-
公开(公告)号：KR1020130088347A
公开(公告)日：2013-08-08
申请号：KR1020120009531
申请日：2012-01-31
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board (PCB) and a manufacturing method thereof are provided to implement fine pitch by transferring a conductive sheet on a film layer. CONSTITUTION: An electrode pad (115) is included on a base circuit board. A film layer (120) is formed on the base circuit board. The base circuit board and a conductive sheet are compressed. The conductive sheet is inserted in an opening unit. A conductive post (142) is formed on the electrode pad.
Abstract translation: 目的：提供一种印刷电路板（PCB）及其制造方法，通过在薄膜层上转印导电薄片来实现细间距。 构成：电路板（115）包括在基底电路板上。 在基板上形成有薄膜层（120）。 基板电路板和导电片被压缩。 导电片插入开口单元中。 在电极焊盘上形成导电柱（142）。
-
公开(公告)号：KR1020130076286A
公开(公告)日：2013-07-08
申请号：KR1020110144813
申请日：2011-12-28
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4007 , H01L2924/0002 , H05K1/0296 , H05K3/4015 , H05K2201/099 , H05K2201/10242 , H01L2924/00
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to easily manufacture a conductive post using a mode which cuts a conductive material of the wire-type. CONSTITUTION: A base substrate (110) which has an electrode pad (115) is prepared. A conductive material having fixed height is prepared. The conductive material is arranged on the electrode pad. The electrode pad and the conductive material are welded. A conductive post (150) is formed on the electrode pad.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以便使用切断导线材料的方式容易地制造导电柱。 构成：制备具有电极焊盘（115）的基底（110）。 制备具有固定高度的导电材料。 导电材料布置在电极垫上。 焊接电极焊盘和导电材料。 在电极焊盘上形成导电柱（150）。
-
公开(公告)号：KR1020130036599A
公开(公告)日：2013-04-12
申请号：KR1020110100776
申请日：2011-10-04
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent the damage to a solder resist by minimizing contacting areas between the solder resist and a seed layer. CONSTITUTION: A circuit layer(120) is formed on a base substrate(110). A solder resist layer(130) having a first open part on the base substrate is formed. A plating resist layer having a second open part on the solder resist layer is formed. A seed layer is formed on the plating resist layer. A metal post(170) is formed at the first and second open parts.
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过使阻焊剂和种子层之间的接触面积最小化来防止对阻焊剂的损伤。 构成：电路层（120）形成在基底（110）上。 形成在基底基板上具有第一开口部的阻焊层（130）。 形成在阻焊层上具有第二开口部的电镀抗蚀剂层。 种子层形成在电镀抗蚀剂层上。 金属柱（170）形成在第一和第二开口部分。
-
-
公开(公告)号：KR1020110064471A
公开(公告)日：2011-06-15
申请号：KR1020090121099
申请日：2009-12-08
Applicant: 삼성전기주식회사
IPC: H01L23/48
CPC classification number: H01L23/49811 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A package substrate and manufacturing method thereof are provided to increase the height of a solder joint by improving the structure of a solder bump, thereby realizing a fine pitch. CONSTITUTION: A substrate(10) includes at least one conductive pad(101). An insulating layer(102) includes an opening which exposes the conductive pad. A columnar terminal(104) is formed on the conductive pad in the opening. A plating seed layer is formed on the bottom of the columnar terminal. A solder bump(106) is formed on the columnar terminal.
Abstract translation: 目的：提供一种封装基板及其制造方法，通过改善焊料凸块的结构来提高焊点的高度，从而实现微细间距。 构成：衬底（10）包括至少一个导电垫（101）。 绝缘层（102）包括露出导电垫的开口。 在开口中的导电垫上形成柱状端子（104）。 在柱状端子的底部形成电镀种子层。 在柱状端子上形成焊料凸块（106）。
-
Patent Agency Ranking
公开(公告)号：KR1020110028838A
公开(公告)日：2011-03-22
申请号：KR1020090086453
申请日：2009-09-14
Applicant: 삼성전기주식회사
IPC: H01L21/60
Abstract: PURPOSE: A post forming method, a printed circuit board manufacturing method using the same, and an electronic component manufacturing method are provided to form the post on the electrode pad without forming a seed layer on the solder resist by depositing the solder resist after forming the post. CONSTITUTION: An electrode pad is formed on a substrate or an electric component(S110). The post of the conductivity is laminated on an electrode pad(S120). The resist layer equipped with the post pattern exposing the electrode pad according to the post is formed(S122). The conductive material is charged in the post pattern(S124). The solder resist covering up the electrode pad is laminated(S130).
Abstract translation: 目的：提供后成型方法，使用其的印刷电路板制造方法和电子部件制造方法，以在电极焊盘上形成柱，而不在形成焊料后通过沉积阻焊剂而在阻焊剂上形成种子层 帖子。 构成：在基板或电气部件上形成电极焊盘（S110）。 将电导率层压在电极焊盘上（S120）。 形成配备有根据柱状物暴露电极焊盘的柱状图案的抗蚀剂层（S122）。 导电材料以柱状图案充电（S124）。 层叠覆盖电极焊盘的阻焊剂（S130）。
-
公开(公告)号：KR1020110028145A
公开(公告)日：2011-03-17
申请号：KR1020090086101
申请日：2009-09-11
Applicant: 삼성전기주식회사
IPC: B24B53/00 , B24B53/12 , H01L21/304
CPC classification number: B24B53/12 , B24B53/005 , B24B55/02 , H01L21/304
Abstract: PURPOSE: An automatic dressing grinder is provided to reduce dressing time by simultaneously dressing all grinding rods using a dressing board. CONSTITUTION: An automatic dressing grinder comprises one or more grinding rods(120), a dressing board(130), and a driving unit(140). The grinding rods grind a substrate. The dressing board is arranged to be parallel with the shaft of the grinding rods. The dressing board dresses the grinding rods. The driving unit moves the grinding rods or the dressing board to contact with each other and dresses the grinding rods.
Abstract translation: 目的：提供自动修整磨床，通过使用修整板同时整理所有的研磨棒来减少修整时间。 构成：自动修整研磨机包括一个或多个研磨杆（120），修整板（130）和驱动单元（140）。 研磨棒研磨基材。 修整板布置成与研磨棒的轴平行。 梳妆台穿着磨棒。 驱动单元使研磨棒或修整板相互接触并连接研磨棒。
-
公开(公告)号：KR1020090087191A
公开(公告)日：2009-08-17
申请号：KR1020080012489
申请日：2008-02-12
Applicant: 삼성전기주식회사
CPC classification number: H05K3/125 , H05K3/1233 , H05K3/3489
Abstract: A printing apparatus and a printing method are provided to prevent generation of a void by preventing hardening of a printing solution through a heater. A printing apparatus includes a chamber(11), a piston(13), and a heater. The chamber is made of high thermal conductive metal material. The chamber receives a printing solution(24). A nozzle(12) is formed in one side of the chamber. A whole part or a part of a side wall of the chamber is tilted toward a nozzle direction. The piston provides pressure to an inner part of the chamber. The heater provides a heat to the printing solution. The heater is a coil(14). The coil is built in a side wall of the chamber. The coil delivers the heat to the printing solution through the side wall of the chamber in order to prevent hardening of the printing solution.
Abstract translation: 提供了一种打印装置和打印方法，以防止通过加热器硬化印刷溶液而产生空隙。 打印装置包括室（11），活塞（13）和加热器。 该室由高导热金属材料制成。 该室接收印刷溶液（24）。 喷嘴（12）形成在腔室的一侧。 腔室的侧壁的整个部分或一部分朝向喷嘴方向倾斜。 活塞为腔室的内部提供压力。 加热器为印刷溶液提供热量。 加热器是线圈（14）。 线圈内置在腔室的侧壁上。 线圈通过室的侧壁将热量传递到印刷溶液，以防止印刷溶液的硬化。
-
-
公开(公告)号：KR101376888B1
公开(公告)日：2014-03-20
申请号：KR1020120112966
申请日：2012-10-11
Applicant: 삼성전기주식회사
CPC classification number: B23K3/06 , B23K3/0623 , B23K3/082 , H01L24/11
Abstract: The present invention relates to a mask for bumping a solder ball on a circuit board and a solder ball bumping method using the same. According to one embodiment of the present invention, the mask for bumping a solder ball on a circuit board includes opening parts which provides a space where a solder ball is inserted and mounted on a solder pad; and a trench which provides an inflow space for the spreading of flux to the mounting part of the solder ball on the solder pad and is extended from at least one side of the circumference of the opening part. Also, a mask for bumping a solder ball on a circuit board and a solder ball bumping method are disclosed.
Abstract translation: 本发明涉及一种用于在电路板上焊接焊球的掩模和使用该掩模的焊球凸起方法。 根据本发明的一个实施例，用于在电路板上焊接焊球的掩模包括提供焊锡球插入并安装在焊盘上的空间的开口部分; 以及沟槽，其提供用于将焊剂扩散到焊料焊盘上的焊球的安装部分的流入空间，并且从开口部分的圆周的至少一侧延伸。 另外，公开了一种用于在电路板上焊接焊球的掩模和焊球凸起方法。
-
-
-
-
-
-
-
-
-
Search Results
40
records
(took 0.024 seconds)
