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公开(公告)号:KR101555509B1
公开(公告)日:2015-09-25
申请号:KR1020090013319
申请日:2009-02-18
Applicant: 삼성전자주식회사
CPC classification number: H04M1/0254 , G06F1/1626 , G06F1/1632 , G06F1/1686 , G06F1/1692 , H04M1/0264 , H04M1/0272 , H04N1/00307 , H04N5/2251 , H04N5/2257 , H04N5/23209 , H04N9/3173 , H04N2201/0084
Abstract: 본발명은탈부착가능한서브모듈을구비하는휴대단말기에관한것이다. 본발명의실시예에따른탈부착가능한서브모듈을구비하는휴대단말기는, 사용자가원하는특정기능을수행하는부품들로이루어진서브기능구성부를구비하는적어도하나의서브모듈및 전면에디스플레이부를구비하며, 후면에상기서브모듈이결합하는접속부가형성된메인단말기를포함하며, 상기접속부또는상기서브모듈의일 측면에는마그넷(Magnet)이설치되고, 상기서브모듈은상기마그넷을통해상기메인단말기와결합되거나상기메인단말기로부터분리될수 있는것을특징으로한다. 본발명의일 실시예에따른탈부착가능한서브모듈을구비하는휴대단말기에따르면, 사용자의필요에따라특정기능을수행하는서브모듈을디스플레이부를구비하는메인단말기에결합시킴으로써휴대단말기의다양한기능을지원함과동시에휴대단말기의휴대편이성을만족시킬수 있다.
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公开(公告)号:KR1020070008856A
公开(公告)日:2007-01-18
申请号:KR1020050062709
申请日:2005-07-12
Applicant: 삼성전자주식회사
IPC: H01L21/20
CPC classification number: G02F1/1303 , H01L21/67017
Abstract: A chamber cooling device and a deposition apparatus for a flat display device including the same are provided to uniformly and quickly cool a chamber when a heated chamber is to be cooled in order to clean or repair it. A deposition apparatus includes a chamber, a chamber lead, and a chamber cooling device cooling the chamber or the chamber lead. The chamber cooling device has at least one cooling unit(210) consisting of a body(212) with a fluid passage(216) through which a coolant flows, and a fastening member(218) for fastening the body to the chamber. The fluid passages of the cooling member are connected to each other by a coupling pipe(220). The coupling pipe extends in the fluid passage, and has a valve for adjusting a flow of the coolant.
Abstract translation: 提供了一种室内冷却装置和用于包括该冷却装置的平板显示装置的沉积装置,以便在要冷却加热室以便清洁或修理时均匀且快速地冷却室。 沉积设备包括室,室引线和冷却室或室引线的室冷却装置。 腔室冷却装置具有至少一个冷却单元(210),该冷却单元由具有冷却剂流过的流体通道(216)的主体(212)和用于将主体紧固到腔室的紧固构件(218)组成。 冷却构件的流体通道通过联接管(220)彼此连接。 联接管在流体通道中延伸,并且具有用于调节冷却剂流动的阀。
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