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公开(公告)号：KR1020110064471A
公开(公告)日：2011-06-15
申请号：KR1020090121099
申请日：2009-12-08
Applicant: 삼성전기주식회사
IPC: H01L23/48
CPC classification number: H01L23/49811 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A package substrate and manufacturing method thereof are provided to increase the height of a solder joint by improving the structure of a solder bump, thereby realizing a fine pitch. CONSTITUTION: A substrate(10) includes at least one conductive pad(101). An insulating layer(102) includes an opening which exposes the conductive pad. A columnar terminal(104) is formed on the conductive pad in the opening. A plating seed layer is formed on the bottom of the columnar terminal. A solder bump(106) is formed on the columnar terminal.
Abstract translation: 目的：提供一种封装基板及其制造方法，通过改善焊料凸块的结构来提高焊点的高度，从而实现微细间距。 构成：衬底（10）包括至少一个导电垫（101）。 绝缘层（102）包括露出导电垫的开口。 在开口中的导电垫上形成柱状端子（104）。 在柱状端子的底部形成电镀种子层。 在柱状端子上形成焊料凸块（106）。
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公开(公告)号：KR1020110028838A
公开(公告)日：2011-03-22
申请号：KR1020090086453
申请日：2009-09-14
Applicant: 삼성전기주식회사
IPC: H01L21/60
Abstract: PURPOSE: A post forming method, a printed circuit board manufacturing method using the same, and an electronic component manufacturing method are provided to form the post on the electrode pad without forming a seed layer on the solder resist by depositing the solder resist after forming the post. CONSTITUTION: An electrode pad is formed on a substrate or an electric component(S110). The post of the conductivity is laminated on an electrode pad(S120). The resist layer equipped with the post pattern exposing the electrode pad according to the post is formed(S122). The conductive material is charged in the post pattern(S124). The solder resist covering up the electrode pad is laminated(S130).
Abstract translation: 目的：提供后成型方法，使用其的印刷电路板制造方法和电子部件制造方法，以在电极焊盘上形成柱，而不在形成焊料后通过沉积阻焊剂而在阻焊剂上形成种子层 帖子。 构成：在基板或电气部件上形成电极焊盘（S110）。 将电导率层压在电极焊盘上（S120）。 形成配备有根据柱状物暴露电极焊盘的柱状图案的抗蚀剂层（S122）。 导电材料以柱状图案充电（S124）。 层叠覆盖电极焊盘的阻焊剂（S130）。
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公开(公告)号：KR1020110028145A
公开(公告)日：2011-03-17
申请号：KR1020090086101
申请日：2009-09-11
Applicant: 삼성전기주식회사
IPC: B24B53/00 , B24B53/12 , H01L21/304
CPC classification number: B24B53/12 , B24B53/005 , B24B55/02 , H01L21/304
Abstract: PURPOSE: An automatic dressing grinder is provided to reduce dressing time by simultaneously dressing all grinding rods using a dressing board. CONSTITUTION: An automatic dressing grinder comprises one or more grinding rods(120), a dressing board(130), and a driving unit(140). The grinding rods grind a substrate. The dressing board is arranged to be parallel with the shaft of the grinding rods. The dressing board dresses the grinding rods. The driving unit moves the grinding rods or the dressing board to contact with each other and dresses the grinding rods.
Abstract translation: 目的：提供自动修整磨床，通过使用修整板同时整理所有的研磨棒来减少修整时间。 构成：自动修整研磨机包括一个或多个研磨杆（120），修整板（130）和驱动单元（140）。 研磨棒研磨基材。 修整板布置成与研磨棒的轴平行。 梳妆台穿着磨棒。 驱动单元使研磨棒或修整板相互接触并连接研磨棒。
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公开(公告)号：KR1020090087191A
公开(公告)日：2009-08-17
申请号：KR1020080012489
申请日：2008-02-12
Applicant: 삼성전기주식회사
CPC classification number: H05K3/125 , H05K3/1233 , H05K3/3489
Abstract: A printing apparatus and a printing method are provided to prevent generation of a void by preventing hardening of a printing solution through a heater. A printing apparatus includes a chamber(11), a piston(13), and a heater. The chamber is made of high thermal conductive metal material. The chamber receives a printing solution(24). A nozzle(12) is formed in one side of the chamber. A whole part or a part of a side wall of the chamber is tilted toward a nozzle direction. The piston provides pressure to an inner part of the chamber. The heater provides a heat to the printing solution. The heater is a coil(14). The coil is built in a side wall of the chamber. The coil delivers the heat to the printing solution through the side wall of the chamber in order to prevent hardening of the printing solution.
Abstract translation: 提供了一种打印装置和打印方法，以防止通过加热器硬化印刷溶液而产生空隙。 打印装置包括室（11），活塞（13）和加热器。 该室由高导热金属材料制成。 该室接收印刷溶液（24）。 喷嘴（12）形成在腔室的一侧。 腔室的侧壁的整个部分或一部分朝向喷嘴方向倾斜。 活塞为腔室的内部提供压力。 加热器为印刷溶液提供热量。 加热器是线圈（14）。 线圈内置在腔室的侧壁上。 线圈通过室的侧壁将热量传递到印刷溶液，以防止印刷溶液的硬化。
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公开(公告)号：KR100878918B1
公开(公告)日：2009-01-15
申请号：KR1020070005222
申请日：2007-01-17
Applicant: 삼성전기주식회사
IPC: H01L21/60
CPC classification number: H01L2224/48 , H01L2224/48095 , H01L2224/48465 , H01L2224/78 , H01L2224/7815 , H01L2224/78301 , H01L2224/78302 , H01L2224/85 , H01L2224/8502 , H01L2224/85181 , H01L2224/85205 , H01L2224/8592 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/00 , H01L2924/00012
Abstract: 본 발명은 절연 피복 와이어 본딩을 할 수 있는 와이어 본딩 장치 및 와이어 본딩 방법에 관한 것이다. 본 발명에 따른 와이어 본딩 장치는, 와이어가 통과하는 제1 경로와 절연 수지가 통과하는 제2 경로가 내부에서 분리되어 형성되는 캐필러리를 포함한다. 본 발명에 따른 와이어 본딩 방법은, 와이어와 함께 상기 와이어를 피복하는 절연 수지를 함께 공급하여 절연 피복 와이어 본딩을 형성한다.
와이어 본딩, 절연, 캐필러리, 경로Abstract translation: 提供引线接合装置和引线接合方法，以防止在毛细管内彼此分离第一和第二路径之前，在排出线之前污染线。 线（30）穿过第一路径（202）。 绝缘树脂（40）穿过第二路径（204）。 毛细管包括第一路径和第二路径。 第一路径和第二路径彼此分离。 第二路径形成为围绕第一路径。 第二路径的平面形状为环状。 第二路径的排出部（204b）位于第一路径的排出部（202b）。 形成打开/关闭第二路径的排出部的打开/关闭单元（206）。
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Patent Agency Ranking
公开(公告)号：KR100861605B1
公开(公告)日：2008-10-07
申请号：KR1020070032387
申请日：2007-04-02
Applicant: 삼성전기주식회사
CPC classification number: C02F1/48 , B01D35/06 , C02F1/461 , C02F2201/4616
Abstract: A method and an apparatus for producing electrolyzed water using an electromagnetic field are provided to increase cleaning and ionizing efficiencies of contaminated water using the electromagnetic field, recycle multiple electrodes without using an ion resin, and produce electrolyzed water economically. An apparatus for producing electrolyzed water using an electromagnetic field comprises: (a) a porous filter(102); (b) an electrolytic cell(103) which is connected to the porous filter, and in which a plurality of electrodes(103a) and counter electrodes(103b) are alternately disposed in a row in a state that the electrodes and counter electrodes are spaced from one another; (c) a pair of magnetic field application units(104a,104b) mounted at both outer sides of the electrolytic cell and disposed in the vertical direction with respect to the electrodes and counter electrodes of the electrolytic cell; (d) a power supply unit(105) connected to the electrolytic cell; and a unit connected to the electrolytic cell or/and the magnetic field application units to vary the direction of an electric current or/and a magnetic field applied into the electrolytic cell. The apparatus further comprises a pump(101) connected to a front part of the porous filter. Further, a space between the electrodes and the counter electrodes is 1mm to 5cm.
Abstract translation: 提供一种使用电磁场生产电解水的方法和装置，以增加使用电磁场的污染水的清洁和电离效率，不使用离子树脂循环多个电极，并经济地生产电解水。 一种使用电磁场产生电解水的设备包括：（a）多孔过滤器（102）; （b）连接到多孔过滤器的电解池（103），其中多个电极（103a）和对置电极（103b）在电极和对电极间隔开的状态下交替布置成行 从彼此; （c）安装在电解槽的两个外侧并相对于电解槽的电极和对电极在垂直方向上设置的一对磁场施加单元（104a，104b）; （d）连接到电解槽的电源单元（105）; 以及连接到电解池或/和磁场施加单元以改变施加到电解槽中的电流方向和/或磁场的单元。 该装置还包括连接到多孔过滤器的前部的泵（101）。 此外，电极和对置电极之间的间隔为1mm至5cm。
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公开(公告)号：KR100771313B1
公开(公告)日：2007-10-29
申请号：KR1020060083579
申请日：2006-08-31
Applicant: 삼성전기주식회사
IPC: H05K3/42
CPC classification number: H05K3/4661 , H05K3/188
Abstract: A plating apparatus and a method of plating a printed circuit board using the same are provided to increase a design freedom by differing plating thicknesses on both surfaces of the PCB. A plating apparatus includes a frame(102) and a nozzle. The frame is formed in a rectangular shape. A guide portion is formed on the frame. Dummy portions at both ends of the PCB(Printed Circuit Board) are slidably inserted into the guide portion. Nozzles are formed on the frame to face one surface of the PCB. The nozzle sprays a liquid on one surface of the PCB such that an oil film is formed thereon. A cushion member(110) is attached to an interface between the guide portion and the PCB such that a movement of the PCB due to a liquid flow in a plating container is controlled.
Abstract translation: 提供电镀装置和使用其的电镀印刷电路板的方法，以通过在PCB的两个表面上的不同电镀厚度增加设计自由度。 电镀装置包括框架（102）和喷嘴。 框架形成为矩形。 引导部分形成在框架上。 PCB（印刷电路板）两端的虚拟部分可滑动地插入引导部分。 在框架上形成喷嘴以面对PCB的一个表面。 喷嘴在PCB的一个表面喷射液体，从而在其上形成油膜。 缓冲构件（110）附接到引导部分和PCB之间的界面，使得由于液体流动在电镀容器中的PCB的运动受到控制。
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公开(公告)号：KR100733252B1
公开(公告)日：2007-06-28
申请号：KR1020060072128
申请日：2006-07-31
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: A printed circuit board having high reliable surface mounting terminals and a manufacturing method thereof are provided to prevent the interfacial separation phenomenon between a gold layer and an Ni layer or between the Ni layers. In a printed circuit board having a wire bonding terminal for mounting a semiconductor and a soldering terminal for connecting with external parts, the wire bonding terminal and the soldering terminal are composed of a metal layer and an Ni layer formed on the metal layer. The Ni layer includes triple layers having different phosphorus contents.
Abstract translation: 提供具有高可靠表面安装端子的印刷电路板及其制造方法，以防止金层与Ni层之间或Ni层之间的界面分离现象。 在具有用于安装半导体的引线接合端子和用于与外部部件连接的焊接端子的印刷电路板中，引线接合端子和焊接端子由金属层和形成在金属层上的Ni层构成。 Ni层包括具有不同磷含量的三层。
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公开(公告)号：KR101128615B1
公开(公告)日：2012-03-26
申请号：KR1020090085985
申请日：2009-09-11
Applicant: 삼성전기주식회사
IPC: C25D17/06
Abstract: 본 발명은 전해 도금용 지그에 관한 것이다.
본 발명의 전해 도금용 지그는, 상단부에 걸쇠가 구비된 제1 기판고정구; 상기 제1 기판고정구에 상단이 힌지 결합되어 개폐 가능하게 회동되는 제2 기판고정구; 상기 제1 기판고정구와 제2 기판고정구 사이에 회동 가능하게 결합된 절연판; 및 상기 제1 기판고정구에 장착되어 상기 제2 기판고정구를 고정시키는 체결수단;을 포함하며, 지그의 양면으로 노출된 기판 일면에 동시에 전해 도금이 이루어짐에 따라 도금 생산성이 향상되는 장점이 있다.
전해 도금, 지그, 기판고정구, 절연판, 도금 접점면-
公开(公告)号：KR1020110098510A
公开(公告)日：2011-09-01
申请号：KR1020100018159
申请日：2010-02-26
Applicant: 삼성전기주식회사 , 부산대학교 산학협력단
CPC classification number: H01L2224/16225 , H01L2924/07811 , H01L2924/00
Abstract: 본 발명은 반도체 칩의 실장 방법에 관한 것으로, 본 발명에 따른 반도체 칩의 실장 방법은 반도체 칩의 본딩 패드 상에 형성된 금속 범프와 인쇄회로 기판에 형성된 금속 배선 중 적어도 하나의 영역에 수소 플라즈마 처리를 수행하는 단계; 및 상기 금속 범프 및 상기 금속 배선을 접합하는 단계;를 포함한다. 본 발명에 따르면, 수소 플라즈마 처리에 의하여 금속 범프 및 금속 배선의 금속 산화막은 제거되고, 일정시간 동안 재산화가 방지된다. 이에 따라, 반도체 칩의 실장 공정은 상온 또는 상압하에서 실시될 수 있다.
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