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公开(公告)号：KR101055547B1
公开(公告)日：2011-08-08
申请号：KR1020080098791
申请日：2008-10-08
Applicant: 삼성전기주식회사
Abstract: 본 발명은 솔더 페이스트를 인쇄하는 스퀴지 장치에 관한 것이고, 보다 상세하게는 솔더 페이스트의 젖음성을 양호한 상태로 유지하면서 솔더 페이스트의 인쇄공정을 수행할 수 있는 차폐막을 갖는 스퀴지 장치에 관한 것이다. 본 발명에 따른 차폐막을 갖는 스퀴지 장치에 의하면, 솔더 페이스트의 인쇄시 솔더 페이스트의 구성 성분이 증발하는 것을 억제할 수 있기 때문에 솔더 페이스트가 인쇄에 적합한 젖음성을 갖는 상태에서 인쇄공정이 이루어질 수 있도록 할 수 있다.
스퀴지(SQUEEGEE), 차폐막, 솔더 페이스트-
公开(公告)号：KR1020090055750A
公开(公告)日：2009-06-03
申请号：KR1020070122546
申请日：2007-11-29
Applicant: 삼성전기주식회사
CPC classification number: H01L23/60 , H01L21/0337 , H01L21/4867 , H01L23/481
Abstract: A mask for a paste printing is provided to prevent generation of electrostatic discharge due to friction of a mask and a metal squeeze by using the mask for a paste printing in which a plating layer is formed in an outer surface of a base. A mask for a paste printing includes a plate type base(110) and a plating layer(120). A penetration hole(112) of a fixed pattern is formed in the base. The plating layer is formed by plating a conductive material in an outer surface of the base, and is made of Cu or Ag. The base is made of Ni or Ni alloy. The base is formed by using a Ni electrotyping plating method.
Abstract translation: 提供了一种用于糊状印刷的掩模，以通过使用其中在基底的外表面中形成镀层的糊状印刷用掩模来防止由于掩模和金属挤压而产生的静电放电。 用于糊印的掩模包括板型基底（110）和镀层（120）。 在基座上形成固定图形的贯通孔（112）。 镀层通过在基体的外表面镀覆导电材料形成，并由Cu或Ag制成。 底座由Ni或Ni合金制成。 该基底通过使用Ni电镀法形成。
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公开(公告)号：KR100900681B1
公开(公告)日：2009-06-01
申请号：KR1020070122116
申请日：2007-11-28
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/10
Abstract: A method for forming a solder bump is provided to form a micro pitch by a printing method and to prevent the short failure between solder bumps. A mask(20) with a plurality of pattern holes(21) is arranged on a substrate(10) with a metal pattern(11). A solder paste coated on the mask is filled in a pattern hole by moving a squeezer in contact with the upper part of the mask. A bump(55) is formed on the substrate by separating the mask and the substrate. The filler(60) is filled between bumps by filling the filler on the substrate. The substrate filled with the filter is reflowed. The filter is removed from the substrate after integrating the bump and the metal pattern.
Abstract translation: 提供形成焊料凸点的方法以通过印刷方法形成微间距并防止焊料凸块之间的短路故障。 具有多个图形孔（21）的掩模（20）被布置在具有金属图案（11）的基板（10）上。 涂覆在面罩上的焊膏通过移动与面罩上部接触的挤压器而填充在图案孔中。 通过分离掩模和基板在基板上形成凸块（55）。 通过将填料填充在基材上，将填料（60）填充到凸块之间。 填充有过滤器的基板被回流。 在凸块和金属图案集成之后，从基板上去除过滤器。
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Patent Agency Ranking
公开(公告)号：KR100887056B1
公开(公告)日：2009-03-04
申请号：KR1020070122465
申请日：2007-11-29
Applicant: 삼성전기주식회사
CPC classification number: H05K3/3484 , H05K1/0259 , H05K2203/0139
Abstract: A screen print apparatus is provided to remove static electricity due to friction of a blade and a mask by adding a capacitor between the blade and a squeeze body. A screen print apparatus prints a conductive paste on a substrate by using a mask having a hole having a certain pattern and includes a blade(110), a squeeze body(120), and a capacitor. The blade fills the conductive paste into the hole of mask by reciprocating and is added to the squeeze body by an insulating member(140). The capacitor is arranged between the squeeze body and the blade and removes the statistic electricity due to friction between the blade and the mask. The capacity of the capacitor is 50uF or 200uF, and the squeeze body is grounded.
Abstract translation: 提供丝网印刷装置，通过在叶片和挤压体之间增加电容器来除去由于叶片和面罩的摩擦而产生的静电。 丝网印刷装置通过使用具有一定图案的孔的掩模将导电浆料印刷在基板上，并且包括叶片（110），挤压体（120）和电容器。 刀片通过往复运动将导电膏填充到掩模孔中，并通过绝缘构件（140）加入到挤压体中。 电容器设置在挤压体和叶片之间，并且由于叶片和面罩之间的摩擦而去除统计电量。 电容器的容量为50uF或200uF，挤压体接地。
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公开(公告)号：KR1020100039714A
公开(公告)日：2010-04-16
申请号：KR1020080098791
申请日：2008-10-08
Applicant: 삼성전기주식회사
CPC classification number: B41F15/42 , B41F31/027 , H05K3/12
Abstract: PURPOSE: A squeezing device comprising a shielding film is provided to process printing of solder paste and to maintain wettability of the solder paste, which is suitable to process printing, by controlling evaporating of component in the solder paste. CONSTITUTION: A squeezing device comprising a shielding film comprises: a squeegee(500) which is horizontally movable along a guide rail(300) and prints solder paste(400) on a substrate(100) ; and a shielding film(700) which is horizontally movable along the guide rail with the squeegee, prepares a room for printing by covering the top of a printing area, and attaches an elastic pad on the bottom in order to prevent a mask(200) from damaging.
Abstract translation: 目的：提供一种包括屏蔽膜的挤压装置，用于通过控制焊膏中组分的蒸发来处理焊膏的印刷和保持适于处理印刷的焊膏的润湿性。 构成：包括屏蔽膜的挤压装置包括：可沿导轨（300）水平移动的刮板（500），并在基板（100）上印刷焊膏（400）; 以及通过刮板沿着导轨水平移动的屏蔽膜（700），通过覆盖打印区域的顶部来准备打印空间，并且将弹性垫附接到底部以防止掩模（200） 从破坏。
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公开(公告)号：KR1020100032634A
公开(公告)日：2010-03-26
申请号：KR1020080091605
申请日：2008-09-18
Applicant: 삼성전기주식회사
CPC classification number: H05K13/0084 , B65G1/10 , H05K13/0069
Abstract: PURPOSE: A magazine and a PMC(Post Mold Cure) method thereof are provided to maintain the flat state of a PCB by applying proper pressure to the PCB through the top compression plate. CONSTITUTION: The single-side of a housing is opened. A PCB(10) is installed in the internal space of the housing. A top part compression plate(300) is installed in the upper part of inner side of the housing. A lower part supporting plate(500) is installed in the bottom part of inner side of the housing. A driving bar(400) drives the top part compression plate to a top and bottom direction. A pressure indication part indicates a pressure delivered to the lower part supporting plate. A guide bar prevents the rotation of the top part compression plate.
Abstract translation: 目的：提供一种杂志和PMC（后模具固化）方法，以通过通过顶部压缩板对PCB施加适当的压力来保持PCB的平坦状态。 构成：外壳的单面打开。 PCB（10）安装在外壳的内部空间中。 顶部压缩板（300）安装在壳体内侧的上部。 下部支撑板（500）安装在壳体内侧的底部。 驱动杆（400）将顶部压缩板驱动到顶部和底部方向。 压力指示部分表示输送到下部支撑板的压力。 导杆防止顶部压缩板的旋转。
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公开(公告)号：KR1020090013606A
公开(公告)日：2009-02-05
申请号：KR1020070077866
申请日：2007-08-02
Applicant: 삼성전기주식회사
IPC: H01L21/60
CPC classification number: H01L2224/11 , H01L2924/00012
Abstract: A formation method of the solder bump is provided to prevent the generation of the small bump and missing bump according to the detachability fault of the solder paste by forming a mask with the material which does not react to the solder paste. Provided is the substrate(10) including the circuit pattern(12). The mask(18) is positioned on the substrate. The mask has the circuit pattern and the hole. The hole is filled with the solder paste by printing he solder paste after coating with the solder paste on the mask. The solder paste is reflown and the solder bump is formed. The mask is removed.
Abstract translation: 提供焊料凸块的形成方法，以通过用不与焊膏反应的材料形成掩模来防止根据焊膏的可脱离性故障产生小凸起和缺失凸起。 提供了包括电路图案（12）的基板（10）。 掩模（18）位于基板上。 掩模具有电路图案和孔。 通过在掩模上涂覆焊膏后印刷焊膏，填充焊膏。 焊料膏被重熔并形成焊料凸块。 去除面具。
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公开(公告)号：KR100848887B1
公开(公告)日：2008-07-29
申请号：KR1020070086053
申请日：2007-08-27
Applicant: 삼성전기주식회사
IPC: H01L21/027
CPC classification number: H01L21/0274 , G03F7/16 , G03F7/2041 , H01L21/0337
Abstract: A method for surface treatment of a metal mask and a bumping method using the same are provided to improve fluidity of solder cream by forming a glass crystal coating layer on the metal mask surface. A metal mask(10) including a plurality of holes(11) is prepared. The prepared metal mask is cleaned by performing a cleaning process using isopropylene. A preprocess of the cleaned metal mask is performed by dipping the cleaned mask into a basic solution. The preprocessed metal mask is dried at the room temperature. The dried metal mask is coated with a coating solution including polysilazane. The coated metal mask is hardened and cleaned.
Abstract translation: 提供金属掩模的表面处理方法和使用其的凸起方法，以通过在金属掩模表面上形成玻璃晶体涂层来改善焊膏的流动性。 制备包括多个孔（11）的金属掩模（10）。 通过使用异丙烯进行清洁处理来清洁所制备的金属掩模。 通过将清洁的面罩浸入基本溶液中来进行清洁的金属掩模的预处理。 预处理的金属掩模在室温下干燥。 干燥的金属掩模用包括聚硅氮烷的涂布溶液涂覆。 涂覆的金属掩模被硬化和清洁。
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