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公开(公告)号：KR101499281B1
公开(公告)日：2015-03-06
申请号：KR1020110131500
申请日：2011-12-09
Applicant: 삼성전기주식회사
Abstract: 본 발명의 일 실시 예에 따른 검사용 마크는 제1방향으로 마주하여 이격 형성된 한 쌍의 제1단자 및 상기 제1방향에 대하여 수직인 제2방향으로 마주하여 이격 형성되는 한 쌍의 제2단자를 포함하는 전압인가단자와, 상기 한 쌍의 제1단자 및 상기 한 쌍의 제2단자를 연결하는 제1-1패턴 및 제1-2패턴을 포함하는 제1패턴과, 상기 제1-1패턴 및 제1-2패턴 양측의 일면 또는 타면에 일단이 연결되어 연장 형성된 복수 개의 제2패턴과, 상기 제2패턴의 타단에 연결 형성된 복수 개의 전압측정단자와, 상기 전압인가단자 및 전압측정단자를 노출시키는 제1개구부와 상기 제1패턴을 노출시키는 제2개구부를 갖는 솔더 레지스트층 및 상기 제1개구부 및 제2개구부를 통해 노출된 전압인가단자, 전압측정단자 및 제1패턴에 형성된 표면처리층을 포함하며, 상기 제1패턴의 제1-1패턴 및 제1-2패턴은 서로 교차하며, 상기 제2개구부는 상기 제1패턴의 교차된 부분을 노출시킨다.
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公开(公告)号：KR1020140069941A
公开(公告)日：2014-06-10
申请号：KR1020120137837
申请日：2012-11-30
Applicant: 삼성전기주식회사
CPC classification number: G01N29/07 , G01B17/04 , G01N29/22 , G01N29/223 , G01N2291/011
Abstract: The present invention relates to a substrate warping measurement device and a measurement method using the same. The substrate warping measurement device comprises a surface plate with multiple through holes; a measurement unit which is formed on one side of the surface plate and has an ultrasonic transceiver transmitting and receiving ultrasonic waves to or from a substrate; and a control unit which controls the measurement unit.
Abstract translation: 本发明涉及一种基板翘曲测量装置及其测量方法。 基板翘曲测量装置包括具有多个通孔的表面板; 测量单元，其形成在所述表面板的一侧上，并且具有超声波收发器，该超声波收发器向基板发送和接收超声波; 以及控制单元，其控制测量单元。
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公开(公告)号：KR1020140047875A
公开(公告)日：2014-04-23
申请号：KR1020120114144
申请日：2012-10-15
Applicant: 삼성전기주식회사
Abstract: The present invention relates to a carrier substrate and a method for manufacturing a printed circuit board using the same. The carrier substrate according to the present invention includes a core layer which includes a liquid permeating structure, an adhesive layer which is coated on the upper and lower sides of the core layer and is chemically dissolved by a chemical dissolving material, and a copper foil layer which is bonded to the upper and lower sides of the core layer by the adhesive layer.
Abstract translation: 本发明涉及一种载体基板及其制造方法。 根据本发明的载体基板包括芯层，其包括液体渗透结构，涂覆在芯层的上侧和下侧并通过化学溶解材料化学溶解的粘合剂层，以及铜箔层 其通过粘合剂层结合到芯层的上侧和下侧。
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公开(公告)号：KR1020130064891A
公开(公告)日：2013-06-19
申请号：KR1020110131500
申请日：2011-12-09
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A mark for inspection is provided to detect an eccentricity and eccentric direction of a solder resist opening part in a correct value. CONSTITUTION: A voltage appliance terminal includes a pair of first terminals(1,3) which are separately formed to face each other in a first direction and a pair of second terminals(2,4) which are separately formed in a second direction which is perpendicular to the first direction. A first pattern includes a 1-1 pattern and a 1-2 pattern and respectively connects the pair of the first terminals with the pair of second terminals. A second pattern is extended by being connected to the one surface or the other surface of the both sides of the 1-1 pattern and the 1-2 pattern. Multiple voltage measurement terminals are connected to the other end of the second pattern. A solder resist layer(150) comprises a first opening part which exposes the voltage appliance terminal and the voltage measurement terminal and a second opening part which exposes the first pattern. A surface processing layer(160) is formed in the voltage appliance terminal, the voltage measurement terminal, and the first pattern.
Abstract translation: 目的：提供检查用标记，以正确的值检测阻焊剂开口部的偏心方向和偏心方向。 构成：电压设备端子包括分别形成为在第一方向上彼此面对的一对第一端子（1,3）和在第二方向上分开形成的一对第二端子（2,4），第二端子 垂直于第一方向。 第一图案包括1-1图案和1-2图案，并且将所述一对第一端子与所述一对第二端子分别连接。 通过连接到1-1图案和1-2图案的两侧的一个表面或另一个表面来延伸第二图案。 多个电压测量端子连接到第二模式的另一端。 阻焊层（150）包括暴露电压设备端子和电压测量端子的第一开口部分和暴露第一图案的第二开口部分。 在电压设备端子，电压测量端子和第一图案中形成表面处理层（160）。
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公开(公告)号：KR1020130055343A
公开(公告)日：2013-05-28
申请号：KR1020110121041
申请日：2011-11-18
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to enable a high densification or thinning of a substrate and reduce a manufacturing cost. CONSTITUTION: A metal pattern layer(120) forms a pattern on a metal layer. The metal pattern layer forms a pattern by removing a part of the metal layer and forms a plating layer on the metal layer on which the pattern is formed. A resist(140) includes a first resist(142) and a second resist(144). The first resist is coated on one side of the metal pattern layer and opens a first pad formation area. The second resist is coated on the other side of the metal pattern layer and opens a second pad formation area. A pad(160) includes a first pad(162) and a second pad(164). The first pad is formed in the first pad formation area. The second pad is formed in the second pad formation area.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以使基板的高致密化或变薄，并降低制造成本。 构成：金属图案层（120）在金属层上形成图案。 金属图案层通过去除金属层的一部分而形成图案，并在其上形成图案的金属层上形成镀层。 抗蚀剂（140）包括第一抗蚀剂（142）和第二抗蚀剂（144）。 第一抗蚀剂涂覆在金属图案层的一侧上，并打开第一焊盘形成区域。 第二抗蚀剂涂覆在金属图案层的另一侧上，并打开第二焊盘形成区域。 垫（160）包括第一垫（162）和第二垫（164）。 第一焊盘形成在第一焊盘形成区域中。 第二焊盘形成在第二焊盘形成区域中。
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Patent Agency Ranking
公开(公告)号：KR1020130039235A
公开(公告)日：2013-04-19
申请号：KR1020110103761
申请日：2011-10-11
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/11
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the degree of freedom in a design by forming solder ball of various pitches and various heights according to a resist size. CONSTITUTION: A base substrate(110) has a connection pad(120). A solder resist layer(130) has a first open part on the connection pad. A solder ball(160) is formed on the first open part. The solder ball is divided into a first layer and a second layer based on a connection pad surface. The diameter of the first layer is different from the diameter of the second layer.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过根据抗蚀剂尺寸形成各种间距和各种高度的焊球来提高设计自由度。 构成：基底（110）具有连接垫（120）。 阻焊层（130）在连接焊盘上具有第一开口部分。 在第一开放部分上形成焊球（160）。 基于连接焊盘表面，焊球被分成第一层和第二层。 第一层的直径不同于第二层的直径。
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公开(公告)号：KR1020130032529A
公开(公告)日：2013-04-02
申请号：KR1020110096174
申请日：2011-09-23
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/00014
Abstract: PURPOSE: A PCB(Printed Circuit Board) and a manufacturing method thereof are provided to simultaneously satisfy high functionalization and to reduce the thickness of the PCB. CONSTITUTION: A PCB(100) comprises an insulation layer(110), a circuit pattern(120), and a cavity(140) for inserting a semiconductor chip. The insulation layer includes a first insulation material and a second insulation material formed on the first insulation material. The circuit pattern is formed at an outer layer and an inner layer of the insulation layer. The cavity for inserting the semiconductor chip is formed at the first or the second insulation material.
Abstract translation: 目的：提供PCB（印刷电路板）及其制造方法，以同时满足高功能化并减小PCB的厚度。 构成：PCB（100）包括绝缘层（110），电路图案（120）和用于插入半导体芯片的空腔（140）。 绝缘层包括形成在第一绝缘材料上的第一绝缘材料和第二绝缘材料。 电路图案形成在绝缘层的外层和内层。 用于插入半导体芯片的空腔形成在第一或第二绝缘材料上。
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公开(公告)号：KR1020110128532A
公开(公告)日：2011-11-30
申请号：KR1020100048034
申请日：2010-05-24
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/13
Abstract: PURPOSE: A semiconductor package substrate and a manufacturing method thereof are provided to reduce conspicuously manufacture costs by manufacturing a pair of cross section circuit boards at the same time using a carrier. CONSTITUTION: A circuit pattern is formed in one side of an insulating layer(104) and includes a connection pad. A metal bump(103) is formed in the insulating layer for inter-layer electrical connection. An outer connection terminal is formed on the metal bump of the other side of the insulating layer and is electrically connected with a circuit pattern of one side of the insulating layer through the metal bump. A protective layer(108) is formed on both sides of the insulating layer. The protective layer has an opening which exposes the surface of the metal bump in which the connection pad and the outer connection terminal are formed.
Abstract translation: 目的：提供半导体封装基板及其制造方法，以通过使用载体同时制造一对横截面电路板来减少显着的制造成本。 构成：电路图案形成在绝缘层（104）的一侧，并且包括连接垫。 在用于层间电连接的绝缘层中形成金属凸块（103）。 外绝缘端子形成在绝缘层另一侧的金属凸块上，并通过金属凸块与绝缘层一侧的电路图形电连接。 在绝缘层的两侧形成保护层（108）。 保护层具有露出形成有连接垫和外部连接端子的金属凸块的表面的开口。
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公开(公告)号：KR1020100120501A
公开(公告)日：2010-11-16
申请号：KR1020090039356
申请日：2009-05-06
Applicant: 삼성전기주식회사
IPC: H05K3/40 , H01L23/488
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H01L2924/15311 , H01L2924/00
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to implement a high density pattern by forming a bump through a coating or paste filling process. CONSTITUTION: A circuit layer is formed on an insulating layer(100) in order to transfer an electric signal. The circuit layer comprises an outer connection pad(110). A bump(500) is formed on the outer connection pad. A bump support part(300) surrounds the side of the bump so that the upper side of the bump is exposed. A solder resist layer(130) is formed on the insulating layer. The opening of the solder resist layer exposes the outer connection pad. A protective layer is formed on the upper side of the bump.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过涂布或糊料填充工艺形成凸块来实现高密度图案。 构成：为了传送电信号，在绝缘层（100）上形成电路层。 电路层包括外连接焊盘（110）。 凸缘（500）形成在外连接垫上。 凸起支撑部分（300）围绕凸块的侧面，使得凸起的上侧被暴露。 在绝缘层上形成阻焊层（130）。 阻焊层的开口露出外连接焊盘。 在凸块的上侧形成有保护层。
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公开(公告)号：KR1020100071587A
公开(公告)日：2010-06-29
申请号：KR1020080130362
申请日：2008-12-19
Applicant: 삼성전기주식회사
CPC classification number: H05K1/03 , C08G73/1067 , H05K1/115 , H05K3/46
Abstract: PURPOSE: A printed circuit board is provided to supply an agreeable environment to a worker and a consumer by including a fragment material layer. CONSTITUTION: A printed circuit board comprises an insulating layer(110), a circuit pattern(120), and an aromatic layer(130). The circuit pattern is formed in the insulating layer. The aromatic layer is formed in the insulating layer. The aromatic layer comprises perfume(134). The perfume is charged into the pore of a porous sheet.
Abstract translation: 目的：提供印刷电路板，通过包括碎片材料层为工人和消费者提供令人满意的环境。 构成：印刷电路板包括绝缘层（110），电路图案（120）和芳族层（130）。 电路图案形成在绝缘层中。 芳族层形成在绝缘层中。 芳香层包含香料（134）。 将香料装入多孔片的孔中。
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