公开(公告)号：KR1020020091949A

公开(公告)日：2002-12-11

申请号：KR1020010030771

申请日：2001-06-01

Applicant: 삼성전자주식회사

Inventor： 박현우 ,  나발라세르게이야코블레비크 ,  마동준 ,  김태완

IPC: H01L21/203

Abstract: PURPOSE: A sputtering apparatus for shifting a target is provided to form effectively a thin film having uniform thickness on a substrate in a sputtering process though a target is smaller than a substrate. CONSTITUTION: A discharge gas such as an argon gas is injected into a discharge gas inlet portion(12). A vacuum chamber(11) has an exhaust hole(13) in order to exhaust the gas. A substrate holder(14) is formed in the inside of the vacuum chamber(11). A substrate(15) is loaded on the substrate holder(14). A target electrode(17) facing the substrate holder(14) is used for fixing a target(18). A target electrode portion(16) includes the target(18) and the target electrode(17). A magnet(19) is formed in the inside of the target electrode portion(16) in order to generate a magnetic field. The target electrode portion(16) is connected with a shaft of a rotary portion(22). The target electrode portion(16) is connected with a supply shaft(24). The supply shaft(24) is connected with a power supply portion(21).

Abstract translation: 目的：提供用于移动靶的溅射装置，以通过靶小于衬底，在溅射工艺中有效地形成在衬底上具有均匀厚度的薄膜。 构成：将诸如氩气的放电气体注入放电气体入口部分（12）。 为了排出气体，真空室（11）具有排气孔（13）。 在真空室（11）的内部形成有基板支架（14）。 衬底（15）被装载在衬底保持器（14）上。 面对基板支架（14）的目标电极（17）用于固定目标（18）。 目标电极部分（16）包括靶（18）和目标电极（17）。 为了产生磁场，在目标电极部分（16）的内部形成磁体（19）。 目标电极部（16）与旋转部（22）的轴连接。 靶电极部16与供给轴24连接。 供给轴（24）与电源部（21）连接。