콘덴서 无效
    陶瓷浆料的制备方法和使用陶瓷浆料的多层陶瓷冷凝器

    公开(公告)号:KR1020130123631A

    公开(公告)日:2013-11-13

    申请号:KR1020120046899

    申请日:2012-05-03

    CPC classification number: C04B35/62625 C04B35/632 H01G4/30

    Abstract: The present invention relates to a manufacturing method comprising a step for dispersing ceramic slurry, a step of separating the dispersed slurry by a centrifugation method, and a step of filtering the centrifuged slurry and a multi-layered ceramic condenser including a green sheet obtained from the ceramic slurry. According to the present invention, when centrifugal separation is applied to the manufacturing method for the slurry, the scattering of the particle size inside the slurry can be reduced, and coarse powder and flocculant can be removed. In addition, filtering efficiency can be improved by upgrading filter grades while filtering is performed. When the green sheet is molded by the manufactured slurry thereof, the surface roughness and compactness can be improved to be useful for manufacturing the thin green sheet. As a result, the scattering shown in the electric property of chips such as capacity, BDV, and etc. can be reduced by a dielectric material having an equal particle size. [Reference numerals] (AA) Slurry disperation;(BB) Centrifugation;(CC,EE) Filtering;(DD) Slurry completion;(FF) Green sheet shaping

    Abstract translation: 本发明涉及一种制造方法,其特征在于,包括分散陶瓷浆料的步骤,通过离心法分离分散浆料的步骤,以及过滤离心浆料的步骤和多层陶瓷冷凝器,所述多层陶瓷冷凝器包括从 陶瓷浆料。 根据本发明,当对浆料的制造方法进行离心分离时,能够减少浆料内的粒子的散射,可以除去粗粉末和絮凝剂。 此外,通过在进行滤波时升级滤波器等级,可以提高滤波效率。 当通过其生产的浆料模塑生片时,可以改善表面粗糙度和紧密度,以有助于制造薄的生片。 结果,可以通过具有相同粒度的电介质材料来减少诸如电容,BDV等芯片的电性能中所示的散射。 (参考号)(AA)浆料分散;(BB)离心;(CC,EE)过滤;(DD)浆料完成;(FF)

    적층형 커패시터
    7.
    发明授权

    公开(公告)号:KR102198536B1

    公开(公告)日:2021-01-06

    申请号:KR1020180119058

    申请日:2018-10-05

    Abstract: 본발명의일 실시형태는복수의유전체층의적층구조와상기유전체층을사이에두고적층된복수의내부전극을포함하는바디및 상기바디외부에형성되어상기내부전극과전기적으로연결된외부전극을포함하며, 상기바디는중앙부와상기복수의유전체층의적층방향으로상기중앙부의상부와하부에위치하는커버부로구분되며, 상기바디에서상기커버부는모서리가곡면으로형성되되상기곡면모서리의곡률반경(R)과상기바디의두께(T)는 10um≤R≤T/4의조건을만족하며, 상기복수의내부전극중 상기커버부에배치된것은상기중앙부에배치된것보다폭이좁은적층형커패시터를제공한다.

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