Abstract:
A data output circuit includes a plurality of registers and a plurality of register output selection switches that are respectively connected to the plurality of registers. Pairs of the plurality of register output selection switches are connected by respective common active regions. A first data group selection switch is connected to the common active regions of a first set of the plurality of register output selection switches. A second data group selection switch is connected to the common active regions of a second subset of the plurality of register output selection switches. An output driver is connected to the first and second data group selection switches.
Abstract:
An integrated circuit device includes first and second complementary data line pairs, e.g., global or local I/O data line pairs, disposed on a substrate and extending along a first direction, the first and second complementary data line pairs arranged such that first and second data lines of the first complementary data line pair have a first data line of the second complementary data line pair disposed therebetween. An equalization transistor includes respective first and second source/drain regions in the substrate that are coupled to respective ones of the first and second data lines of the first complementary data line pair and an equalization transistor gate electrode disposed on the substrate between the first and second data lines of the first complementary data line pair. A first precharge transistor includes the first source/drain region, a third source/drain region in the substrate displaced from the first source/drain region along the first direction, and a first precharge transistor gate electrode disposed on the substrate between the first and third source/drain regions. A second precharge transistor includes the second source/drain region, a fourth source/drain region in the substrate displaced from the second source/drain region along the first direction, and a second precharge transistor gate electrode disposed on the substrate between the second and fourth source/drain regions. A precharge voltage bus conductor is disposed on the substrate and is electrically coupled to the third and fourth source/drain regions.
Abstract:
An integrated circuit comprises a substrate having circuitry integrated with the substrate. Switching circuitry is selectably operable to configure signal paths to alternative mirrored pads over the substrate. At least one of the first and second signal paths may comprise a buffer in series between the switching circuit and its respective pad.
Abstract:
PURPOSE: A data output circuit of a synchronous semiconductor memory device is provided to minimize junction loading and interconnection loading and data skew. CONSTITUTION: According to the data output circuit of a synchronous semiconductor memory device comprising a data output multiplexer having a wave pipeline structure, every output port of two register output selection switches is connected to a multiplexing output line through a single line, by forming output part active regions of adjacent register output selection switches(S1,S2,S3,S4,S5,S8,S9,S10,S12,S13,S16) in common, in order to reduce junction loading of the multiplexing output line connected to lines connected to output ports of register output selection switches in the above data output multiplexer in common. The above register output selection switches are constituted with a CMOS transmission gate respectively.
Abstract:
PURPOSE: A layout of a semiconductor IC having a termination circuit is provided to reduce a size of the semiconductor IC by arranging efficiently a pad, an output buffer, and the termination circuit. CONSTITUTION: A semiconductor IC having a termination circuit includes one pad(101), a transmitter, and a termination circuit(160a,160b). The pad(101) is connected to a bus line. The transmitter is used for transmitting a signal of an internal circuit to the outside through the pad(101). The termination circuit(160a,160b) is used for terminating the bus line. The pad(101) is surrounded by the transmitter and the termination circuit(160a,160b). The pad(101) is formed with a square pad having the first to the fourth sides.
Abstract:
A semiconductor integrated circuit includes at least one pad coupled to a bus line, a transmitter for transmitting a signal from an internal circuit to the outside through the pad, and a termination circuit for terminating the bus line. The transmitter and the termination circuit are disposed to surround the pad, reducing a size of the semiconductor integrated circuit.
Abstract:
PURPOSE: An equalization/precharge circuit and a semiconductor memory device comprising the same are provided to improve signal transmission characteristics through input/output line pair. CONSTITUTION: The equalization/precharge circuit are connected to a bit line and a complementary bit line connected to a memory cell array through a column selection transistor, and they equalize and precharge a data line and a complementary data line arranged in parallel. An equalization transistor(EQ1) equalizes the data line and the complementary data line. The first precharge transistor(PCH1) precharges the data line to a fixed voltage level. The second precharge transistor(PCH2) precharges the complementary data line to the voltage level. A gate of the equalization transistor and a gate of the first precharge transistor and a gate of the second precharge transistor are connected in a T shape each other.
Abstract:
PURPOSE: A semiconductor IC circuit and a module including the same are provided to minimize the number of crossing wires by changing external signals of TTL-level to internal signals of CMOS-level and switching the internal signals of CMOS-level to internal circuits. CONSTITUTION: A semiconductor device includes a plurality of bonding pads(1000,1100), a plurality of input buffer circuits(BUF1,BUF2), and a plurality of multiplexer circuits(MUX1,MUX2). The bonding pads are connected to external electrodes in order to receive TTL-level external signals. The input buffer circuits are connected to the bonding pads in order to output CMOS-level internal signals corresponding to the external signals. The multiplexer circuits are used for receiving the output signals of the input buffer circuits and switching the inputted signals in response to control signals. The input signals applied to the bonding pads are transmitted to the first internal circuit(1200) when the semiconductor device is packaged by the first package. The input signals applied to the bonding pads are transmitted to the second internal circuit(1300) when the semiconductor device is packaged by the second package.