Abstract:
표시 패널 컨트롤러는 기 설정된 프레임 레이트로 스틸 이미지를 표시하도록 표시 패널을 구동하는 표시 구동 집적 회로, 스틸 이미지를 구현하기 위한 스틸 이미지 데이터 및 내부의 타이밍 컨트롤러에서 생성되는 복수의 제어 신호들을 표시 구동 집적 회로에 제공하는 어플리케이션 프로세서, 및 표시 패널의 최소 리프레시 레이트에 기초하여 표시 패널의 프레임 싱크를 제어하는 싱크 컨트롤러를 포함한다.
Abstract:
A method of operating an image data processing circuit which controls an operation of an organic light emitting diode (OLED) display comprises the steps of: transforming the first RGB values into luminance values and chroma values; adjusting the luminance values and the chroma values based on the first control values; and generating the second RGB values based on the adjusted luminance values and the adjusted chroma values and outputting the second RGB values to the OLED display. The image data processing circuit decreases luminance values of images corresponding to the second RGB data displayed in the OLED display, and increases the visually perceived brightness.
Abstract:
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce the failure rate of an end-product and improve yields by detecting the normality of bonding wires for electrical contact with a second semiconductor package. CONSTITUTION: A first bonding pad(120) is formed on an upper side of a first substrate(102). An outer connection pad(140) is formed on a lower side of the first substrate. A plurality of first semiconductor chips(110a-110f) is mounted on the upper side of the first substrate. The first semiconductor chips are electrically connected to the first substrate with a plurality of first wires(130). The first semiconductor chip is electrically connected to the external device through a connecting member(180).
Abstract:
PURPOSE: An under-run compensation circuit, a method thereof, and apparatuses including the same are provided to prevent image quality degradation of a display apparatus by compensating an under-run state by detecting the under-run state of an input/output buffer. CONSTITUTION: An under-run compensation circuit(320) outputs a clock signal and dummy data when an under-run detection signal is received. The under-run compensation circuit bypasses the clock signal and data when the under-run detection signal is not received. A count comparison unit(330) creates a comparison signal according a comparison result by comparing a standard count value and a count value from counting underflow in response to the under-run detection signal. A clock masking circuit(350) performs a clock masking process according to the comparison signal. A data selection circuit outputs data or dummy data according to the comparison signal.
Abstract:
PURPOSE: An image forming device and a color correcting method thereof and a host device for correcting a color of an output image are provided to reflect monitor information to correct a color conversion table, thereby matching colors between a displayed input image and an output image. CONSTITUTION: A table correcting unit(340) corrects a color conversion table by reflecting monitor information. A color conversion unit(350) converts an input image into an output image using the corrected color conversion table. An interface unit(310) inputs the monitor information from a host device connected to an image forming device. A panel operation unit(320) inputs the monitor information. The monitor information corresponds to one of information inputted through printer driver and information automatically recognized by the host device.
Abstract:
PURPOSE: A semiconductor package having stepped molding compound with conductive via, a method for forming the same, and a stacked semiconductor package using the same are provided to reduce pitch of a solder ball so as to reduce the whole size. CONSTITUTION: A semiconductor chip(120) is installed on a substrate(110). First conductive pads(112) are formed on the substrate around the semiconductor chip. The semiconductor chip is mounted on a substrate by the wire bonding(122). The substrate is composed of a printed circuit board. A second conductive pad(114) and a solder ball(150) are formed in the opposite surface to the mounting surface of the semiconductor chip. Molding resin(130) is formed on the front surface of the substrate to surround the semiconductor chip. The molding resin comprises a conductive via(140) contacting the first conductive pad. The molding resin is used in order to prevent the warpage of the substrate due to the thermal expansion.
Abstract:
An image forming apparatus and an image forming method are provided to expand a first image area belonging to an expansion object area and to reduce a second image area belonging to the other areas except for the first image area so as to prevent the data loss of the second image area. An image forming apparatus(100) comprises a scanning part(110), a user interface part(120), and a scanning processing part(130). The user interface part sets an expansion object area and an expansion size of the entire area of the document. The scanning processing part expands a first image according to the expansion size and reduces a second image, so that the scanned data including the first and second images is generated. A printing part prints the generated scanned data on a paper. An interface part transmits the generated scanning data to an external device.
Abstract:
자연색 보정기능을 구비한 단말장치 및 자연색 보정방법이 개시된다. 본 단말장치는 자연계에 존재하는 사물의 색인 자연색의 범위가 기준컬러데이터영역으로 저장된 선호도저장부, 소정 이미지에 존재하는 자연색영역에 대한 사용자의 보정명령에 따라, 자연색영역에 대응되는 자연색이미지데이터를 보정하는 컬러편집부, 그리고 기준컬러데이터영역에, 컬러편집부에 의해 보정된 자연색이미지데이터의 포함 여부를 판단하는 제어부를 포함한다. 이에 따라 자연색에 가장 가까운 이미지를 생성할 수 있게 된다. 자연색, 피부색(skin), 하늘색(sky), 잔디색(green), 명도(lightness), 채도(chroma), 색상(hue), 선호도, LAB 색 공간, RGB, YMCK