公开(公告)号：KR1020170090271A

公开(公告)日：2017-08-07

申请号：KR1020160010916

申请日：2016-01-28

Applicant: 삼성전기주식회사 ,  동아대학교 산학협력단 ,  서울대학교산학협력단

Inventor： 이효종 ,  문성재 ,  박채민 ,  송영석 ,  박준호 ,  허석환 ,  강철

IPC: C25D17/00 ,  C25D7/06 ,  C25D17/10 ,  C25D3/38

Abstract: 전해도금장치가개시된다. 본발명의일 측면에따른전해도금장치는, 도금액을수용하는도금조, 도금조내에배치되는양극, 도금조내에배치되고피도금체와전기적으로연결되는음극및 피도금체와이격되게양극과음극사이에배치되고도금액에전해(electro-dissolution)되는금속을포함하는전류밀도조절부를포함한다.

Abstract translation: 公开了一种电解电镀设备。 根据本发明的一个方面的电解电镀装置包括容纳电镀液的电镀槽，设置在电镀槽中的阳极，设置在电镀槽中并与电镀体电连接的阴极， 并且电流密度调节器包括设置在电极之间并且可电解溶解的金属。

公开(公告)号：KR101896555B1

公开(公告)日：2018-09-10

申请号：KR1020110085944

申请日：2011-08-26

Applicant: 삼성전기주식회사

Inventor： 강철 ,  전영욱 ,  홍석기 ,  박종원

IPC: H05K3/28 ,  H05K3/00 ,  H05K3/42

Abstract: 본발명은인쇄회로기판및 인쇄회로기판제조방법에관한것이다. 본발명의실시예에따르면, 본발명의일 측면에따르면, 베이스기판, 베이스기판의더미영역의에지(edge)를둘러싸는에지코팅, 베이스기판의회로형성영역에형성된내층회로층을포함하는인쇄회로기판이제공된다.

公开(公告)号：KR1020130022911A

公开(公告)日：2013-03-07

申请号：KR1020110085944

申请日：2011-08-26

Applicant: 삼성전기주식회사

Inventor： 강철 ,  전영욱 ,  홍석기 ,  박종원

IPC: H05K3/28 ,  H05K1/02

Abstract: PURPOSE: A printed circuit board and a method for manufacturing the same are provided to protect an insulating layer and a plating layer in a dummy region. CONSTITUTION: A base substrate(111) includes a circuit region(112) for an inner circuit layer(142) and a dummy region(113,114). An edge coating(150) surrounds the edge of the dummy region and protects an insulating layer and a plating layer(130) in a dummy region. The inner circuit layer includes a circuit pattern(141) and a via(140) for connecting an outer circuit.

Abstract translation: 目的：提供印刷电路板及其制造方法，以在虚拟区域中保护绝缘层和镀层。 构成：基底（111）包括用于内部电路层（142）的电路区域（112）和虚拟区域（113,114）。 边缘涂层（150）围绕虚拟区域的边缘并且在虚拟区域中保护绝缘层和镀层（130）。 内部电路层包括用于连接外部电路的电路图案（141）和通孔（140）。

公开(公告)号：KR1020130021724A

公开(公告)日：2013-03-06

申请号：KR1020110084163

申请日：2011-08-23

Applicant: 삼성전기주식회사

Inventor： 강철 ,  최주석 ,  박재한 ,  김일동

IPC: C25D21/08 ,  C25D17/00

CPC classification number: C25D21/08 ,  C25D21/20

Abstract: PURPOSE: A substrate cleaning device for a plating facility is provided to easily plate by preventing the reattachment of foreign substances and by discharging rinse water including foreign substance towards the outside of a rinse tank after a substrate is rinsed thereby preventing the degradation of the plating quality. CONSTITUTION: A substrate cleaning device(1) for a plate facility comprises a supply pipe(10), a spray nozzle(20), a drain pipe(30), an assistant pipe(40), and a filter. The supply pipe is installed in the inside of a rinse tank including a board. The spray nozzle is installed in the supply pipe and sprays rinse water towards the board in a radial shape. The drain pipe is installed in the outside of the rinse tank. The supply pipe is installed in the water tank. The assistant pipe connects the supply pipes. A pair of supply pipes is symmetrically installed by facing the substrate. The filter filters the rinse water collected through the drain pipe.

Abstract translation: 目的：提供一种电镀设备的基板清洗装置，通过防止外来物质的重新附着，以及在漂洗基板之后将包括异物的冲洗水排向冲洗槽的外部，从而防止电镀质量下降 。 构成：用于板材设备的基板清洁装置（1）包括供应管（10），喷嘴（20），排水管（30），辅助管（40）和过滤器。 供应管安装在包括板的冲洗槽的内部。 喷嘴安装在供应管中，以径向形式向洗涤板喷射冲洗水。 排水管安装在冲洗槽的外侧。 供水管安装在水箱内。 辅助管连接供水管。 一对供应管通过面对基板对称地安装。 过滤器过滤通过排水管收集的冲洗水。

公开(公告)号：KR1020130110445A

公开(公告)日：2013-10-10

申请号：KR1020120032428

申请日：2012-03-29

Applicant: 삼성전기주식회사

Inventor： 강철 ,  강종휘 ,  안현욱 ,  홍석기

IPC: H05K3/28 ,  B05C1/08

CPC classification number: B05D3/12 ,  B05B13/0221 ,  B05B14/30 ,  B05C3/10 ,  B05C3/18 ,  B05D1/18 ,  B05D1/42 ,  B05D2252/04 ,  H05K3/0091 ,  H05K2203/0139 ,  H05K2203/1509

Abstract: PURPOSE: A device and a method of coating a substrate improve the coating quality at an edge part of the substrate by equalizing the thickness of a coated protection layer. CONSTITUTION: A coating device includes a horizontal coating unit (110) and a squeegee unit (120). The horizontal coating unit includes a coating bath (111), and a leading-in unit (112a) and a leading-out unit (112b) for leading a substrate in and out horizontally. The horizontal coating unit forms a protection layer (103) by coating the front side of the substrate with a coating solution in a horizontal dipping method. The squeegee unit is formed outside the leading-out unit of the horizontal coating unit and equalizes the coating thickness of the protection layer by being installed close to the protection layer of the substrate led out from the horizontal coating unit.

Abstract translation: 目的：通过均匀涂覆的保护层的厚度，涂覆基材的装置和方法提高了基板边缘部分的涂层质量。 构成：涂覆装置包括水平涂覆单元（110）和刮板单元（120）。 水平涂布单元包括涂层浴（111）和引导单元（112a）和引出单元（112b），用于使基板在水平方向上进出。 水平涂布单元通过以水平浸渍方法用涂布溶液涂布基材的前侧而形成保护层（103）。 刮板单元形成在水平涂布单元的引出单元的外侧，通过安装在靠近从水平涂布单元引出的基板的保护层上而使保护层的涂层厚度相等。