Abstract:
PURPOSE: A light guide plate, a thin liquid crystal display using the same, and a sheetless liquid crystal display using the same are provided to improve the brightness at the front view angle without a prism sheet and a diffusion sheet. CONSTITUTION: A light guide body includes a plurality of sides. A light reflective surface has a light reflecting element to reflect light inputted from any one of the sides. A light projecting surface(222f) faces the light reflective surface and projects the light reflected by the light reflecting element. At least one or more view angle compensating grooves(221a) are formed on the light projecting surface to improve a front view angle to a liquid crystal panel while the light is projected from the light projecting surface. The view angle compensating grooves have a plurality of side walls.
Abstract:
PURPOSE: A method for manufacturing a stacked flash memory cell is provided to prevent a shift of threshold voltage of memory cells by enhancing a charge retention capability of a floating gate. CONSTITUTION: A gate oxide layer is formed on an active region of a semiconductor substrate(200). A structure sequentially stacked a floating gate, a dielectric film of ONO structure and a control gate are sequentially formed on a desired portion of the gate oxide(210-230). An oxide layer made of SiON is formed on the gate oxide layer including the stacked structure by an oxidation processing using N2O gas or NO gas as a source gas(240). An LDD(Lightly Doped Drain) region is formed in the substrate(250). After forming an insulating spacer at both sidewalls of the stacked structure(260), source and drain regions are formed(270).
Abstract:
PURPOSE: A vertical diffusion furnace for manufacturing a semiconductor device is provided to supply uniformly a gas to each wafer by forming an exhausting portion on a slot portion supporting the wafer. CONSTITUTION: A heater portion(50) forms an outer body. A reaction tube(60) is installed at an inside of the heater portion(50). The reaction tube(60) has an exhaust portion for exhausting a supplied gas. A boat(80) is installed at an inside of the reaction tube(60). The boat(80) has an upper plate(81), a lower plate(83), and a multitude of support bar(85). The support bars(85) are installed between the upper plate(81) and the lower plate(83). Slots for supporting edges of wafers are formed on the support bars(85). A guide path(85b) is formed on the boat(80) in order to guide a gas to the reaction tube(60). A boat cap(90) is formed to load the boat(80). A gas inflow path(91) is formed on the boat cap(90).
Abstract:
PURPOSE: A boat cap of a vertical diffusion furnace for manufacturing a semiconductor device is to provide a uniform layer of an excellent quality regarding the entire surface of a wafer, by making reaction gas of a uniform quantity flow and maintaining a uniform distribution space of a temperature. CONSTITUTION: Vertical surfaces in parallel with a flat zone(42) of a wafer(40) are formed in a reaction pipe(10), upper and lower plates(32,34) of a boat(30) and a boat cap(50) so that reaction gas does not flow to the flat zone of the wafer intensively. Vertical surfaces in parallel with the flat zone of the wafer are formed in at least the inner surface of a heater so that a uniform temperature is used regarding the entire surface of the wafer.
Abstract:
PURPOSE: A line connector of thermocouple element used in detecting temperature of heating furnace is provided to delay a rapid oxidation of a terminal to enhance reliability of a temperature detecting signal, and to reduce costs by extending a life of parts containing a temperature compensating line and a terminal. CONSTITUTION: A line connector of thermocouple element used in detecting temperature of heating furnace comprises a terminal unit(310), a terminal unit fixing part(330), and a support pole(350). The terminal unit connects a terminal of a drawing site of one thermocouple element or more mounted on an outer wall of a heating furnace and a terminal of temperature compensating line site connected to a controller. The terminal unit fixing part consists of a hollow tube containing the temperature compensating line and coupled to the terminal unit. The support pole consists of a hollow tube.
Abstract:
A chassis for a flat panel display device and a flat panel display device having the same are provided to facilitate fastening of a mold frame and a chassis, and strengthen a fastening force by having a fastening part at one end of at least one side wall of a chassis. A base plate(310) has an opened region. A plurality of side walls(320) are formed to extend from the base plate(310). The side wall(320) includes the first bent portion(321) formed to extend in a certain direction from the base plate(310) and the second bent portion(323) extending from the first bent portion(321) and facing the base plate(310). A fastening portion(330) is formed at one end of the second bent portion(323). The first bent portion extends in a vertical direction from the base plate(310). The fastening portion(330) is formed to face the first bent portion(321). An upper chassis(300) is integrally formed.
Abstract:
본 발명은 반도체 소자 제조용 종형 확산로에 관한 것으로서, 반응 가스의 주입에 따라 소정의 공정이 진행되도록 수직 방향으로 배치된 반응관과, 상기 반응관의 둘레에 내부를 가열시킬 수 있도록 구비된 히터부와, 상기 반응관의 내부에 삽입되어 복수의 웨이퍼를 적재시킬 수 있도록 상, 하부판 및 복수의 지지봉으로 이루어진 보트와, 상기 보트를 올려놓을 수 있는 보트 캡을 포함하는 반도체 소자 제조용 종형 확산로에 있어서, 상기 반응관, 상기 보트의 상, 하부판 그리고 상기 보트 캡은 웨이퍼의 플랫 존 부분으로 반응 가스의 집중적인 흐름이 이루어지지 않도록 상기 웨이퍼의 플랫 존 부분과 평행하는 수직면이 각 각 형성되고, 상기 히터는 적어도 그 내측면 부분에 웨이퍼의 전면에 걸쳐 균일한 온도를 작용시킬 수 있도록 웨이퍼의 플랫 존 부분과 평행한 수직면이 형성되는 것을 특징으로 한다. 따라서, 본 발명에 의하면 확산로의 주요 구성부들의 형상을 웨이퍼의 형상과 대응될 수 있게 변경하여 반응 가스의 유동(흐름) 및 온도의 분포 공간을 일정하게 유지시킬 수 있으므로 웨이퍼의 플랫 존 부분에 치우치지 않고 웨이퍼의 전면에 걸쳐 고르고 양호한 막질을 얻게 되고, 나아가 반도체 제조 공정의 신뢰성을 더욱 더 향상시킬 수 있다.
Abstract:
PURPOSE: A wireless remote control system for controlling a loader part of semiconductor fabrication equipment and a method for operating the same are provided to control a loader portion by using a wireless remote control method. CONSTITUTION: A wireless remote control system is installed at a loader portion(10) having a wire control system in order to control the loader portion(10) by using a wireless remote control method. The wireless remote control system is formed with a local controller(70) a wireless transmitting and receiving function and an RF(Radio Frequency) transmission and reception portion(60). The RF portion(60) is connected with a mechanical control portion(40) for controlling the loader portion(10) in order to provide a remote control signal to the mechanical control portion(40). The RF portion(60) has its own peculiar code to provide a receiving control command to the mechanical control portion(40). A plurality of devices having peculiar codes are controlled by using one local controller(70).
Abstract:
PURPOSE: A vertical diffusion furnace for semiconductor fabrication is provided to form uniformly thickness of layer formed between each region of a wafer by compensating a thermal loss of a lower end region of a boat. CONSTITUTION: A plurality of heater coils(22) are adhered on both sides of a heater(200). The heater coils are used for controlling temperature of the inside of the heater(200). A gas inlet portion(30) injects a gas to the inside of a reaction tube(24) through pipe arrangement installed on one side of the reaction tube(24). The gas outlet portion(32) exhausts the remaining gas from the reaction tube(24). The reaction tube(24) is formed by SiO2 or SiC. The reaction tube(24) is used for reacting a wafer with the gas. A boat(26) is used for transferring the wafer into the inside of the reaction tube(24). A boat cap(28) is adhered to a lower end portion of the boat(26).
Abstract:
PURPOSE: A diffusion furnace for fabricating a semiconductor device is provided to easily attach and remove gas pipes for introducing a process gas to/from an exterior of a combustion pipe. CONSTITUTION: The furnace comprises the combustion pipe to which gas pipes are connected. External pipes is disposed on an exterior of the combustion pipe. The gas pipes are removably inserted into the exterior of the combustion pipe. The external pipe and the gas pipe are fixed utilizing a fix hole made of teflon whose heat-resistance and corrosion-resistance are excellent.