터치센서
    1.
    发明公开
    터치센서 审中-实审
    触摸传感器

    公开(公告)号:KR1020160070591A

    公开(公告)日:2016-06-20

    申请号:KR1020140177752

    申请日:2014-12-10

    CPC classification number: G06F3/041 G06F3/044

    Abstract: 본발명의일실시예에따른터치센서는, 윈도우기판; 상기윈도우기판과마주보도록형성되고, 일면에적어도 1개이상의제1 전극패턴이형성되며상기전극패턴의전기적신호를제1 전극배선을통하여외부로연결하도록일측단부에제1 전극패드가형성된제1 베이스기판; 상기제1 베이스기판과마주보도록형성되고, 상기제1 전극패턴에교차하여형성된제2 전극패턴의전기적신호를제2 전극배선을통하여외부로연결하도록일측단부에제2 전극패드가형성된제2 베이스기판; 상기제1 전극배선및 제2 전극배선의폭이동일하도록형성된터치센서를제공한다.

    Abstract translation: 本发明提供了一种触摸传感器,其能够通过均匀地形成电极线的线宽来调节根据电极线的数量的电阻值。 根据本发明的一个实施例的触摸传感器包括:窗基板; 形成为面向窗基板的第一基底基板,在其一个表面上形成有至少一个第一电极图案,并在其一个端部处形成有第一电极焊盘,以将电极图案的电信号通过 第一电极丝; 以及第二基底基板,其形成为面向所述第一基底基板并在其一个端部处形成有第二电极焊盘,以通过第二电极线将与所述第一电极图案交叉的第二电极图案的电信号连接到外部。 第一电极线的宽度等于第二电极线的宽度。

    터치센서
    2.
    发明授权
    터치센서 有权
    触摸传感器

    公开(公告)号:KR101588924B1

    公开(公告)日:2016-01-26

    申请号:KR1020120152391

    申请日:2012-12-24

    CPC classification number: G01L1/005 G06F3/044 G06F2203/04112

    Abstract: 본발명은터치센서에관한것으로, 본발명에따른터치센서는투명기판및 상기투명기판에메시패턴으로형성된전극을포함하고, 상기전극은두께방향으로일측의선폭이타측의선폭보다작게형성된다.

    Abstract translation: 本发明涉及一种触摸传感器,根据本发明的触摸传感器包括透明衬底,并且包括形成在所述透明基板上的网状图案的电极,该电极被形成为比一侧的衣康侧的在厚度方向上的线宽度的线宽度变小。

    터치패널을 포함하는 디스플레이장치
    3.
    发明公开
    터치패널을 포함하는 디스플레이장치 审中-实审
    显示设备,包括触摸面板

    公开(公告)号:KR1020140110349A

    公开(公告)日:2014-09-17

    申请号:KR1020130024537

    申请日:2013-03-07

    CPC classification number: G02F1/13338 G02F1/13394 G02F2202/28 G06F3/041

    Abstract: A display device including a touch panel according to the present invention comprises a touch panel including a window substrate and an electrode pattern formed on a surface of the window substrate; and a display part combined with the surface of the window substrate. A feature of the present invention is that a stopper is formed in a separated area where the display part and the electrode pattern face each other.

    Abstract translation: 包括根据本发明的触摸面板的显示装置包括:触摸面板,其包括窗基板和形成在窗基板的表面上的电极图案; 以及与窗基板的表面结合的显示部。 本发明的特征在于,在显示部和电极图形彼此面对的分离区域中形成有止动件。

    터치 패널의 제조 방법
    4.
    发明公开
    터치 패널의 제조 방법 审中-实审
    触控面板的制造方法

    公开(公告)号:KR1020140083570A

    公开(公告)日:2014-07-04

    申请号:KR1020120153473

    申请日:2012-12-26

    CPC classification number: G06F3/041

    Abstract: A method of manufacturing a touch panel includes the steps of forming an adhesive layer on a transparent substrate; selectively exposing the adhesive layer using a pattern mask; allowing a conductive layer formed on a carrier to adhere onto the adhesive layer; and forming an electrode pattern on the transparent substrate onto which an area attached to a conductive layer is attached by separating the carrier, so that a process of manufacturing a touch panel can be simplified.

    Abstract translation: 触摸屏的制造方法包括在透明基板上形成粘接层的工序; 使用图案掩模选择性地暴露粘合剂层; 允许形成在载体上的导电层粘附到粘合剂层上; 以及通过分离载体而在附着于导电层的区域上的透明基板上形成电极图案,从而可以简化制造触摸面板的工艺。

    터치패널 및 그 제조방법
    5.
    发明公开
    터치패널 및 그 제조방법 审中-实审
    触控面板及其制作方法

    公开(公告)号:KR1020140080038A

    公开(公告)日:2014-06-30

    申请号:KR1020120149402

    申请日:2012-12-20

    Abstract: A touch panel, according to an embodiment of the present invention, blocks noise generated by a display coupled to the touch pattern by separately forming a soundproof layer between a transparent substrate and electrode patterns. Also, a first electrode pattern and a second electrode pattern are formed to intersect each other on the same surface of the transparent substrate through a bridge electrode pattern, formed by patterning the soundproof layer, and a bridge insulation pattern patterned on an insulation layer formed on the soundproof layer. Accordingly, the stability of electrical connections between each electrode pattern is ensured.

    Abstract translation: 根据本发明的实施例的触摸面板通过在透明基板和电极图案之间分开形成隔音层来阻止由耦合到触摸图案的显示器产生的噪声。 此外,第一电极图案和第二电极图案被形成为通过桥接电极图案在透明基板的相同表面上彼此相交,所述桥接电极图案通过图案化隔声层而形成,并且在绝缘层上图案化的桥接绝缘图案形成在 隔音层。 因此,确保了每个电极图案之间的电连接的稳定性。

    수정 진동자 및 수정 진동자의 전극 구조
    6.
    发明公开
    수정 진동자 및 수정 진동자의 전극 구조 有权
    晶体振荡器及其电极结构

    公开(公告)号:KR1020120110975A

    公开(公告)日:2012-10-10

    申请号:KR1020110029191

    申请日:2011-03-31

    Inventor: 박장호

    CPC classification number: H03H9/177 H03H9/131

    Abstract: PURPOSE: A crystal oscillator and an electrode structure thereof are provided to reduce frequency shift due to thermal stress by minimizing the thermal expansion coefficient difference between a crystal piece and an electrode. CONSTITUTION: A crystalline lens vibrates with an electric signal. A first electrode(12a) and a second electrode(12b) include a first electrode layer and a second electrode layer which are laminated on both sides of the crystalline lens. The first electrode layer includes one or more selected from a group consisting of an alloy including either Cr(Chromium), Ni(Nitinol), or Ti(Titanium). A thickness ratio of the first electrode layer over the thickness of the first electrode or the second electrode is 3-30%. The second electrode layer includes Cu(Cuprum) or the alloy including the Cu. The thickness ratio of the second electrode layer over the thickness of the first electrode or the second electrode is 70-97%.

    Abstract translation: 目的:提供一种晶体振荡器及其电极结构,以通过最小化晶片与电极之间的热膨胀系数差来减少热应力引起的频移。 结构:晶状体用电信号振动。 第一电极(12a)和第二电极(12b)包括层叠在晶状体两侧的第一电极层和第二电极层。 第一电极层包括选自由Cr(铬),Ni(镍钛诺)或Ti(钛)组成的组中的一种或多种。 第一电极层与第一电极或第二电极的厚度的厚度比为3-30%。 第二电极层包括Cu(Cuprum)或包含Cu的合金。 第二电极层与第一电极或第二电极的厚度的厚度比为70-97%。

    어레이 타입 칩 저항기
    7.
    发明授权

    公开(公告)号:KR101058602B1

    公开(公告)日:2011-08-22

    申请号:KR1020090083522

    申请日:2009-09-04

    Abstract: 본 발명은 어레이 타입 칩 저항기에 관한 것이다.
    본 발명의 어레이 타입 칩 저항기는, 양측면에 다수의 홈이 등간격으로 형성된 기판; 상기 기판의 하면 양측부에 형성된 하부전극; 상기 하부전극과 전기적으로 연결되어 상기 기판의 측면 일부까지 연장 형성된 측면전극; 상기 기판 하면의 상기 하부전극 사이에 개재된 저항체; 상기 저항체 상에 복개되되, 양측부가 상기 하부전극의 일부를 동시에 복개하는 보호층; 상기 보호층의 외측으로 노출된 상기 하부전극과 접촉되는 레벨링 전극; 및 상기 레벨링 전극 상에 형성된 도금층;을 함하며, 저항체가 기판 하면의 하부전극 내측에 인쇄되기 때문에 기판 실장시 외부충격에 의한 저항체의 파손을 방지할 수 있는 장점이 있다.
    칩 저항기, 저항체, 전극, 도금층, 절연층, 쇼트

    어레이 타입 칩 저항기
    8.
    发明公开
    어레이 타입 칩 저항기 有权
    阵列型芯片电阻

    公开(公告)号:KR1020110025453A

    公开(公告)日:2011-03-10

    申请号:KR1020090083522

    申请日:2009-09-04

    Abstract: PURPOSE: An array type chip resistor is provided to prevent a short circuit between electrodes by forming only lateral electrode without a top electrode. CONSTITUTION: In an array type chip resistor, a substrate(110) has a plurality of grooves on both sides with an equal space between them. A bottom electrode(130) is formed in both sides of lower part of the substrate. A lateral electrode(150) is electrically connected to the bottom electrode. A leveling electrode(170) is touched with the bottom electrode which is exposed from a protective layer. A plating layer is formed on the leveling electrode.

    Abstract translation: 目的:提供阵列型芯片电阻器,通过仅形成没有顶部电极的横向电极来防止电极之间的短路。 构成:在阵列型芯片电阻器中,基板(110)的两侧具有多个相互间隔的槽。 底部电极(130)形成在基板的下部的两侧。 横向电极(150)电连接到底部电极。 平底电极(170)与从保护层露出的底部电极接触。 在平整电极上形成镀层。

    플립칩형 표면탄성파 장치
    9.
    发明公开
    플립칩형 표면탄성파 장치 失效
    FLIP芯片型表面波形装置,每个导电部件由每个焊接块连接

    公开(公告)号:KR1020040082775A

    公开(公告)日:2004-09-30

    申请号:KR1020030017444

    申请日:2003-03-20

    Inventor: 박장호

    CPC classification number: H03H9/64 H03H9/059 H03H9/125 H03H9/25

    Abstract: PURPOSE: A flip chip type surface acoustic wave device is provided to reduce the size of the chip and the package by manufacturing it with a compact size with implementing various functions. CONSTITUTION: A flip chip type surface acoustic wave device includes a piezoelectric wafer(11), a first functional pattern(12A), a second functional pattern(12B), a package(13), a first conductive part(15), a second conductive part(16), a first solder bump(14A) and a second solder bump(14B). The first functional pattern(12A) is formed on a surface of the piezoelectric wafer(11) and provided with a functional part of the surface acoustic wave filter and the connection terminal. The second functional pattern(12B) formed on the other surface of the piezoelectric wafer(11) and provided with a functional part of the surface acoustic filter and a connection terminal. The package(13) receives the piezoelectric wafer(11) inside thereof. The first conductive part(15) is formed on the inside of the package(13) for electrically connecting to the outside. The second conductive part(16) is formed on the other surface of the package(13) for electrically connecting to the outside. The first solder bump(14A) is electrically connected to the first conductive part(15A) and the terminal of the first functional pattern(12A). And, the second solder bump(14B) is electrically connected to the second conductive part(16) and the terminal of the second functional pattern(12B).

    Abstract translation: 目的:提供一种倒装芯片型表面声波装置,通过实现各种功能,通过以紧凑​​的尺寸制造芯片和封装来减小芯片和封装的尺寸。 构成:倒装芯片型弹性表面波器件包括压电晶片(11),第一功能图案(12A),第二功能图案(12B),封装(13),第一导电部件(15),第二 导电部分(16),第一焊料凸块(14A)和第二焊料凸块(14B)。 第一功能图案(12A)形成在压电晶片(11)的表面上,并具有表面声波滤波器和连接端子的功能部分。 形成在压电晶片(11)的另一个表面上并具有声表面波滤波器的功能部分的第二功能图案(12B)和连接端子。 封装(13)在其内部接收压电晶片(11)。 第一导电部件(15)形成在用于电连接到外部的封装(13)的内部。 第二导电部分(16)形成在封装(13)的另一个表面上,用于电连接到外部。 第一焊料凸块(14A)电连接到第一导电部件(15A)和第一功能图案(12A)的端子。 并且,第二焊料凸点(14B)与第二导电部(16)和第二功能图案(12B)的端子电连接。

    터치 패널
    10.
    发明公开
    터치 패널 审中-实审
    触控面板

    公开(公告)号:KR1020150117859A

    公开(公告)日:2015-10-21

    申请号:KR1020140043502

    申请日:2014-04-11

    Abstract: 본발명은터치패널에관한것으로본 발명의일 실시예에따른터치패널은기판; 상기기판의베젤영역에형성되는인쇄부; 및상기기판및 상기인쇄부상에마련되고, 메쉬형상의복수의단위셀로구성되는도체선을포함하는복수의전극; 을포함하고, 상기복수의단위셀 중상기기판과상기인쇄부의경계선에오버랩되는복수의단위셀 각각을구성하는선들의일부는단선될수 있다.

    Abstract translation: 本发明涉及触摸面板。 根据本发明的实施例的触摸面板包括:基板; 形成在基板的边框区域上的印刷单元; 以及多个电极,其具有由网格形状的单位单元制成的导电线,其中电极形成在基板和印刷单元上。 可以切割构成与基板和印刷单元之间的边界线重叠的每个单元的一些线。

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